- 专利标题: Solder paste misprint cleaning
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申请号: US15924484申请日: 2018-03-19
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公开(公告)号: US10286471B2公开(公告)日: 2019-05-14
- 发明人: Xingquan Dong , Yanlong Hou , LiCen Mu , Ben Wu , WeiFeng Zhang
- 申请人: International Business Machines Corporation
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理商 Isaac J. Gooshaw
- 主分类号: B23K3/00
- IPC分类号: B23K3/00 ; B23K35/22 ; H05K3/22 ; B23K1/018 ; B23K1/00 ; B23K3/04 ; B23K3/08 ; B23K35/26 ; B23K35/30 ; B23K35/36 ; B23K35/02 ; B23K31/02 ; B23K31/12 ; H05K3/34 ; B23K101/42
摘要:
A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.
公开/授权文献
- US20180185944A1 SOLDER PASTE MISPRINT CLEANING 公开/授权日:2018-07-05
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