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公开(公告)号:US20220301926A1
公开(公告)日:2022-09-22
申请号:US17832570
申请日:2022-06-03
Applicant: Applied Materials, Inc.
Inventor: Rutger MEYER TIMMERMAN THIJSSEN , Joseph C. OLSON , Morgan EVANS
IPC: H01L21/768 , H01L21/308 , H01J37/304 , H01J37/317
Abstract: Systems and methods discussed herein can be used to form gratings at various slant angles across a grating material on a single substrate by determining an ion beam angle and changing the angle of an ion beam among and between ion beam angles to form gratings with varying angles and cross-sectional geometries. The substrate can be rotated around a central axis, and one or more process parameters, such as a duty cycle of the ion beam, can be modulated to form a grating with a depth gradient.
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公开(公告)号:US20210333450A1
公开(公告)日:2021-10-28
申请号:US16606575
申请日:2019-04-17
Applicant: Applied Materials, Inc.
Inventor: Rutger MEYER TIMMERMAN THIJSSEN , Morgan EVANS , Joseph C. OLSON
IPC: G02B5/18 , H01J37/305 , H01J37/20 , H01J37/302
Abstract: Embodiments described herein relate to methods of forming gratings with different slant angles on a substrate and forming gratings with different slant angles on successive substrates using angled etch systems. The methods include positioning portions of substrates retained on a platen in a path of an ion beam. The substrates have a grating material disposed thereon. The ion beam is configured to contact the grating material at an ion beam angle θ relative to a surface normal of the substrates and form gratings in the grating material. The substrates are rotated about an axis of the platen resulting in rotation angles ϕ between the ion beam and a surface normal of the gratings. The gratings have slant angles θ′ relative to the surface normal of the substrates. The rotation angles ϕ selected by an equation ϕ=cos−1(tan(θ′)/tan(θ)).
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公开(公告)号:US20240297016A1
公开(公告)日:2024-09-05
申请号:US18662669
申请日:2024-05-13
Applicant: APPLIED Materials, Inc.
Inventor: Anthony RENAU , Joseph C. OLSON , Peter F. KURUNCZI
IPC: H01J37/304 , H01J37/20
CPC classification number: H01J37/304 , H01J37/20 , H01J2237/201
Abstract: A system may include a substrate stage to support a substrate, and a plurality of beam sources. The plurality of beam sources may include an ion beam source, the ion beam source arranged to direct an ion beam to the substrate, and a radical beam source, the radical beam source arranged to direct a radical beam to the substrate. The system may include a controller configured to control the ion beam source and the radical beam source to operate independently of one another, in at least one aspect, wherein the at least one aspect includes beam composition, beam angle of incidence, and relative scanning of a beam source with respect to the substrate.
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公开(公告)号:US20230251430A1
公开(公告)日:2023-08-10
申请号:US18305256
申请日:2023-04-21
Applicant: Applied Materials, Inc.
Inventor: Peter KURUNCZI , Joseph C. OLSON , Morgan EVANS , Rutger MEYER TIMMERMAN THIJSSEN
CPC classification number: G02B6/34 , G03F7/0005 , G03F7/094 , G03F7/0002 , G02B2207/101 , B29C33/3842
Abstract: A method for forming a device structure is disclosed. The method of forming a device structure includes forming a variable-depth structure in a device material layer using a laser ablation. A plurality of device structures is formed in the variable-depth structure to define slanted device structures therein. The variable-depth structure and the slanted device structures are formed using an etch process.
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公开(公告)号:US20150355549A1
公开(公告)日:2015-12-10
申请号:US14301184
申请日:2014-06-10
Applicant: Applied Materials, Inc.
Inventor: Peng XIE , Ludovic GODET , Tristan MA , Joseph C. OLSON , Christopher BENCHER
Abstract: Methods and apparatuses for minimizing line edge/width roughness in lines formed by photolithography are provided. The random diffusion of acid generated by a photoacid generator during a lithography process contributes to line edge/width roughness. Methods disclosed herein apply an electric field and/or a magnetic field during photolithography processes. The field application controls the diffusion of the acids generated by the photoacid generator along the line and spacing direction, preventing the line edge/width roughness that results from random diffusion. Apparatuses for carrying out the aforementioned methods are also disclosed herein.
Abstract translation: 提供了通过光刻形成的线中的线边缘/宽度粗糙度最小化的方法和装置。 在光刻过程中由光致酸发生器产生的酸的随机扩散有助于线边缘/宽度粗糙度。 本文公开的方法在光刻工艺期间施加电场和/或磁场。 场应用控制由光致酸发生器沿线和间隔方向产生的酸的扩散,防止由随机扩散引起的线边缘/宽度粗糙度。 用于实施上述方法的装置也在此公开。
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公开(公告)号:US20220260764A1
公开(公告)日:2022-08-18
申请号:US17737723
申请日:2022-05-05
Applicant: Applied Materials, Inc.
