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公开(公告)号：US10957030B2
公开(公告)日：2021-03-23
申请号：US16103178
申请日：2018-08-14
发明人： Jiayu Zheng , Tao Song , Zexin Luo , WeiFeng Zhang , Lingle Guo , Mingman Li , Zhen Wang
摘要： System and methods for solder void analysis with an optical inspection component are described, including a plurality of optical fibers longitudinally disposed through a glass tube such that ends of the optical fibers are exposed from corresponding ends of the glass tube. A solderable fill encompassing each of the optical fibers by filling spaces between each of the optical fibers and between the optical fibers and the glass tube such that the ends of the glass tube include the ends of the optical fibers surrounded by the solderable fill to form an interface around the optical fibers for soldering one of the ends of the glass tube to a solder pad.
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公开(公告)号：US20200058117A1
公开(公告)日：2020-02-20
申请号：US16103178
申请日：2018-08-14
发明人： Jiayu Zheng , Tao Song , Zexin Luo , WeiFeng Zhang , Lingle Guo , Mingman Li , Zhen Wang
摘要： System and methods for solder void analysis with an optical inspection component are described, including a plurality of optical fibers longitudinally disposed through a glass tube such that ends of the optical fibers are exposed from corresponding ends of the glass tube. A solderable fill encompassing each of the optical fibers by filling spaces between each of the optical fibers and between the optical fibers and the glass tube such that the ends of the glass tube include the ends of the optical fibers surrounded by the solderable fill to form an interface around the optical fibers for soldering one of the ends of the glass tube to a solder pad.
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