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公开(公告)号：US20230213693A1
公开(公告)日：2023-07-06
申请号：US18120520
申请日：2023-03-13
Applicant: Applied Materials, Inc.
Inventor： Yongan XU , Rutger MEYER TIMMERMAN THIJSSEN , Jinrui GUO , Ludovic GODET
CPC classification number: G03F7/70775 , G02B5/1857
Abstract: A method of forming patterned features on a substrate is provided. The method includes positioning a plurality of masks arranged in a mask layout over a substrate. The substrate is positioned in a first plane and the plurality of masks are positioned in a second plane, the plurality of masks in the mask layout have edges that each extend parallel to the first plane and parallel or perpendicular to an alignment feature on the substrate, the substrate includes a plurality of areas configured to be patterned by energy directed through the masks arranged in the mask layout. The method further includes directing energy towards the plurality of areas through the plurality of masks arranged in the mask layout over the substrate to form a plurality of patterned features in each of the plurality of areas.
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公开(公告)号：US20220336270A1
公开(公告)日：2022-10-20
申请号：US17810466
申请日：2022-07-01
Applicant: Applied Materials, Inc.
Inventor： Ludovic GODET , Wayne MCMILLAN , Rutger MEYER TIMMERMAN THIJSSEN , Naamah ARGAMAN , Tapashree ROY , Sage Toko Garrett DOSHAY
IPC: H01L21/768 , H01L21/3213 , H01L21/311 , H01L25/04 , H01L25/16
Abstract: Systems and methods herein are related to the formation of optical devices including stacked optical element layers using silicon wafers, glass, or devices as substrates. The optical elements discussed herein can be fabricated on temporary or permanent substrates. In some examples, the optical devices are fabricated to include transparent substrates or devices including charge-coupled devices (CCD), or complementary metal-oxide semiconductor (CMOS) image sensors, light-emitting diodes (LED), a micro-LED (uLED) display, organic light-emitting diode (OLED) or vertical-cavity surface-emitting laser (VCSELs). The optical elements can have interlayers formed in between optical element layers, where the interlayers can range in thickness from 1 nm to 3 mm.
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公开(公告)号：US20220326611A1
公开(公告)日：2022-10-13
申请号：US17703315
申请日：2022-03-24
Applicant: Applied Materials, Inc.
Inventor： Jing JIANG , Chien-An CHEN , Rutger MEYER TIMMERMAN THIJSSEN
Abstract: Methods of forming optical devices using nanoimprint lithography and etch processes are provided. In one embodiment, a method is provided that includes depositing a first resist layer on a substrate, the substrate having a hardmask disposed thereon, imprinting a first resist portion of the first resist layer with a first single-height stamp, etching the first resist portion of the first resist layer, etching a first hardmask portion of the hardmask corresponding to the first resist portion of the first resist layer, removing the first resist layer and depositing a second resist layer, imprinting a second resist portion of the second resist layer with a second single-height stamp, etching the second resist portion of the second resist layer, and etching a second hardmask portion of the hardmask corresponding to the second resist portion of the second resist layer.
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公开(公告)号：US20220252780A1
公开(公告)日：2022-08-11
申请号：US17730280
申请日：2022-04-27
Applicant: Applied Materials, Inc.
Inventor： Michael Yu-tak YOUNG , Wayne MCMILLAN , Rutger MEYER TIMMERMAN THIJSSEN , Robert Jan VISSER
Abstract: Embodiments described herein relate to methods for fabricating waveguide structures utilizing substrates. The waveguide structures are formed having input coupling regions, waveguide regions, and output coupling regions formed from substrates. The regions are formed by imprinting stamps into resists disposed on hard masks formed on surfaces of the substrates to form positive waveguide patterns. Portions of the positive waveguide patterns and the hard masks formed under the portions are removed. The substrates are masked and etched to form gratings in the input coupling regions and the output coupling regions. Residual portions of the positive waveguide patterns and the hard masks disposed under the residual portions are removed to form waveguide structures having input coupling regions, waveguide regions, and output coupling regions formed from substrates.
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公开(公告)号：US20220128745A1
公开(公告)日：2022-04-28
申请号：US17571039
申请日：2022-01-07
Applicant: Applied Materials, Inc.
Inventor： Yongan XU , Rutger MEYER TIMMERMAN THIJSSEN , Jinrui GUO , Ludovic GODET
Abstract: A method of forming patterned features on a substrate is provided. The method includes positioning a plurality of masks arranged in a mask layout over a substrate. The substrate is positioned in a first plane and the plurality of masks are positioned in a second plane, the plurality of masks in the mask layout have edges that each extend parallel to the first plane and parallel or perpendicular to an alignment feature on the substrate, the substrate includes a plurality of areas configured to be patterned by energy directed through the masks arranged in the mask layout. The method further includes directing energy towards the plurality of areas through the plurality of masks arranged in the mask layout over the substrate to form a plurality of patterned features in each of the plurality of areas.
