公开(公告)号：US11367937B2

公开(公告)日：2022-06-21

申请号：US16464673

申请日：2016-12-30

Applicant: Intel Corporation

Inventor： Georgios Dogiamis ,  Sasha Oster ,  Telesphor Kamgaing

IPC: H01P3/16 ,  H01P3/08 ,  H03F3/19 ,  H03H11/04 ,  H05K1/02 ,  H05K1/18 ,  H05K7/14

Abstract: Embodiments of the invention may include a mm-wave waveguide. In an embodiment, the mm-wave waveguide may include a first dielectric waveguide and a second dielectric waveguide. A conductive layer may be used to cover the first dielectric waveguide and the second dielectric waveguide in some embodiments. Furthermore, embodiments may include a repeater communicatively coupled between the first dielectric waveguide and the second dielectric waveguide. In an embodiment, the repeater may be an active repeater or a passive repeater. According to an embodiment, a passive repeater may be integrated within the dielectric waveguide. The passive repeater may include a dispersion compensating material that produces a dispersion response in a signal that is substantially opposite to a dispersion response produced when the signal is propagated along the dielectric waveguide.

公开(公告)号：US11309619B2

公开(公告)日：2022-04-19

申请号：US16327811

申请日：2016-09-23

Applicant: INTEL CORPORATION

Inventor： Sasha Oster ,  Georgios Dogiamis ,  Telesphor Kamgaing ,  Adel Elsherbini ,  Shawna Liff ,  Aleksandar Aleksov ,  Johanna Swan

IPC: H01L23/66 ,  H01Q1/22 ,  H01Q21/06 ,  H01Q21/00 ,  H01P5/18

Abstract: A waveguide coupling system may include at least one waveguide member retention structure disposed on an exterior surface of a semiconductor package. The waveguide member retention structure may be disposed a defined distance or at a defined location with respect to an antenna carried by the semiconductor package. The waveguide member retention structure may engage and guide a waveguide member slidably inserted into the respective waveguide member retention structure. The waveguide member retention structure may position the waveguide member at a defined location with respect to the antenna to maximize the power transfer from the antenna to the waveguide member.

公开(公告)号：US11251512B2

公开(公告)日：2022-02-15

申请号：US16466627

申请日：2017-01-05

Applicant: Intel Corporation

Inventor： Georgios Dogiamis ,  Sasha Oster ,  Telesphor Kamgaing

IPC: H05K7/00 ,  H01P5/08 ,  H01P3/16 ,  H01R12/70 ,  H01R31/06 ,  H05K1/18 ,  H05K7/14

Abstract: Embodiments of the invention include an active mm-wave interconnect. In an embodiment, the active mm-wave interconnect includes a dielectric waveguide that is coupled to a first connector and a second connector. According to an embodiment, each of the first and second connectors may include a mm-wave engine. In an embodiment, the mm-wave engines may include a power management die, a modulator die, a demodulator die, a mm-wave transmitter die, and a mm-wave receiver die. Additional embodiments may include connectors that interface with predefined interfaces, such as small form-factor pluggables (SFP), quad small form-factor pluggables (QSFP), or octal small form-factor pluggables (OSFP). Accordingly, embodiments of the invention allow for plug and play functionality with existing servers and other high performance computing systems.

公开(公告)号：US10215164B2

公开(公告)日：2019-02-26

申请号：US14961116

申请日：2015-12-07

Applicant: Intel Corporation

Inventor： Nadine L. Dabby ,  Feras Eid ,  Adel A. Elsherbini ,  Braxton Lathrop ,  Aleksandar Aleksov ,  Sasha Oster

IPC: H01L41/113 ,  F03G5/08 ,  H02N2/18

Abstract: A device for harvesting energy from fabric or clothing includes a piece of fabric or clothing. One or more piezoelectric harvesters are coupled with the piece of fabric or clothing. The piezoelectric harvesters are capable of producing electric energy in response to the movement of the piece of fabric or clothing. Additionally, the device includes one or more energy storage mediums coupled to the one or more piezoelectric harvesters. The energy storage mediums are capable of storing the energy produced by the one or more piezoelectric harvesters. Further, the method for harvesting energy from fabric or clothing involves moving a piece of fabric such that one or more piezoelectric harvesters generate electricity. The method for harvesting energy from fabric or clothing also involves storing the generated electricity in one or more energy storage mediums.

公开(公告)号：US09824901B2

公开(公告)日：2017-11-21

申请号：US15085538

申请日：2016-03-30

Applicant: Intel Corporation

Inventor： Sasha Oster ,  Adel A. Elsherbini ,  Joshua D. Heppner ,  Shawna M. Liff

IPC: H01L21/56 ,  H01L23/31

CPC classification number: H01L23/315 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/42 ,  H01L23/4334 ,  H01L23/467 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/3511 ,  H01L2224/81

Abstract: Molded electronics package cavities are formed by placing a sacrificial material in the mold and then decomposing, washing, or etching away this sacrificial material. The electronics package that includes this sacrificial material is then overmolded, with little or no change needed in the overmolding process. Following overmolding, the sacrificial material is removed such as using a thermal, chemical, optical, or other decomposing process. This proposed use of sacrificial material allows for formation of complex 3-D cavities, and reduces or eliminates the need for precise material removal tolerances. Multiple instances of the sacrificial material may be removed simultaneously, replacing a serial drilling process with a parallel material removal manufacturing process.

