公开(公告)号：US08110962B2

公开(公告)日：2012-02-07

申请号：US12642357

申请日：2009-12-18

申请人： Christian Bauer ,  Hans Krueger ,  Werner Ruile ,  Alois Stelzl

发明人： Christian Bauer ,  Hans Krueger ,  Werner Ruile ,  Alois Stelzl

IPC分类号： H01L29/84

CPC分类号： H03H9/02866 ,  H03H9/14538

摘要： A MEMS component includes a chip that has a rear side having a low roughness of less than one tenth of the wavelength at the center frequency of an acoustic wave propagating in the component. Metallic structures for scattering bulk acoustic waves are provided on the rear side of the chip and a material of the metallic structures is acoustically matched to a material of the chip.

摘要翻译： MEMS部件包括芯片，该芯片的后侧具有小于在部件中传播的声波的中心频率处波长的十分之一的粗糙度。 用于散射体声波的金属结构设置在芯片的后侧，并且金属结构的材料与芯片的材料声学匹配。

公开(公告)号：US20100148285A1

公开(公告)日：2010-06-17

申请号：US12642357

申请日：2009-12-18

申请人： Christian Bauer ,  Hans Krueger ,  Werner Ruile ,  Alois Stelzl

发明人： Christian Bauer ,  Hans Krueger ,  Werner Ruile ,  Alois Stelzl

IPC分类号： H01L29/84 ,  H01L21/3205

CPC分类号： H03H9/02866 ,  H03H9/14538

摘要： A MEMS component includes a chip that has a rear side having a low roughness of less than one tenth of the wavelength at the center frequency of an acoustic wave propagating in the component. Metallic structures for scattering bulk acoustic waves are provided on the rear side of the chip and a material of the metallic structures is acoustically matched to a material of the chip.

摘要翻译： MEMS部件包括芯片，该芯片的后侧具有小于在部件中传播的声波的中心频率处波长的十分之一的粗糙度。 用于散射体声波的金属结构设置在芯片的后侧，并且金属结构的材料与芯片的材料声学匹配。

公开(公告)号：US08759677B2

公开(公告)日：2014-06-24

申请号：US12993299

申请日：2009-05-26

申请人： Christian Bauer ,  Hans Krueger ,  Juergen Portmann ,  Alois Stelzl

发明人： Christian Bauer ,  Hans Krueger ,  Juergen Portmann ,  Alois Stelzl

IPC分类号： H01J5/00 ,  H01J15/00 ,  H05K5/06 ,  H05H1/00 ,  H05K7/00 ,  H05K7/10 ,  H05K7/12

CPC分类号： H01L23/06 ,  B81B7/0077 ,  B81C2203/0136 ,  H01L23/053 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/3011 ,  H01L2924/00

摘要： Frames (3) applied on a wafer (1) are leveled and covered with a covering film, such that gas-tight housings are formed for component structures (5), in particular for filter or MEMS structures. Inner columns (4) can be provided for supporting the housing and for the ground connection; outer columns (4) can be provided for the electrical connection and are connected to the component structures by means of conductor tracks (6) that are electrically insulated from the frames (3).

摘要翻译： 施加在晶片（1）上的框架（3）被平整并用覆盖膜覆盖，使得形成用于组件结构（5）的气密壳体，特别是用于过滤器或MEMS结构。 可以提供内柱（4）用于支撑壳体和接地连接; 可以为电连接提供外柱（4），并且通过与框架（3）电绝缘的导体轨道（6）连接到部件结构。

公开(公告)号：US20110114355A1

公开(公告)日：2011-05-19

申请号：US12993299

申请日：2009-05-26

申请人： Christian Bauer ,  Hans Krueger ,  Juergen Portmann ,  Alois Stelzl

发明人： Christian Bauer ,  Hans Krueger ,  Juergen Portmann ,  Alois Stelzl

IPC分类号： H05K5/06

CPC分类号： H01L23/06 ,  B81B7/0077 ,  B81C2203/0136 ,  H01L23/053 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/3011 ,  H01L2924/00

摘要： Frames (3) applied on a wafer (1) are leveled and covered with a covering film, such that gas-tight housings are formed for component structures (5), in particular for filter or MEMS structures. Inner columns (4) can be provided for supporting the housing and for the ground connection; outer columns (4) can be provided for the electrical connection and are connected to the component structures by means of conductor tracks (6) that are electrically insulated from the frames (3).

