公开(公告)号：US20140158404A1

公开(公告)日：2014-06-12

申请号：US14106220

申请日：2013-12-13

Applicant: Brian Samuel Beaman

Inventor： Brian Samuel Beaman

IPC: H05K1/11

CPC classification number: H05K1/117 ,  H01R12/721 ,  H05K3/403 ,  H05K2201/09145 ,  H05K2201/09909 ,  H05K2201/10863 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A printed circuit board assembly and method of assembly is provided for a printed circuit board having a top and bottom surface with at least one edge portion having a rounded surface extending from the top surface to a point below the top surface and at least one electrical contact pad located on the top surface and extending over the edge portion rounded surface to a point below the top surface.

公开(公告)号：US20090189288A1

公开(公告)日：2009-07-30

申请号：US12357453

申请日：2009-01-22

Applicant: Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Da-Yuan Shih

Inventor： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Da-Yuan Shih

IPC: H01L23/49

CPC classification number: B23K20/007 ,  B23K20/004 ,  B23K2101/40 ,  G01R1/06711 ,  G01R1/0675 ,  G01R1/07307 ,  G01R1/07371 ,  G01R3/00 ,  H01L21/4853 ,  H01L21/4896 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/45 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1134 ,  H01L2224/13016 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/78301 ,  H01L2224/7855 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/49194 ,  Y10T29/4921 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/2075 ,  H01L2924/20754 ,  H01L2924/00012

Abstract: A method is described having the steps of providing a surface having a plurality of wire bondable locations; wire bonding a wire to each of the wire bondable locations using a wire capillary tool; controlling the position of the capillary tool with respect to the substrate; after forming a wire bond of the wire to the wire bondable location moving the capillary tool relative to the surface as the capillary tool is moved away from the surface to form a wire having a predetermined shape.

Abstract translation: 描述了一种方法，其具有提供具有多个可焊接位置的表面的步骤; 使用电线毛细管工具将导线接合到每个可焊接位置; 控制毛细管工具相对于基底的位置; 在将导线形成线接合位置之后，当毛细管工具远离表面移动毛细管工具相对于表面移动时，形成具有预定形状的导线。

公开(公告)号：US07495342B2

公开(公告)日：2009-02-24

申请号：US10736890

申请日：2003-12-16

Applicant: Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Da-Yuan Shih

Inventor： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Da-Yuan Shih

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: B23K20/007 ,  B23K20/004 ,  B23K2101/40 ,  G01R1/06711 ,  G01R1/0675 ,  G01R1/07307 ,  G01R1/07371 ,  G01R3/00 ,  H01L21/4853 ,  H01L21/4896 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/45 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1134 ,  H01L2224/13016 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/78301 ,  H01L2224/7855 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/49194 ,  Y10T29/4921 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/2075 ,  H01L2924/20754 ,  H01L2924/00012

Abstract: A method is described having the steps of providing a surface having a plurality of wire bondable locations, wire bonding a wire to each of the wire bondable locations using a wire capillary tool; controlling the position of the capillary tool with respect to the substrate; after forming a wire bond of the wire to the wire bondable location moving the capillary tool relative to the surface as the capillary tool is moved away from the surface to form a wire having a predetermined shape.

Abstract translation: 描述了一种方法，其具有提供具有多个可焊接位置的表面的步骤，使用线毛细管工具将导线引导到每个可接合线的位置; 控制毛细管工具相对于基底的位置; 在将导线形成线接合位置之后，当毛细管工具远离表面移动毛细管工具相对于表面移动时，形成具有预定形状的导线。

公开(公告)号：US07442049B2

公开(公告)日：2008-10-28

申请号：US11194790

申请日：2005-08-01

Applicant: Gareth Geoffrey Hougham ,  Brian Samuel Beaman ,  Claudius Feger

Inventor： Gareth Geoffrey Hougham ,  Brian Samuel Beaman ,  Claudius Feger

IPC: H01R4/58

CPC classification number: H01R12/7005 ,  H01R12/7076 ,  H01R12/714 ,  H01R13/2414

Abstract: Techniques for providing electrical connections are provided. In one aspect, an electrical connecting device is provided which comprises a plurality of compressible contacts; and a downstop structure surrounding at least a portion of one or more of the contacts, limiting compression of the contacts, and being configured to limit interaction between the contacts. The electrical connecting device may be further configured to have the plurality of compressible contacts have a first coefficient of thermal expansion and the downstop structure have a second coefficient of thermal expansion, the first coefficient of thermal expansion being substantially similar to the second coefficient of thermal expansion.

Abstract translation: 提供了提供电连接的技术。 一方面，提供一种电连接装置，其包括多个可压缩触点; 以及围绕一个或多个触点的至少一部分的下降结构，限制触点的压缩，并且被配置为限制触点之间的相互作用。 电连接装置还可以被配置成具有多个可压缩触点具有第一热膨胀系数，并且下降结构具有第二热膨胀系数，第一热膨胀系数基本上类似于第二热膨胀系数 。

公开(公告)号：US20080164896A1

公开(公告)日：2008-07-10

申请号：US12052823

申请日：2008-03-21

Applicant: Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Yun-Hsin Liao ,  Daniel Peter Morris ,  Da-Yuan Shih

Inventor： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Yun-Hsin Liao ,  Daniel Peter Morris ,  Da-Yuan Shih

IPC: G01R1/073

CPC classification number: G01R1/07307 ,  G01R1/06711 ,  G01R1/0675 ,  G01R1/06772 ,  G01R1/07342 ,  G01R1/07371 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2886 ,  H01L23/49827 ,  H01L23/5384 ,  H01L25/0652 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/78301 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/1627 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/0401

Abstract: The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.

