摘要:
An end-face sealing agent for display devices, which consists of a resin composition containing (1) a liquid epoxy resin, (2) an epoxy resin curing agent that is liquid at 23° C. and that is selected from the group consisting of acid anhydrides and thiol compounds having two or more mercapto groups in the molecule, (3) a secondary or tertiary amine that is solid at 233° C., or microcapsules that contain a secondary or tertiary amine therein, and (4) a filler, and in which the content of the component (4) is 50 to 150 parts by weight relative to 100 parts by weight of the sum total of the components (1), (2) and (3), and the viscosity as determined using an E-type viscometer at 253° C. and 2.5 rpm is 0.5 to 50 Pas.
摘要:
The invention provides a cation polymerizable resin composition excellent in curing properties and corrosion resistance with less resin coloration and less cure shrinkage, which is a material suitable as a surface protective material for optical disk. Specifically, the cationpolymerizable resin composition comprises an epoxy compound (A) as an essential ingredient represented by formula 1 wherein R1 and R2 each represent a saturated or unsaturated carbon atom, and R3 represents a hydrogen atom or a saturated or unsaturated carbon atom, a cation polymerizable compound (B) other than the epoxy compound represented by formula 1, a photo cation polymerization initiator (C) and a photo radical polymerization initiator (D)
摘要:
The invention provides a cation polymerizable resin composition excellent in curing properties and corrosion resistance with less resin coloration and less cure shrinkage, which is a material suitable as a surface protective material for optical disk. Specifically, the cation polymerizable resin composition comprises an epoxy compound (A) as an essential ingredient represented by formula 1 wherein R1 and R2 each represent a saturated or unsaturated carbon atom, and R3 represents a hydrogen atom or a saturated or unsaturated carbon atom, a cation polymerizable compound (B) other than the epoxy compound represented by formula 1, a photo cation polymerization initiator (C) and a photo radical polymerization initiator (D).