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    PARTICLE DETECTION FOR SUBSTRATE PROCESSING
    1.
    发明申请
    PARTICLE DETECTION FOR SUBSTRATE PROCESSING 有权

    公开(公告)号：US20210018449A1

    公开(公告)日：2021-01-21

    申请号：US17062231

    申请日：2020-10-02

    Applicant: Applied Materials, Inc.

    Inventor： Todd EGAN ,  Mehdi VAEZ-IRAVANI ,  Samer BANNA ,  Kyle TANTIWONG ,  Gregory KIRK ,  Abraham RAVID ,  Yaoming SHEN

    IPC: G01N21/95 ,  H01L21/67 ,  G01N15/02 ,  G01N15/14 ,  G01N21/94

    Abstract: A system for processing a substrate is provided. The system includes a process chamber including one or more sidewalls enclosing a processing region; and a substrate support. The system further includes a passageway connected to the process chamber; and a first particle detector disposed at a first location along the passageway. The first particle detector includes an energy source configured to emit a first beam; one or more optical devices configured to direct the first beam along one or more paths, where the one or more paths extend through at least a portion of the passageway. The first particle detector further includes a first energy detector disposed at a location other than on the one or more paths. The system further includes a controller configured to communicate with the first particle detector, wherein the controller is configured to identify a fault based on signals received from the first particle detector.

    METHOD AND APPARATUS FOR REDUCING RADIATION INDUCED CHANGE IN SEMICONDUCTOR STRUCTURES
    3.
    发明申请
    METHOD AND APPARATUS FOR REDUCING RADIATION INDUCED CHANGE IN SEMICONDUCTOR STRUCTURES 有权
    减少半导体结构辐射诱导变化的方法和装置

    公开(公告)号：US20160276227A1

    公开(公告)日：2016-09-22

    申请号：US15075094

    申请日：2016-03-18

    Applicant: Applied Materials, Inc.

    Inventor： Gary E. DICKERSON ,  Seng (victor) Keong LIM ,  Samer BANNA ,  Gregory KIRK ,  Mehdi VAEZ-IRAVANI

    IPC: H01L21/66 ,  H01L21/683 ,  H01L21/67 ,  H01L21/324 ,  H01L21/027

    CPC classification number: H01L21/67248 ,  H01L21/0273 ,  H01L21/324 ,  H01L21/67103 ,  H01L21/67115 ,  H01L21/67253 ,  H01L21/6831 ,  H01L22/12

    Abstract: Embodiments of the present disclosure relate to an apparatus and a method for reducing the adverse effects of exposing portions of an integrated circuit (IC) device to various forms of radiation during one or more operations found within the IC formation processing sequence by controlling the environment surrounding and temperature of an IC device during one or more parts of the IC formation processing sequence. The provided energy may include the delivery of radiation to a surface of a formed or a partially formed IC device during a deposition, etching, inspection or post-processing process operation. In some embodiments of the disclosure, the temperature of the substrate on which the IC device is formed is controlled to a temperature that is below room temperature (e.g.,

    Abstract translation: 本公开的实施例涉及一种用于在通过控制周围环境的IC形成处理序列期间发现的一个或多个操作期间减少将集成电路（IC）装置的部分暴露于各种形式的辐射的不良影响的装置和方法 以及在IC形成处理序列的一个或多个部分期间的IC器件的温度。 提供的能量可以包括在沉积，蚀刻，检查或后处理过程操作期间将辐射传送到形成的或部分形成的IC器件的表面。 在本公开的一些实施例中，将IC器件形成的衬底的温度控制在IC形成处理序列的一个或多个部分期间低于室温（例如，<20℃）的温度 。

    METHOD AND APPARATUS FOR DETECTING DEFECTS IN A PACKAGE
    4.
    发明申请
    METHOD AND APPARATUS FOR DETECTING DEFECTS IN A PACKAGE 有权

    公开(公告)号：US20250076216A1

    公开(公告)日：2025-03-06

    申请号：US18799653

    申请日：2024-08-09

    Applicant: Applied Materials, Inc.

    Inventor： Venkatakaushik VOLETI ,  Yun-Ching CHANG ,  Dan XIE ,  Gregory KIRK ,  Mehdi VAEZ-IRAVANI

    IPC: G01N21/95 ,  G01N21/47 ,  H01L21/66 ,  H01L23/00

    Abstract: An optical inspection system for pre-bonding inspection includes a stage having a surface on which a sample to be inspected is placed, the surface of the sample having at least parts with a two dimensional (2D) periodic pattern which may include defects, an optical head including optics, a dark-field illuminator configured to illuminate the surface of the sample at an first angle, wherein the first angle is an oblique angle, a bright-field illuminator configured to illuminate the surface at a second angle, a dark-field collection path, a bright-field collection path, and a sensor configured to detect light transmitted from the dark-field illuminator, scattered at the surface of the sample, collected by the optical head, and relayed through the dark-field collection path, and light transmitted from the bright-field illuminator, reflected at the surface of the sample, and relayed through the bright-field collection path.

