公开(公告)号：US12205908B2

公开(公告)日：2025-01-21

申请号：US17349777

申请日：2021-06-16

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing

IPC: H01L23/66 ,  H01L23/00 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to a transceiver architecture for inter-die communication on-package using mm-wave/THz interconnects. In particular, amplifier-less transceivers are used in combination with on-package low loss transmission lines to provide inter-die communication. In embodiments, signals on the interconnect may be transmitted between up conversion mixers and down conversion mixers without any additional amplification. Other embodiments may be described and/or claimed.

公开(公告)号：US20240421465A1

公开(公告)日：2024-12-19

申请号：US18334201

申请日：2023-06-13

Applicant: Intel Corporation

Inventor： Tolga Acikalin ,  Tae Young Yang ,  Shuhei Yamada ,  Telesphor Kamgaing

IPC: H01Q1/22 ,  H01L23/15 ,  H01L23/538 ,  H01L25/065 ,  H01P3/08 ,  H01Q13/02

Abstract: Wireless interconnects in integrated circuit package substrates with glass cores are disclosed. An example apparatus includes a semiconductor die. The example apparatus further includes a package substrate supporting the semiconductor die. The package substrate includes a glass core. The example apparatus also includes an antenna within the glass core.

公开(公告)号：US12155133B2

公开(公告)日：2024-11-26

申请号：US18133361

申请日：2023-04-11

Applicant: Intel Corporation

Inventor： Feras Eid ,  Sasha N. Oster ,  Telesphor Kamgaing ,  Georgios C. Dogiamis ,  Aleksandar Aleksov

IPC: H01Q1/38 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495 ,  H01L23/522 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/52 ,  H01Q9/04 ,  H01Q19/22 ,  H01L23/367

Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.

公开(公告)号：US12150271B2

公开(公告)日：2024-11-19

申请号：US18331474

申请日：2023-06-08

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Johanna M. Swan ,  Georgios Dogiamis ,  Henning Braunisch ,  Adel A. Elsherbini ,  Aleksandar Aleksov ,  Richard Dischler

IPC: H05K7/14 ,  H01P3/16 ,  H01P5/08 ,  H01P5/12 ,  H05K1/02 ,  H01L23/00 ,  H01L23/538 ,  H01L23/66 ,  H01L25/18 ,  H05K1/18

Abstract: Embodiments may relate an electronic device that includes a first server blade and a second server blade coupled with a chassis. The first and second server blades may include respective microelectronic packages. The electronic device may further include a waveguide coupled to the first and second server blades such that their respective microelectronic packages are communicatively coupled by the waveguide. Other embodiments may be described or claimed.

公开(公告)号：US20240234303A9

公开(公告)日：2024-07-11

申请号：US17972975

申请日：2022-10-25

Applicant: Intel Corporation

Inventor： Min Suet Lim ,  Telesphor Kamgaing ,  Chee Kheong Yoon ,  Chu Aun Lim ,  Eng Huat Goh ,  Jooi Wah Wong ,  Kavitha Nagarajan

IPC: H01L23/522 ,  H01L49/02

CPC classification number: H01L23/5227 ,  H01L28/10

Abstract: Described herein are integrated circuit devices that include semiconductor devices near the center of the device, rather than towards the top or bottom of the device, and integrated inductors formed over the semiconductor devices. Power delivery to the device is on the opposite side of the semiconductor devices. The integrated inductors may be used for power step-down to reduce device thickness and/or a number of power rails.

公开(公告)号：US12021289B2

公开(公告)日：2024-06-25

申请号：US16912067

申请日：2020-06-25

Applicant: Intel Corporation

Inventor： Diego Correas-Serrano ,  Georgios Dogiamis ,  Henning Braunisch ,  Neelam Prabhu Gaunkar ,  Telesphor Kamgaing

IPC: H01P5/02 ,  H01L23/498 ,  H01L23/66 ,  H01P3/16 ,  H01R12/75

CPC classification number: H01P5/022 ,  H01L23/49811 ,  H01L23/66 ,  H01P3/16 ,  H01R12/75 ,  H01L2223/6616 ,  H01L2223/6627

Abstract: Disclosed herein is a millimeter-wave dielectric waveguide connector that includes a first connector interface, a second connector interface, a dielectric material exposed at the first connector interface and the second connector interface, and a metal structure around the dielectric material, wherein the metal structure includes a flared portion at the first connector interfacea.