Inventor: Rutger MEYER TIMMERMAN THIJSSEN , Morgan EVANS , Joseph C. OLSON
IPC: G02B5/18 , H01J37/305 , H01J37/20 , H01J37/302
Abstract: Embodiments described herein relate to methods of forming gratings with different slant angles on a substrate and forming gratings with different slant angles on successive substrates using angled etch systems. The methods include positioning portions of substrates retained on a platen in a path of an ion beam. The substrates have a grating material disposed thereon. The ion beam is configured to contact the grating material at an ion beam angle relative to a surface normal of the substrates and form gratings in the grating material. The substrates are rotated about an axis of the platen resulting in rotation angles ϕ between the ion beam and a surface normal of the gratings. The gratings have slant angles relative to the surface normal of the substrates. The rotation angles ϕ selected by an equation ϕ=cos−1 (tan()/tan()).
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公开(公告)号:US20220161363A1
公开(公告)日:2022-05-26
申请号:US17650814
申请日:2022-02-11
Applicant: Applied Materials, Inc.
Inventor: Morgan EVANS , Joseph C. OLSON , Rutger MEYER TIMMERMAN THIJSSEN
Abstract: Embodiments of the present application generally relate to methods for forming a plurality of gratings. The methods generally include depositing a material over one or more protected regions of a waveguide combiner disposed on a substrate, the material having a thickness inhibiting removal of a grating material disposed on the waveguide combiner when an ion beam is directed toward the substrate, and directing the ion beam toward the substrate. The methods disclosed herein allow for formation of a plurality of gratings in one or more unprotected regions, while no gratings are formed in the protected regions.
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公开(公告)号:US20210027985A1
公开(公告)日:2021-01-28
申请号:US17037935
申请日:2020-09-30
Applicant: Applied Materials, Inc.
Inventor: Joseph C. OLSON , Morgan EVANS , Rutger MEYER TIMMERMAN THIJSSEN
IPC: H01J37/305 , H01J37/12 , G02B6/136 , H01J37/147 , H01J37/20
Abstract: Embodiments described herein relate to methods and apparatus for forming gratings having a plurality of fins with different slant angles on a substrate and forming fins with different slant angles on successive substrates using angled etch systems and/or an optical device. The methods include positioning portions of substrates retained on a platen in a path of an ion beam. The substrates have a grating material disposed thereon. The ion beam is configured to contact the grating material at an ion beam angle ϑ relative to a surface normal of the substrates and form gratings in the grating material.
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公开(公告)号:US20230260746A1
公开(公告)日:2023-08-17
申请号:US18139184
申请日:2023-04-25
Applicant: Applied Materials, Inc.
Inventor: Joseph C. OLSON , Morgan EVANS , Rutger MEYER TIMMERMAN THIJSSEN
IPC: H01J37/305 , H01J37/12 , G02B6/136 , H01J37/147 , H01J37/20
CPC classification number: H01J37/3053 , H01J37/12 , G02B6/136 , H01J37/1478 , H01J37/20 , H01J37/3056 , G02B2006/12107
Abstract: Embodiments described herein relate to methods and apparatus for forming gratings having a plurality of fins with different slant angles on a substrate and forming fins with different slant angles on successive substrates using angled etch systems and/or an optical device. The methods include positioning portions of substrates retained on a platen in a path of an ion beam. The substrates have a grating material disposed thereon. The ion beam is configured to contact the grating material at an ion beam angle θ relative to a surface normal of the substrates and form gratings in the grating material.
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公开(公告)号:US20220077794A1
公开(公告)日:2022-03-10
申请号:US17455312
申请日:2021-11-17
Applicant: Applied Materials, Inc.
Inventor: Wayne MCMILLAN , Visweswaren SIVARAMAKRISHNAN , Joseph C. OLSON , Ludovic GODET , Rutger MEYER TIMMERMAN THIJSSEN , Naamah ARGAMAN
Abstract: Embodiments of the present disclosure generally relate to substrate support assemblies for retaining a surface of a substrate having one or more devices disposed on the surface without contacting the one or more devices and deforming the substrate, and a system having the same. In one embodiment, the substrate support assembly includes an edge ring coupled to a body of the substrate support assembly. A controller is coupled to actuated mechanisms of a plurality of pixels coupled to the body of the substrate support assembly such that portions of pixels corresponding to a portion of the surface of a substrate to be retained are positioned to support the portion without contacting one or more devices disposed on the surface of the substrate to be retained on the support surface.
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