    Subsurface alignment metrology system for packaging applications
    5.
    发明公开
    Subsurface alignment metrology system for packaging applications 审中-公开

    公开(公告)号：US20240170317A1

    公开(公告)日：2024-05-23

    申请号：US17993096

    申请日：2022-11-23

    Applicant: Applied Materials, Inc.

    Inventor： Venkatakaushik VOLETI ,  Keith Buckley WELLS ,  Mehdi VAEZ-IRAVANI

    IPC: H01L21/68

    CPC classification number: H01L21/681 ,  H01L24/80 ,  H01L2224/8013

    Abstract: An apparatus for detecting metrology data in semiconductor packaging processes using fast focus and acquisition techniques to determine alignment metrology data for hybrid bonding. In some embodiments, the apparatus may include a source configured to illuminate a focal point with a wavelength selected from wavelengths greater than 1100 nm, an optical lens that forms an illumination beam when illuminated by the source, an acousto-optic scanner that moves the illumination beam back and forth in a scanning pattern, a splitter to allow the illumination beam to be directed at a metrology sampling location while allowing a reflection beam caused by the illumination beam to pass through the splitter to a detector, a set of optics configured to focus the illumination beam at one or more focal points in a Z direction to obtain subsurface images, and a substrate platform configured to hold a substrate and to move the substrate during scanning.

    METHOD AND APPARATUS FOR DETECTION OF PARTICLE SIZE IN A FLUID
    6.
    发明申请
    METHOD AND APPARATUS FOR DETECTION OF PARTICLE SIZE IN A FLUID 有权

    公开(公告)号：US20230060205A1

    公开(公告)日：2023-03-02

    申请号：US17888277

    申请日：2022-08-15

    Applicant: Applied Materials, Inc.

    Inventor： Mehdi VAEZ-IRAVANI ,  Todd EGAN ,  Guoheng ZHAO

    IPC: G01N15/02 ,  G01N15/14

    Abstract: Examples disclosed herein generally relate to systems and methods for detecting the size of a particle in a fluid. In one example, a system for imaging a particle includes a first imaging device. The first imaging device includes a lens and a digital detector. The system further includes a laser source. He laser source is configured to emit a first laser beam and a second laser beam. The digital detector is configured to accumulate a metric of an intensity of an accumulated light that passes through the lens. The accumulated light is scattered from the particle. The accumulated light includes light from the first laser beam and the second laser beam.

    Large Format Continuous Imaging System
    9.
    发明申请
    Large Format Continuous Imaging System 有权

    公开(公告)号：US20250062145A1

    公开(公告)日：2025-02-20

    申请号：US18234591

    申请日：2023-08-16

    Applicant: Applied Materials, Inc.

    Inventor： Venkatakaushik VOLETI ,  Mehdi VAEZ-IRAVANI

    IPC: H01L21/67 ,  G06T7/00 ,  G06T7/73

    Abstract: A scanning inspection apparatus detects anomalies on surfaces of objects such as substrates, substrates with bonded chiplets, and carriers with singulated chiplets and the like. In some embodiments, the inspection apparatus includes a time delay integrated (TDI) linear sensor with an optical input and a data output where more than one optical assembly is positioned adjacent to each other with an optical output focused on a different segment of the TDI linear sensor and with an optical input positioned to receive a portion of a surface under examination. The apparatus may further include a platform with an upper surface for supporting an object with the surface under examination and with a motion assembly to move the platform and with a controller in communication with the motion assembly to move the platform in relation to the optical input of the optical assembly.

    IN-SITU, REAL-TIME DETECTION OF PARTICULATE DEFECTS IN A FLUID
    10.
    发明申请
    IN-SITU, REAL-TIME DETECTION OF PARTICULATE DEFECTS IN A FLUID 有权

    公开(公告)号：US20210181084A1

    公开(公告)日：2021-06-17

    申请号：US16716218

    申请日：2019-12-16

    Applicant: Applied Materials, Inc.

    Inventor： Mehdi VAEZ-IRAVANI ,  Sankesha BHOYAR ,  Rachit SHARMA ,  Guoheng ZHAO

    IPC: G01N15/14

    Abstract: Examples disclosed herein generally relate to an apparatus and method for detecting particles in a fluid. A system for imaging a particle includes an imaging device. The imaging device has a lens and a detector. A laser source is configured to emit a laser beam. The detector is configured to accumulate an intensity of an accumulated light that passes through the lens. The accumulated light is scattered by the particle. The particle passes through the laser beam over a given period.

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