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公开(公告)号：US20200058117A1
公开(公告)日：2020-02-20
申请号：US16103178
申请日：2018-08-14
发明人： Jiayu Zheng , Tao Song , Zexin Luo , WeiFeng Zhang , Lingle Guo , Mingman Li , Zhen Wang
摘要： System and methods for solder void analysis with an optical inspection component are described, including a plurality of optical fibers longitudinally disposed through a glass tube such that ends of the optical fibers are exposed from corresponding ends of the glass tube. A solderable fill encompassing each of the optical fibers by filling spaces between each of the optical fibers and between the optical fibers and the glass tube such that the ends of the glass tube include the ends of the optical fibers surrounded by the solderable fill to form an interface around the optical fibers for soldering one of the ends of the glass tube to a solder pad.
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公开(公告)号：US10957030B2
公开(公告)日：2021-03-23
申请号：US16103178
申请日：2018-08-14
发明人： Jiayu Zheng , Tao Song , Zexin Luo , WeiFeng Zhang , Lingle Guo , Mingman Li , Zhen Wang
摘要： System and methods for solder void analysis with an optical inspection component are described, including a plurality of optical fibers longitudinally disposed through a glass tube such that ends of the optical fibers are exposed from corresponding ends of the glass tube. A solderable fill encompassing each of the optical fibers by filling spaces between each of the optical fibers and between the optical fibers and the glass tube such that the ends of the glass tube include the ends of the optical fibers surrounded by the solderable fill to form an interface around the optical fibers for soldering one of the ends of the glass tube to a solder pad.
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公开(公告)号：US11904417B2
公开(公告)日：2024-02-20
申请号：US16601692
申请日：2019-10-15
发明人： Michael Benosa Monjardin , LiCen Mu , Mingman Li , Miao Zhang , Susan Zhai , Jia Yu Zheng
IPC分类号： B23K9/095 , G05B19/418
CPC分类号： B23K9/0953 , G05B19/41885 , G05B2219/32368 , G05B2219/33286 , G05B2219/45135
摘要： Automated material welding including starting a welding operation, scanning a weld in-progress, creating a simulation of the weld in-progress, detecting a flaw in the weld in-progress according to the scanning and the simulation, remediating the weld in-progress, and completing the welding operation.
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公开(公告)号：US11644501B2
公开(公告)日：2023-05-09
申请号：US17027066
申请日：2020-09-21
发明人： Tao Song , Zhongfeng Yang , XiYuan Yin , Xiao Hu , LiCen Mu , Mingman Li
CPC分类号： G01R31/2813 , G01R31/2818 , G01R31/304 , H05K1/0268 , H05K1/115 , H05K3/0047 , H05K3/42 , H05K2203/06 , H05K2203/162
摘要： A reference via in a set of plated vias on a printed circuit board is located. A reference lead is applied to the reference via. A test via in the set of plated vias is located. A test lead is applied to the test via. An electrical conductance between the reference via and the test via is measured. A property of a core layer of the printed circuit board is identified based on the electrical conductance.
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公开(公告)号：US20220091181A1
公开(公告)日：2022-03-24
申请号：US17027066
申请日：2020-09-21
发明人： Tao Song , Zhongfeng Yang , XiYuan Yin , Xiao Hu , LiCen Mu , Mingman Li
摘要： A reference via in a set of plated vias on a printed circuit board is located. A reference lead is applied to the reference via. A test via in the set of plated vias is located. A test lead is applied to the test via. An electrical conductance between the reference via and the test via is measured. A property of a core layer of the printed circuit board is identified based on the electrical conductance.
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公开(公告)号：US20210107082A1
公开(公告)日：2021-04-15
申请号：US16601692
申请日：2019-10-15
发明人： Michael Benosa Monjardin , LiCen Mu , Mingman Li , Miao Zhang , Susan Zhai , Jia Yu Zheng
IPC分类号： B23K9/095 , G05B19/418
摘要： Automated material welding including starting a welding operation, scanning a weld in-progress, creating a simulation of the weld in-progress, detecting a flaw in the weld in-progress according to the scanning and the simulation, remediating the weld in-progress, and completing the welding operation.
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