Abstract translation: 本发明涉及具有从支撑表面突出的多个离散绝缘细长电导体的结构，其可用作用于测试电子装置（例如集成电路装置和其它电子部件）的电互连的探针，特别是用于集成 具有刚性互连焊盘的电路装置和具有高密度互连焊盘的多芯片模块封装以及其使用的装置及其制造方法。 通过提供高密度同轴探针的方法制造同轴探针结构。

公开(公告)号：US20080117612A1

公开(公告)日：2008-05-22

申请号：US11929991

申请日：2007-10-30

Applicant: Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih ,  George Frederick Walker

Inventor： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih ,  George Frederick Walker

IPC: H05K7/06 ,  H05K1/02 ,  G01R31/26

CPC classification number: G01R1/0735 ,  G01R1/06744 ,  G01R1/0675 ,  G01R1/07307 ,  G01R1/07378 ,  G01R3/00

Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

公开(公告)号：US20080117611A1

公开(公告)日：2008-05-22

申请号：US11929853

申请日：2007-10-30

Applicant: Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih ,  George Frederick Walker

Inventor： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih ,  George Frederick Walker

IPC: H05K7/06 ,  H05K1/02 ,  G01R31/26

CPC classification number: G01R1/0735 ,  G01R1/06744 ,  G01R1/0675 ,  G01R1/07307 ,  G01R1/07378 ,  G01R3/00

Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

公开(公告)号：US20080112149A1

公开(公告)日：2008-05-15

申请号：US11930016

申请日：2007-10-30

Applicant: Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih ,  George Frederick Walker

Inventor： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih ,  George Frederick Walker

IPC: H05K7/06 ,  H05K1/02 ,  G01R31/26

CPC classification number: G01R1/0735 ,  G01R1/06744 ,  G01R1/0675 ,  G01R1/07307 ,  G01R1/07378 ,  G01R3/00

Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

公开(公告)号：US06526655B2

公开(公告)日：2003-03-04

申请号：US09871536

申请日：2001-05-31

Applicant: Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Da-Yuan Shih

Inventor： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Da-Yuan Shih

IPC: H01R900

CPC classification number: B23K20/007 ,  B23K20/004 ,  B23K2101/40 ,  G01R1/06711 ,  G01R1/0675 ,  G01R1/07307 ,  G01R1/07371 ,  G01R3/00 ,  H01L21/4853 ,  H01L21/4896 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/45 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1134 ,  H01L2224/13016 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/78301 ,  H01L2224/7855 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/49194 ,  Y10T29/4921 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/2075 ,  H01L2924/20754 ,  H01L2924/00012

Abstract: A method is described having the steps of providing a surface having a plurality of wire bondable locations; wire bonding a wire to each of the wire bondable locations using a wire capillary tool; controlling the position of the capillary tool with respect to the substrate; after forming a wire bond of the wire to the wire bondable location moving the capillary tool relative to the surface as the capillary tool is moved away from the surface to form a wire having a predetermined shape.

Abstract translation: 描述了一种方法，其具有提供具有多个可焊接位置的表面的步骤; 使用电线毛细管工具将导线接合到每个可焊接位置; 控制毛细管工具相对于基底的位置; 在将导线形成线接合位置之后，当毛细管工具远离表面移动毛细管工具相对于表面移动时，形成具有预定形状的导线。

公开(公告)号：US06300780B1

公开(公告)日：2001-10-09

申请号：US09088394

申请日：1998-06-01

Applicant: Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih ,  George Frederick Walker

Inventor： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih ,  George Frederick Walker

IPC: G01R3102

CPC classification number: G01R1/07371 ,  G01R1/06711 ,  G01R1/0675 ,  G01R1/07307 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2886 ,  H01L23/49827 ,  H01L23/5384 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0652 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/78301 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L2924/00013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/1627 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3011 ,  Y10S29/029 ,  Y10T29/49004 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49158 ,  Y10T29/49162 ,  Y10T29/49192 ,  Y10T29/53174 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076

Abstract: A high density test probe for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transfer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer. The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

Abstract translation: 用于测试晶圆形式的高密度和高性能集成电路或分立芯片的高密度测试探头。 测试探针由嵌入柔性或高模量弹性体材料的细长电导体的密集阵列形成。 使用陶瓷集成电路芯片封装基板等标准封装基板来提供空间变压器。 电线被连接到空间变压器表面上的接触焊盘阵列。 由多层集成电路芯片封装基板形成的空间传输。 电线与接触位置阵列一样密集。 围绕着向外突出的线的阵列设置模具。 液体弹性体设置在模具中以填充电线之间的空间。 弹性体被固化并且模具被去除，留下布置在弹性体中并与空间变压器电接触的线阵列。 空间变压器可以具有一个引脚阵列，它们在空间变压器的与细长导体所接合的相反的表面上。 这些销插入第二空间变压器（例如印刷电路板）上的插座中以形成探针组件。 或者，插入器电连接器可以设置在第一和第二空间变压器之间。