摘要翻译： 施加在晶片（1）上的框架（3）被平整并用覆盖膜覆盖，使得形成用于组件结构（5）的气密壳体，特别是用于过滤器或MEMS结构。 可以提供内柱（4）用于支撑壳体和接地连接; 可以为电连接提供外柱（4），并且通过与框架（3）电绝缘的导体轨道（6）连接到部件结构。

公开(公告)号：US09382110B2

公开(公告)日：2016-07-05

申请号：US13818916

申请日：2011-07-29

申请人： Christian Bauer ,  Hans Krueger ,  Juergen Portmann ,  Alois Stelzl

发明人： Christian Bauer ,  Hans Krueger ,  Juergen Portmann ,  Alois Stelzl

IPC分类号： H01L21/00 ,  B81B7/00 ,  B81C1/00

CPC分类号： B81B7/0077 ,  B81B2207/093 ,  B81C1/00269 ,  B81C1/00333 ,  B81C2203/0109 ,  B81C2203/0118 ,  H01L2224/16225 ,  H01L2224/8114 ,  H01L2924/1461 ,  H01L2924/00

摘要： A component includes a substrate, a chip and a frame. The frame is bonded to the substrate and the chip rests on the frame. A sealing layer on parts of the frame and the chip is designed to hermetically seal a volume enclosed by the substrate, the chip and the metal frame.

摘要翻译： 部件包括基板，芯片和框架。 框架结合到基板，芯片搁置在框架上。 框架和芯片的部件上的密封层被设计成密封由衬底，芯片和金属框架包围的体积。

公开(公告)号：US08404516B2

公开(公告)日：2013-03-26

申请号：US12627707

申请日：2009-11-30

申请人： Christian Bauer ,  Gregor Feiertag ,  Hans Krueger ,  Alois Stelzl

发明人： Christian Bauer ,  Gregor Feiertag ,  Hans Krueger ,  Alois Stelzl

IPC分类号： H01L21/00

CPC分类号： B81C1/00269 ,  B81B7/0058 ,  B81C2203/0136 ,  B81C2203/019 ,  H01L24/14 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A carrier substrate has a mounting location with a number of electrical connection pads on a top side and external contacts connected thereto on an underside. A metal frame encloses the connection pads of the mounting location. A MEMS chip has electrical contacts on an underside. The MEMS chip is placed on the mounting location of the carrier substrate in such a way that the MEMS chip is seated with an edge region of its underside on the metal frame. Using a flip-chip process, the electrical contacts of the MEMS chip are connected to the connection pads of the carrier substrate by means of bumps the metal frame is connected to the MEMS chip such that a closed cavity is formed between MEMS chip and carrier substrate.

摘要翻译： 载体基板具有安装位置，在顶侧具有多个电连接焊盘，并且在下侧上与其连接的外部触点。 金属框架包围安装位置的连接垫。 MEMS芯片在下侧具有电触点。 MEMS芯片以这样的方式被放置在载体基板的安装位置上，使得MEMS芯片在金属框架上的下侧的边缘区域被安置。 使用倒装芯片工艺，MEMS芯片的电触点通过凸块连接到载体衬底的连接焊盘，金属框架连接到MEMS芯片，使得在MEMS芯片和载体衬底之间形成闭合腔 。

公开(公告)号：US07544540B2

公开(公告)日：2009-06-09

申请号：US11578854

申请日：2005-04-21

申请人： Christian Bauer ,  Hans Krueger ,  Alois Stelzl

发明人： Christian Bauer ,  Hans Krueger ,  Alois Stelzl

IPC分类号： H01L21/44

CPC分类号： H01L21/44 ,  B81C1/0023 ,  H01L2224/16225 ,  H03H3/0072 ,  H03H9/1057

摘要： A micro-electro-mechanical systems (MEMS) component includes a panel, a chip having an underside containing active component structures, where the chip is mounted on the panel via bumps, a frame structure on the panel and enclosing an installation site of the chip, and a jet-printed structure closing a seam between frame structure and chip. The jet-printed structure has an upper edge that is above a lower edge of the chip.