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Patent Agency Ranking
公开(公告)号：US20220018792A1
公开(公告)日：2022-01-20
申请号：US17360715
申请日：2021-06-28
Applicant: Applied Materials, Inc.
IPC: G01N23/2251 , G01N21/956 , H01J37/28
Abstract: Embodiments of the present disclosure relate to optical devices having one or more metrology features and a method of optical device metrology that provides for metrology tool location recognition with negligible impact to optical performance of the optical devices. The optical device includes one or more target features. The target features described herein provide for metrology tool location recognition with negligible impact to optical performance of the optical devices. In metrology processes, the target features allow for metrology tools to determine one or more locations of the optical device having a macroscale surface area. The target features correspond to one or more structures merged together, one or more structures merged together surrounded by one or more structures that have been removed, or one or more structures that have been removed having one or more profiles defined by adjacent structures to the target features.
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公开(公告)号：US20190318957A1
公开(公告)日：2019-10-17
申请号：US16283560
申请日：2019-02-22
Applicant: Applied Materials, Inc.
Inventor： Ludovic GODET , Wayne MCMILLAN , Rutger MEYER TIMMERMAN THIJSSEN , Naamah ARGAMAN , Tapashree ROY , Sage DOSHAY
IPC: H01L21/768 , H01L21/3213 , H01L25/16 , H01L25/04 , H01L21/311
Abstract: Systems and methods herein are related to the formation of optical devices including stacked optical element layers using silicon wafers, glass, or devices as substrates. The optical elements discussed herein can be fabricated on temporary or permanent substrates. In some examples, the optical devices are fabricated to include transparent substrates or devices including charge-coupled devices (CCD), or complementary metal-oxide semiconductor (CMOS) image sensors, light-emitting diodes (LED), a micro-LED (uLED) display, organic light-emitting diode (OLED) or vertical-cavity surface-emitting laser (VCSELs). The optical elements can have interlayers formed in between optical element layers, where the interlayers can range in thickness from 1 nm to 3 mm.
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公开(公告)号：US20190019828A1
公开(公告)日：2019-01-17
申请号：US15647349
申请日：2017-07-12
Applicant: Applied Materials, Inc.
IPC: H01L27/146
Abstract: Embodiments described herein generally relate to an apparatus for capturing an image and a photoactive device for that apparatus. In one embodiment, the apparatus for capturing an image includes a lens and a photoactive device. The photoactive device is positioned behind the lens. The photoactive device includes a substrate, one or more photodiodes, and a color filter array. The one or more photodiodes are formed in the substrate. The color filter array is positioned over the substrate. The color filter array has one or more color filters. Each color filter has a radiation receiving surface that is shaped to re-direct radiation to a respective photodiode.
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公开(公告)号：US20230260746A1
公开(公告)日：2023-08-17
申请号：US18139184
申请日：2023-04-25
Applicant: Applied Materials, Inc.
Inventor： Joseph C. OLSON , Morgan EVANS , Rutger MEYER TIMMERMAN THIJSSEN
IPC: H01J37/305 , H01J37/12 , G02B6/136 , H01J37/147 , H01J37/20
CPC classification number: H01J37/3053 , H01J37/12 , G02B6/136 , H01J37/1478 , H01J37/20 , H01J37/3056 , G02B2006/12107
Abstract: Embodiments described herein relate to methods and apparatus for forming gratings having a plurality of fins with different slant angles on a substrate and forming fins with different slant angles on successive substrates using angled etch systems and/or an optical device. The methods include positioning portions of substrates retained on a platen in a path of an ion beam. The substrates have a grating material disposed thereon. The ion beam is configured to contact the grating material at an ion beam angle θ relative to a surface normal of the substrates and form gratings in the grating material.
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公开(公告)号：US20230221484A1
公开(公告)日：2023-07-13
申请号：US17647535
申请日：2022-01-10
Applicant: Applied Materials, Inc.
Inventor： Rutger MEYER TIMMERMAN THIJSSEN , Ludovic GODET
IPC: F21V8/00
CPC classification number: G02B6/0065 , G02B6/0016 , G02B6/0036
Abstract: Embodiments described herein provide for methods of forming angled optical device structures. The methods described herein utilize etching a mandrel material with an etch chemistry that is selective to the hardmask, i.e., the mandrel material is etched at a higher rate than the hardmask. Therefore, mandrel trenches are formed in the mandrel material. Device material of the angled optical device structures to be formed is deposited on the plurality of angled mandrels. An angled etch process is performed on portions of the device material such that the angled optical device structures are formed.
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