Abstract:
A method for manufacturing a polarizer apparatus is described. The method includes forming a patterned resist structure having lines with a top surface and two or more side surfaces; depositing a conductive material over the patterned resist structure, wherein the conductive material is provided at the top surface and the two or more side surfaces, and wherein a layer structure is formed; and etching the layer structure to remove the conductive material from the top surface of the lines to form conductive lines of the conductive material at the two or more side surfaces.
Abstract:
Embodiments of the present disclosure relates to LED pixels and methods of fabricating LED pixels. The device includes a backplane, the backplane including a plurality of backplane electrodes, one or more LEDs, each LED having at least one LED electrode coupled a respective backplane electrode of the plurality of backplane electrode, at least two pixels, each pixel including sub-pixel isolation (SI) structures disposed over the LEDs, the SI structures defining wells of sub-pixels of each pixel, where a respective pixel includes three operational sub-pixels, each operational sub-pixel having an operational LED and a color conversion material disposed in each well, a defective LED sub-pixel, the defective LED sub-pixel having a defective LED, and where one of the at least two pixels has two operational sub-pixels having a same color conversion material disposed in each well.
Abstract:
Embodiments described herein generally relate to a DMD. The DMD includes a base and a plurality of mirrors disposed on the base. Each mirror of the plurality of mirrors has a surface facing away from the base, and a structure is disposed on the surface of each mirror. The structure enhances the reflectance of the surface of each mirror, which enhances the efficiency of light manipulation and delivery.
Abstract:
Methods and apparatuses for minimizing line edge/width roughness in lines formed by photolithography are provided. The random diffusion of acid generated by a photoacid generator during a lithography process contributes to line edge/width roughness. Methods disclosed herein apply an electric field, a magnetic field, and/or a standing wave during photolithography processes. The field and/or standing wave application controls the diffusion of the acids generated by the photoacid generator along the line and spacing direction, preventing the line edge/width roughness that results from random diffusion. Apparatuses for carrying out the aforementioned methods are also disclosed herein.
Abstract:
Methods and apparatuses for minimizing line edge/width roughness in lines formed by photolithography are provided. The random diffusion of acid generated by a photoacid generator during a lithography process contributes to line edge/width roughness. Methods disclosed herein apply an electric field, a magnetic field, and/or a standing wave during photolithography processes. The field and/or standing wave application controls the diffusion of the acids generated by the photoacid generator along the line and spacing direction, preventing the line edge/width roughness that results from random diffusion. Apparatuses for carrying out the aforementioned methods are also disclosed herein.
Abstract:
Methods and apparatuses for minimizing line edge/width roughness in lines formed by photolithography are provided. The random diffusion of acid generated by a photoacid generator during a lithography process contributes to line edge/width roughness. Methods disclosed herein apply an electric field and/or a magnetic field during photolithography processes. The field application controls the diffusion of the acids generated by the photoacid generator along the line and spacing direction, preventing the line edge/width roughness that results from random diffusion. Apparatuses for carrying out the aforementioned methods are also disclosed herein.
Abstract:
Multi-beam pattern generators employing yaw correction when writing upon large substrates, and associated methods are disclosed. A multi-beam pattern generator may include a spatial light modulator (SLM) with independently controllable mirrors to reflect light onto a substrate to write a pattern. The pattern may be written in writing cycles where the substrate is moved to writing cycle zone locations. The light is reflected by the SLM onto the substrate by mirrors of the SLM in active positions to write the pattern upon the substrate. By determining a location and yaw of the substrate with respect to the SLM in each writing cycle, some mirrors of the SLM may be digitally controlled to either inactive positions or the active positions to compensate for the yaw of the substrate. In this manner, the pattern written upon the substrate may be precisely written with compensation for yaw.