摘要:
Disclosed is a photocurable resin composition which is highly sensitive to ultraviolet light or visible light having a long wavelength, in particular a photocurable resin composition which is useful as a sealing agent. Specifically disclosed is a photocurable resin composition containing a component (a) which is composed of an anthraquinone derivative represented by the formula (I) below, and a component (b) which is composed of a compound having a (meth)acryloyl group in the molecule. The photocurable resin composition is characterized in that a part or the entire of the component (b) further contains an oxiranyl group in the molecule, and the component (a) content is 0.01-10% by mass relative to the component (b) content. [chemical formula 1] (I) (In the formula (I), X represents a phenyl group, an alkyl group having 1-8 carbon atoms, an alcoholic form of the phenyl group or the alkyl group, or a derivative of the alcoholic form.)
摘要:
A liquid crystal sealing agent composition that is a one-component light and heat-curable resin composition containing: (1) a solid epoxy resin having a ring and ball method softening temperature of 40° C. or above; (2) an acrylate monomer and/or a methacrylate monomer, or an oligomer thereof; (3) a thermoplastic polymer having a ring and ball method softening temperature of 50 to 120° C., the thermoplastic polymer being obtained by copolymerizing an acrylate monomer and/or a methacrylate monomer with a monomer copolymerizable therewith; (4) a light-activated radical polymerization initiator; and (5) a latent epoxy curing agent. The light and heat curable liquid crystal sealing agent composition is employable in one drop fill, is excellent in properties of a cured product particularly after first-stage light curing, achieves stable cell gap after cell gap formation, permits prevention of contamination of the liquid crystal in second-stage heat curing, is excellent in curing properties in shaded area, and shows superior bonding reliability.
摘要:
Disclosed is a photocurable resin composition which is highly sensitive to ultraviolet light or visible light having a long wavelength, in particular a photocurable resin composition which is useful as a sealing agent. Specifically disclosed is a photocurable resin composition containing a component (a) which is composed of an anthraquinone derivative represented by the formula (I) below, and a component (b) which is composed of a compound having a (meth)acryloyl group in the molecule. The photocurable resin composition is characterized in that a part or the entire of the component (b) further contains an oxiranyl group in the molecule, and the component (a) content is 0.01-10% by mass relative to the component (b) content. [chemical formula 1] (I) (In the formula (I), X represents a phenyl group, an alkyl group having 1-8 carbon atoms, an alcoholic form of the phenyl group or the alkyl group, or a derivative of the alcoholic form.)
摘要:
A liquid crystal sealing agent composition that is a one-component light and heat-curable resin composition containing: (1) a solid epoxy resin having a ring and ball method softening temperature of 40° C. or above; (2) an acrylate monomer and/or a methacrylate monomer, or an oligomer thereof; (3) a thermoplastic polymer having a ring and ball method softening temperature of 50 to 120° C., the thermoplastic polymer being obtained by copolymerizing an acrylate monomer and/or a methacrylate monomer with a monomer copolymerizable therewith; (4) a light-activated radical polymerization initiator; and (5) a latent epoxy curing agent. The light and heat curable liquid crystal sealing agent composition is employable in one drop fill, is excellent in properties of a cured product particularly after first-stage light curing, achieves stable cell gap after cell gap formation, permits prevention of contamination of the liquid crystal in second-stage heat curing, is excellent in curing properties in shaded area, and shows superior bonding reliability.
摘要:
A photocurable resin composition comprises a cationic polymerizable compound (A), an acrylic resin (B) and a cationic photopolymerization initiator (C), in which the acrylic resin (B) has a cationic polymerizable functional group, and the content of the component (A) is 30 to 95 parts by mass and the content of the component (B) is 5 to 70 parts by mass, based on 100 parts by mass of the total amount of the components (A) and (B). In addition, the functional group of the acrylic resin (B) preferably contains at least one of a cyclic ether group, a vinyloxy group, an acid adduct of a vinyloxy group, and an active hydrogen group, with the active hydrogen group preferably being a hydroxyl group. The photocurable resin composition has sufficient curability and sufficient adhesiveness to rigid plastics such as polycarbonate and PET having poor adhesive property.
摘要:
It has been discovered that an initiation reaction is efficiently progressed to a propagation reaction by adding a compound that potentially or directly generates a carbocation to the polymerization system of a cationic ring-opening polymerizable compound, and thus the activation of polymerization is rendered. Namely, the present invention relates to a cationic polymerizable resin composition which is characterized by comprising (A) a compound having at least one functional group capable of cationic ring-opening polymerization in one molecular chain, (B) a cationic polymerization initiator, and (C) a compound to generate a carbocation by the action of active species generated from (B) the cationic polymerization initiator by electromagnetic wave or particle beam. According to the present invention, it has been discovered that the initiation reaction is efficiently progressed to the propagation reaction by adding the compound that potentially or directly generates a carbocation to the polymerization system of the cationic ring-opening polymerizable compound, and thus the activation of polymerization is rendered.
摘要:
A lead-free organic sealant with which sealing can be carried out at a temperature lower than 400° C., and which is excellent in strength at high temperature. Specifically, an organic sealant for sealing envelope-constituting members to constitute a vacuum envelope for an image display device, wherein a fired body of the organic sealant has a minimum viscosity of at most 103 Pa•s within a temperature range of at least 300° C. and lower than 400° C., and the fired body of the organic sealant satisfies 0.99
摘要:
An end-face sealing agent for display devices, which consists of a resin composition containing (1) a liquid epoxy resin, (2) an epoxy resin curing agent that is liquid at 23° C. and that is selected from the group consisting of acid anhydrides and thiol compounds having two or more mercapto groups in the molecule, (3) a secondary or tertiary amine that is solid at 233° C., or microcapsules that contain a secondary or tertiary amine therein, and (4) a filler, and in which the content of the component (4) is 50 to 150 parts by weight relative to 100 parts by weight of the sum total of the components (1), (2) and (3), and the viscosity as determined using an E-type viscometer at 253° C. and 2.5 rpm is 0.5 to 50 Pas.
摘要:
An ionic compound comprising a cationic portion having a hydroxyl group and/or a carboxylic acid group and an anionic portion of the formula (1): [BR4]− (1) wherein R may be the same or different and represents a phenyl group substituted with F or CF3. Preferably, the anionic portion is [B(C6F5)4]−, [B(C6H4CF3)4]− or [B(C6H3F2)4]−. In other aspects, a radiation polymerization initiator and a resin composition comprising the ionic compound are provided. A resin composition prepared by using the radiation polymerization initiator generates a small amount of outgas during reaction and has excellent reactivity and transparency.
摘要:
Pastes for circuit connections and anisotropic conductive pastes that are excellent in storage stability and dispenser application properties, can be free of voids, bubbles and bleeding on thermocompression bonding and can give cured products having high bonding and connection reliability at high temperatures and high humidity, and the ability to be repaired. The paste for circuit connection contains an epoxy resin, an acid anhydride curing agent or a phenolic curing agent, and high-softening point fine particles. The anisotropic conductive paste additionally contains conductive particles. The method of using the paste for circuit connection or the anisotropic conductive paste involves connecting an electric circuit wiring formed on a substrate with an electric circuit wiring formed on another substrate with the paste for circuit connection or the anisotropic conductive paste.