Abstract:
A programmable device has digital logic elements and a programmable interconnect structure employing antifuses, the antifuses being programmable to connect selected ones of the digital logic elements together. During normal circuit operation, a first power input terminal is used to power the digital logic elements with a first supply voltage received on the first power input terminal. During normal circuit operation, a second power input terminal is used to protect circuitry of the programmable device from high voltage signals that may be driven onto terminals of the programmable device by circuitry external to the programmable device. During antifuse programming, the second power input terminal is used to drive charge pumps of programming drivers and/or programming control drivers. In some embodiments, the second power input terminal receives a voltage higher than the first supply voltage during antifuse programming such that the oscillating signal that drives the charge pumps has a larger amplitude thereby allowing back bias threshold voltages of transistors in the charge pumps to be overcome, facilitating starting of the charge pumps, and/or increasing charge pump efficiency.
Abstract:
A programmable device comprises a first antifuse programmed with a first programming method and a second antifuse programmed with a second programming method, whereby an actual operating current flowing through the second antifuse exceeds a maximum permissible operating current of the first antifuse but does not exceed a maximum permissible operating current of the second antifuse, whereby an actual operating current flowing through the first antifuse does not exceed the maximum permissible operating current of the first antifuse, and whereby an actual operating current flowing through the second antifuse does not exceed the maximum permissible operating current of the second antifuse. By allowing the use of a programming method on some antifuses which would not be adequate for the programming of other antifuses, the realization of user-specific circuits in field programmable devices is facilitated and the reliability of user-specific circuits realized in field programmable devices is enhanced.
Abstract:
Antifuses and gate arrays with antifuses are disclosed that have high thermal stability, reduced size, reduced leakage current, reduced capacitance in the unprogrammed state, improved manufacturing yield, and more controllable electrical characteristics. Some antifuses include spacers in the antifuse via. In some antifuses, the programmable material is planar, and the top or the bottom electrode is formed in the antifuse via. In some gate arrays, the antifuses are formed above the dielectric separating two levels of routing channels rather than below that dielectric.
Abstract:
An amorphous silicon antifuse has a bottom electrode, a dielectric overlying the bottom electrode, amorphous silicon contacting the bottom electrode in a via in the dielectric, and the top electrode over the amorphous silicon. Spacers are provided in the via corners between the amorphous silicon and the top electrode. The spacers smooth the surface above the amorphous silicon, provide good top electrode step coverage, and reduce leakage current. Another amorphous silicon antifuse is provided in which the amorphous silicon layer is planar. The planarity makes the amorphous silicon layer easy to manufacture. A programmable CMOS circuit is provided in which the antifuses are formed over the intermetal dielectric. The antifuses are not affected by the high temperatures associated with the formation of the intermetal dielectric and the first-metal contacts. The intermetal dielectric protects the circuit elements during the antifuse formation. The bottom electrodes of the antifuses are connected to the first-metal contacts. The overall capacitance associated with the antifuses is low, and hence the circuit is fast.
Abstract:
Internal net drivers of a field programmable gate array are laid out with additional transistors to increase current drive capability at low supply voltages when a low supply voltage mask option is used. When a high supply voltage mask option is used, the additional transistors are not used in this way and the net drivers do not provide additional switching current drive capability. In some embodiments, were a low supply voltage mask option net driver operated at the high supply voltage, an impermissibly large switching current would flow through a programmed antifuse in a net coupled to the output of the net driver.
Abstract:
Antifuses and gate arrays with antifuses are disclosed that have high thermal stability, reduced size, reduced leakage current, reduced capacitance in the unprogrammed state, improved manufacturing yield, and more controllable electrical characteristics. Some antifuses include spacers in the antifuse via. In some antifuses, the programmable material is planar, and the top or the bottom electrode is formed in the antifuse via. In some gate arrays, the antifuses are formed above the dielectric separating two levels of routing channels rather than below that dielectric.
Abstract:
A method for determining an electrical characteristic (such as a resistance) of an antifuse of a programmable device. The method comprises the steps of: 1) before the antifuse is programmed, determining an electrical characteristic (such as a voltage, current and/or resistance) of a first conductive path which includes a series element disposed electrically in series with a parallel element, the parallel element being controlled to be substantially conductive, the parallel element being disposed electrically in parallel with the unprogrammed antifuse; 2) after programming of the antifuse, determining an electrical characteristic (such as a voltage, current and/or resistance) of a second conductive path including the series element disposed electrically in series with the programmed antifuse when the parallel element is controlled to be substantially nonconductive; 3) determining an electrical characteristic (such as a voltage, current and/or resistance) of a third, conductive path through the series element, and through the programmed antifuse and the parallel element, the parallel element being controlled to be substantially conductive; and 4) determining the electrical characteristic (such as a resistance) of the antifuse based on the above three determinations in 1), 2) and 3). The method is usable to determine whether or not programmed antifuses of a programmable device have low enough resistances to meet desired reliability criteria.
Abstract:
A latch device and related layout techniques are provided to reduce soft error rates caused by radiation or other exposure to ionized/charged particles. The latch device comprises a pair of cross-coupled inverters forming a storage cell. A pair of clock pass transistors is coupled to the pair of cross-coupled inverters. The pair of clock pass transistors is configured to receive as input a clock signal. On both true and complement sides of the latch device, a channel-connected region is formed between one of the pair of cross-coupled inverters and one of the pair of clock pass transistors. Each channel-connected region is configured to have a reduced Linear Energy Transfer (LET) cross-section. The reduced LET cross-section results in a reduced soft error rate.
Abstract:
A latch device and related layout techniques are provided to reduce soft error rates caused by radiation or other exposure to ionized/charged particles. The latch device comprises a pair of cross-coupled inverters forming a storage cell. A pair of clock pass transistors is coupled to the pair of cross-coupled inverters. The pair of clock pass transistors is configured to receive as input a clock signal. On both true and complement sides of the latch device, a channel-connected region is formed between one of the pair of cross-coupled inverters and one of the pair of clock pass transistors. Each channel-connected region is configured to have a reduced Linear Energy Transfer (LET) cross-section. The reduced LET cross-section results in a reduced soft error rate.
Abstract:
A lower metal plate having a strip-like opening is used in a bond pad structure having metal plugs coupling the lower metal plate to an upper metal plate. A volume of relatively rigid material filling a volume above the strip-like opening transfers stress from the upper metal plate, through the strip-like opening, and to a foundation layer upon which the lower metal plate is disposed. The bond pad structure can be fabricated using the same semiconductor processing steps used to fabricate amorphous silicon antifuse structures having metal plugs.