摘要翻译： 微电子机械系统（MEMS）部件包括面板，具有包含有源部件结构的底部的芯片，其中芯片通过凸块安装在面板上，框架结构在面板上并且包围芯片的安装位置 以及在框架结构和芯片之间封闭接缝的喷墨印刷结构。 喷墨印刷结构具有在芯片的下边缘上方的上边缘。

公开(公告)号：US09647196B2

公开(公告)日：2017-05-09

申请号：US14007074

申请日：2012-03-28

申请人： Christian Bauer ,  Hans Krueger ,  Juergen Portmann ,  Alois Stelzl ,  Wolfgang Pahl ,  Robert Koch

发明人： Christian Bauer ,  Hans Krueger ,  Juergen Portmann ,  Alois Stelzl ,  Wolfgang Pahl ,  Robert Koch

IPC分类号： H01L41/053 ,  B81C1/00 ,  H03H9/10 ,  H01L41/25 ,  H01L23/00

CPC分类号： H01L41/053 ,  B81B2207/095 ,  B81C1/00301 ,  H01L24/11 ,  H01L41/25 ,  H01L2224/1134 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/1461 ,  H03H9/1071 ,  Y10T29/42 ,  H01L2924/00 ,  H01L2924/00014

摘要： A hermetic wafer-level package composed of two piezoelectric wafers, preferably identical in terms of material, and a production method therefor are presented. The electrical and mechanical connection between the two wafers is accomplished with frame structures and pillars, the partial structures of which, distributed between two wafers, are wafer-bonded with the aid of connecting layers.

公开(公告)号：US20140226285A1

公开(公告)日：2014-08-14

申请号：US14239990

申请日：2012-08-10

申请人： Christian Bauer ,  Hans Krueger ,  Juergen Portmann ,  Alois Stelzl ,  Alexander Schmajew

发明人： Christian Bauer ,  Hans Krueger ,  Juergen Portmann ,  Alois Stelzl ,  Alexander Schmajew

IPC分类号： H05K5/06

CPC分类号： H05K5/066 ,  B81B7/0058 ,  B81B2207/093 ,  B81C2203/035 ,  H01L23/10 ,  H01L23/3121 ,  H01L24/16 ,  H01L2224/1134 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

摘要： A component includes a substrate, a chip, and a frame. The frame, the substrate, and the chip enclose a volume. A metal sealing layer is provided which is designed to hermetically seal the volume. The metal sealing layer has a hardened liquid metal or a hardened liquid metal alloy.

摘要翻译： 组件包括衬底，芯片和框架。 框架，基板和芯片包围一个体积。 提供了一种金属密封层，其被设计成气密地密封容积。 金属密封层具有硬化液态金属或硬化液态金属合金。

公开(公告)号：US20140111062A1

公开(公告)日：2014-04-24

申请号：US14007074

申请日：2012-03-28

申请人： Christian Bauer ,  Hans Krueger ,  Juergen Portmann ,  Alois Stelzl ,  Wolfgang Pahl ,  Robert Koch

发明人： Christian Bauer ,  Hans Krueger ,  Juergen Portmann ,  Alois Stelzl ,  Wolfgang Pahl ,  Robert Koch

IPC分类号： H01L41/053 ,  H01L41/25

CPC分类号： H01L41/053 ,  B81B2207/095 ,  B81C1/00301 ,  H01L24/11 ,  H01L41/25 ,  H01L2224/1134 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/1461 ,  H03H9/1071 ,  Y10T29/42 ,  H01L2924/00 ,  H01L2924/00014

摘要： A hermetic wafer-level package composed of two piezoelectric wafers, preferably identical in terms of material, and a production method therefor are presented. The electrical and mechanical connection between the two wafers is accomplished with frame structures and pillars, the partial structures of which, distributed between two wafers, are wafer-bonded with the aid of connecting layers.

摘要翻译： 提出了由两个压电晶片组成的密封晶片级封装，其优选在材料方面是相同的及其制造方法。 两个晶片之间的电气和机械连接通过框架结构和支柱实现，其框架结构和支柱分布在两个晶片之间的部分结构借助于连接层进行晶片结合。