公开(公告)号：US11955684B2

公开(公告)日：2024-04-09

申请号：US16911568

申请日：2020-06-25

Applicant: Intel Corporation

Inventor： Diego Correas-Serrano ,  Georgios Dogiamis ,  Henning Braunisch ,  Neelam Prabhu Gaunkar ,  Telesphor Kamgaing

IPC: H01P3/16 ,  H01P1/20 ,  H01P1/208 ,  H01P5/02 ,  H01P5/08

CPC classification number: H01P3/16 ,  H01P1/2002 ,  H01P1/2088 ,  H01P5/02 ,  H01P5/087

Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.

公开(公告)号：US20240113052A1

公开(公告)日：2024-04-04

申请号：US18541878

申请日：2023-12-15

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Adel A. Elsherbini ,  Sasha Oster

IPC: H01L23/66 ,  H01L21/48 ,  H01L23/498

CPC classification number: H01L23/66 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/16

Abstract: In various embodiments, disclosed herein are systems and methods directed to the fabrication of a coreless semiconductor package (e.g., a millimeter (mm)-wave antenna package) having an asymmetric build-up layer count that can be fabricated on both sides of a temporary substrate (e.g., a core). The asymmetric build-up layer count can reduce the overall layer count in the fabrication of the semiconductor package and can therefore contribute to fabrication cost reduction. In further embodiments, the semiconductor package (e.g., a millimeter (mm)-wave antenna packages) can further comprise dummification elements disposed near one or more antenna layers. Further, the dummification elements disposed near one or more antenna layers can reduce image current and thereby increasing the antenna gain and efficiency.

公开(公告)号：US20240030098A1

公开(公告)日：2024-01-25

申请号：US18366734

申请日：2023-08-08

Applicant: Intel Corporation

Inventor： Feras Eid ,  Telesphor Kamgaing ,  Georgios Dogiamis ,  Aleksandar Aleksov ,  Johanna M. Swan

IPC: H01L23/427 ,  H01L23/38 ,  H01L23/373 ,  H01L23/31 ,  H01L23/48 ,  H03H9/46 ,  H01L23/66

CPC classification number: H01L23/427 ,  H01L23/38 ,  H01L23/373 ,  H01L23/3157 ,  H01L23/481 ,  H03H9/46 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2223/6644 ,  H01L2223/6677

Abstract: Disclosed herein are structures and assemblies that may be used for thermal management in integrated circuit (IC) packages.

公开(公告)号：US11715693B2

公开(公告)日：2023-08-01

申请号：US16397923

申请日：2019-04-29

Applicant: Intel Corporation

Inventor： Georgios Dogiamis ,  Aleksandar Aleksov ,  Adel A. Elsherbini ,  Henning Braunisch ,  Johanna M. Swan ,  Telesphor Kamgaing

IPC: H01L23/538 ,  H01L23/66 ,  G02B6/30 ,  H01P3/16 ,  H01P11/00

CPC classification number: H01L23/538 ,  G02B6/30 ,  H01L23/66 ,  H01P3/16 ,  H01P11/006 ,  H01L2223/6627

Abstract: Embodiments may relate to a semiconductor package that includes a package substrate coupled with a die. The package may further include a waveguide coupled with the first package substrate. The waveguide may include two or more layers of a dielectric material with a waveguide channel positioned between two layers of the two or more layers of the dielectric material. The waveguide channel may convey an electromagnetic signal with a frequency greater than 30 gigahertz (GHz). Other embodiments may be described or claimed.