公开(公告)号：US20190271587A1

公开(公告)日：2019-09-05

申请号：US15908982

申请日：2018-03-01

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Yuhua Luo ,  Zexin Luo ,  Michael B. Monjardin ,  LiCen Mu ,  Zhipeng Wang ,  XiYuan Yin ,  WeiFeng Zhang ,  Jia Yu Zheng

IPC分类号： G01J1/42 ,  G01J3/50 ,  G01J1/04

摘要： Technical solutions are described for testing a light emitting diode (LED) device. An example method includes driving, by a controller, a filter unit to filter a light from the LED device using a first filter. The method further includes, in response to a sensor not receiving a measurable signal because of the first filter, driving, by the controller, the filter unit to filter the light using a second filter. Further, in response to the sensor not receiving the measureable signal because of the second filter, the method includes outputting an indication that the LED device is rejected. Further, in response to the sensor receiving the measureable signal, the method includes outputting an indication that the LED device is of a color representative of the second filter.

公开(公告)号：US20200058117A1

公开(公告)日：2020-02-20

申请号：US16103178

申请日：2018-08-14

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Jiayu Zheng ,  Tao Song ,  Zexin Luo ,  WeiFeng Zhang ,  Lingle Guo ,  Mingman Li ,  Zhen Wang

IPC分类号： G06T7/00 ,  G02B6/06 ,  B23K37/00 ,  G01N21/88 ,  G01N21/95

摘要： System and methods for solder void analysis with an optical inspection component are described, including a plurality of optical fibers longitudinally disposed through a glass tube such that ends of the optical fibers are exposed from corresponding ends of the glass tube. A solderable fill encompassing each of the optical fibers by filling spaces between each of the optical fibers and between the optical fibers and the glass tube such that the ends of the glass tube include the ends of the optical fibers surrounded by the solderable fill to form an interface around the optical fibers for soldering one of the ends of the glass tube to a solder pad.

公开(公告)号：US10957030B2

公开(公告)日：2021-03-23

申请号：US16103178

申请日：2018-08-14

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Jiayu Zheng ,  Tao Song ,  Zexin Luo ,  WeiFeng Zhang ,  Lingle Guo ,  Mingman Li ,  Zhen Wang

IPC分类号： G06T7/00 ,  G02B6/06 ,  B23K37/00 ,  G01N21/95 ,  G01N21/88

摘要： System and methods for solder void analysis with an optical inspection component are described, including a plurality of optical fibers longitudinally disposed through a glass tube such that ends of the optical fibers are exposed from corresponding ends of the glass tube. A solderable fill encompassing each of the optical fibers by filling spaces between each of the optical fibers and between the optical fibers and the glass tube such that the ends of the glass tube include the ends of the optical fibers surrounded by the solderable fill to form an interface around the optical fibers for soldering one of the ends of the glass tube to a solder pad.