Abstract:
A vacuum interrupter (10) has a metallic member (11, 13) for a vacuum envelope and an insulating member (12a, 12b) for the vacuum envelope, made of unglazed insulating ceramics. A pair of separable stationary and movable contacts (24, 29) contained in the vacuum envelope. A movable lead rod (16) is rigidly secured to a movable disc-shaped electrode (30) which has the movable contact (29), extending outwardly of the vacuum envelope. Bellows secured in a vacuum-tight manner to the rod (16) and to the vacuum envelope. An impervious insulating film is coated adhesively on atmospheric-side surfaces of the insulating member (12a, 12b) and of the vacuum-tightly connected portion and vicinity thereof between the insulating member (12a, 12b) and metallic member (11, 13) for the vacuum envelope. Consequently, the vacuum envelope of the interrupter (10) is free from adsorbing moisture and pollutant, thereby preventing insulating performance of the envelope from lowering, and highly improving reliablity of vacuum-tightness of the envelope.
Abstract:
A semiconductor device package is provided which can achieve speeding-up thereof. The semiconductor device package includes: a board which has at least one of a ground plane and a power plane; at least one connecting conductor portion which is formed on an inner wall surface of an opening portion of the board and electrically connected to the corresponding plane; at least one bonding pattern which is formed on a front surface layer portion of the board in the vicinity of an edge of the opening portion, and connected to the corresponding connecting conductor portion; and a second external connection portion which is formed on the side of the front surface layer of the board, and electrically connected to the corresponding plane, respectively, through a through-hole conductor portion formed in the board.
Abstract:
A method of manufacturing a wiring board by utilizing electro plating characterized in that: when a wiring pattern is formed on the board by utilizing electro plating, an unnecessary portion does not remain on the wiring pattern. The method comprises: first electroless plating layers (19) are formed on both sides of an insulating substrate (1), which are covered with metallic foils (17) in advance, on which first electro plating layers (21) are formed; wiring patterns are formed by etching so as not to extend to the end edge of the substrate; second electroless plating layers (41) are formed on all of the surfaces of the substrate; a plating resist pattern (43) is formed so that only a predetermined portion of the wiring patterns is exposed; a second electro plating layer (27, 29) is formed on the predetermined portion of the wiring patterns by supplying an electric power from the second electroless plating layers; the plating resist pattern and the second electroless plating layers are removed; and a solder resist (45) is formed so that predetermined portions of the wiring patterns are exposed.
Abstract:
A semiconductor device package is provided which can achieve speeding-up thereof. The semiconductor device package includes: a board which has at least one of a ground plane and a power plane; at least one connecting conductor portion which is formed on an inner wall surface of an opening portion of the board and electrically connected to the corresponding plane; at least one bonding pattern which is formed on a front surface layer portion of the board in the vicinity of an edge of the opening portion, and connected to the corresponding connecting conductor portion; and a second external connection portion which is formed on the side of the front surface layer of the board, and electrically connected to the corresponding plane, respectively, through a through-hole conductor portion formed in the board.
Abstract:
The present invention provides a pipelined computer which processes variable-length data without using branch instructions for speedy execution of a variable-length data-handling software instruction. Upon receiving a variable-length data-handling instruction from an instruction supply unit 1, an instruction division unit 2 divides the instruction into a plurality of derived micro instructions that handle fixed-length data. A reservation station 5 sends the derived micro instructions to an execution unit 6 and a redundant instruction detection unit 9 in a sequence in which the derived micro instructions were generated during the division. The redundant instruction detection unit 9 monitors the remaining derived micro instructions. An instruction deletion control unit 8 deletes redundant micro instructions in the reservation station 5. An instruction end operation unit 7 sets the state of the redundant derived micro instructions in the reorder buffer 4 to “execution completed state”.
Abstract:
Catalyst compositions suitable for use in the exhaust gas recycle stream of an internal combustion engine are provided. Such catalyst compositions typically provide significant amounts of methane in addition to syngas. A reformer incorporating such a catalyst for use in an exhaust gas recycle portion of an internal combustion engine powertrain is described. A powertrain incorporating such a reformer, a method of increasing the octane rating of an exhaust gas recycle stream, and a method of operating an internal combustion engine using methane-assisted combustion are also described.
Abstract:
Catalyst compositions suitable for use in the exhaust gas recycle stream of an internal combustion engine are provided. Such catalyst compositions typically provide significant amounts of methane in addition to syngas. A reformer incorporating such a catalyst for use in an exhaust gas recycle portion of an internal combustion engine powertrain is described. A powertrain incorporating such a reformer, a method of increasing the octane rating of an exhaust gas recycle stream, and a method of operating an internal combustion engine using methane-assisted combustion are also described.
Abstract:
An object grasping control method, in which an object grasping control apparatus grasps a plurality of graspable members using a grasping unit, includes recognizing at least one of a shape, position, and attitude of each of the plurality of graspable members, setting, based on at least of one of the shape, position, and attitude of each of the plurality of graspable members, an attitude range as a graspable attitude range in which each of the plurality of graspable members and the grasping unit do not interfere with each other for each of the plurality of graspable members, and setting, as a grasping target to be grasped by the grasping unit, a graspable member, among the plurality of graspable members, the set graspable attitude range of which is greater than a predetermined threshold value.
Abstract:
An endurance testing apparatus, which is for performing an endurance test of a contacting/separating portion in which a first member and a second member repeats contacting with and separating from each other, has a contact load generator and a testing medium fluid supply means. The contact load generator reciprocates the second member relative to the first member to generate a contact load acting between the first member and the second member repeatedly. The testing medium fluid supply means supplies a testing medium fluid to the contacting/separating portion to expose the first member and the second member to the testing medium fluid.
Abstract:
A method of manufacturing a wiring board by utilizing electro plating characterized in that: when a wiring pattern is formed on the board by utilizing electro plating, an unnecessary portion does not remain on the wiring pattern. The method comprises: first electroless plating layers (19) are formed on both sides of an insulating substrate (1), which are covered with metallic foils (17) in advance, on which first electro plating layers (21) are formed; wiring patterns are formed by etching so as not to extend to the end edge of the substrate; second electroless plating layers (41) are formed on all of the surfaces of the substrate; a plating resist pattern (43) is formed so that only a predetermined portion of the wiring patterns is exposed; a second electro plating layer (27, 29) is formed on the predetermined portion of the wiring patterns by supplying an electric power from the second electroless plating layers; the plating resist pattern and the second electroless plating layers are removed; and a solder resist (45) is formed so that predetermined portions of the wiring patterns are exposed.