公开(公告)号：US09788581B2

公开(公告)日：2017-10-17

申请号：US14865440

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Adel Elsherbini ,  Sasha Oster ,  Braxton Lathrop ,  Nadine L. Dabby ,  Feras Eid

IPC: G06F3/01 ,  H05K7/00 ,  A41D1/00 ,  G06F1/16 ,  H05K1/03 ,  H05K1/02

CPC classification number: A41D1/002 ,  G06F1/163 ,  H05K1/0283 ,  H05K1/0296 ,  H05K1/038 ,  H05K2201/0133 ,  H05K2201/09263 ,  H05K2201/10098 ,  H05K2201/10151

Abstract: Some forms relate to an electronic system that includes a textile. The electronic system includes a stretchable body that includes an integrated circuit that is configured to compute and communicate with an external device, wherein the stretchable body further includes at least one of (i) a power source that provides power to at least one of the electronic components; (ii) at least one sensor; (iii) a sensing node that receives signals from each sensor and sends signals to the integrated circuit; and (iv) an antenna that is configured to send and receive signals to and from the integrated circuit and the external device; and a textile attached to the stretchable body.

公开(公告)号：US11165129B2

公开(公告)日：2021-11-02

申请号：US16463329

申请日：2016-12-30

Applicant: Intel Corporation

Inventor： Georgios Dogiamis ,  Sasha Oster ,  Telesphor Kamgaing

IPC: H01P3/16 ,  H01P3/12 ,  H01P11/00 ,  H01P5/08

Abstract: Embodiments of the invention include a dispersion reduced dielectric waveguide and methods of forming such devices. In an embodiment, the dispersion reduced dielectric waveguide may include a first dielectric material that has a first Dk-value, and a second dielectric material that has a second Dk-value that is greater than the first Dk-value. In an embodiment, the dispersion reduced dielectric waveguide may also include a conductive layer formed around the first and second dielectric materials. According to an embodiment, a first portion of a bandwidth of a signal that is propagated along the dispersion reduced dielectric waveguide is primarily propagated along the first dielectric material, and a second portion of a bandwidth of the signal that is propagated along the dispersion reduced dielectric waveguide is primarily propagated along the second dielectric material.

公开(公告)号：US10386204B2

公开(公告)日：2019-08-20

申请号：US15636599

申请日：2017-06-28

Applicant: Intel Corporation

Inventor： Sasha Oster ,  Feras Eid ,  Thomas L. Sounart ,  Georgios C. Dogiamis

IPC: G01C25/00 ,  G01C19/5656 ,  G01P15/08 ,  G01P1/02 ,  G01P1/00 ,  G01P15/18 ,  G01P15/097 ,  G01P21/00

Abstract: An apparatus is provided which comprises: a substrate; a sensor including a sensing element, wherein the sensor is integrated within the substrate; and a calibration structure integrated within the substrate, wherein the calibration structure is to exhibit one or more physical or chemical properties same as the sensor but without the sensing element.

公开(公告)号：US10039186B2

公开(公告)日：2018-07-31

申请号：US15267872

申请日：2016-09-16

Applicant: Intel Corporation

Inventor： Amit Sudhir Baxi ,  Vincent S. Mageshkumar ,  Adel A. Elsherbini ,  Sasha Oster ,  Feras Eid ,  Aleksandar Aleksov ,  Johanna M. Swan

IPC: H05K1/00 ,  H05K1/14 ,  H05K1/18 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/147 ,  A61B5/00 ,  A61B5/6833 ,  A61B2562/164 ,  A61B2562/166 ,  H05K1/0283 ,  H05K1/112 ,  H05K1/181 ,  H05K3/365 ,  H05K2201/10151 ,  H05K2201/10265 ,  H05K2201/10303 ,  H05K2201/10318

Abstract: A circuit interconnect may be used in biometric data sensing and feedback applications. A circuit interconnect may be used in device device-to-device connections (e.g., Internet of Things (IoT) devices), including applications that require connection between stretchable and rigid substrates. A circuit interconnect may include a multi-pin, snap-fit attachment mechanism, where the attachment mechanism provides an electrical interconnection between a rigid substrate and a flexible or stretchable substrate. The combination of a circuit interconnect and flexible or stretchable substrate provides improved electrical connection reliability, allows for greater stretchability and flexibility of the circuit traces, and allows for more options in connecting a stretchable circuit trace to a rigid PCB.

公开(公告)号：US09915978B2

公开(公告)日：2018-03-13

申请号：US14859894

申请日：2015-09-21

Applicant: Intel Corporation

Inventor： Nadine L. Dabby ,  Lakshman Krishnamurthy ,  Braxton Lathrop ,  Aleksandar Aleksov ,  Adel Elsherbini ,  Sasha Oster ,  Tom L. Simmons

IPC: H05K3/30 ,  G06F1/16

CPC classification number: G06F1/1633 ,  H01L23/5385 ,  H01L23/5387 ,  H01L25/105 ,  H01L2225/1017 ,  H01L2225/1047 ,  H01L2924/00

Abstract: Some forms relate to a method of making a stretchable computing system. The method includes attaching a first set of conductive traces to a stretchable member; attaching a first electronic component to the first set of conductive traces; adding a first set of flexible conductors to the stretchable member such that the first set of flexible conductors is electrically connected to the first set of conductive traces; adding stretchable material to the stretchable member such that the first set of conductive traces is surrounded by the stretchable member; forming an opening in the stretchable member that exposes the first set of conductive traces; and attaching a second set of conductive traces to the stretchable member such that the second set of conductive traces fills the opening to form a via in the stretchable member that electrically connects the first set of conductive traces with the second set of conductive traces.