公开(公告)号：US12004337B2

公开(公告)日：2024-06-04

申请号：US17985065

申请日：2022-11-10

Applicant: Applied Materials, Inc.

Inventor： Gayatri Natu ,  Geetika Bajaj ,  Prerna Goradia ,  Darshan Thakare ,  David Fenwick ,  XiaoMing He ,  Sanni Seppaelae ,  Jennifer Sun ,  Rajkumar Thanu ,  Jeff Hudgens ,  Karuppasamy Muthukamatchy ,  Arun Dhayalan

IPC: H05K9/00 ,  H01J37/20 ,  H01J37/32 ,  H01L21/687 ,  H05F1/02

CPC classification number: H05K9/0064 ,  H01J37/20 ,  H01J37/32477 ,  H01J37/32495 ,  H01L21/68707 ,  H01L21/68757 ,  H05F1/02

Abstract: Disclosed in some embodiments is a chamber component (such as an end effector body) coated with an ultrathin electrically-dissipative material to provide a dissipative path from the coating to the ground. The coating may be deposited via a chemical precursor deposition to provide a uniform, conformal, and porosity free coating in a cost effective manner. In an embodiment wherein the chamber component comprises an end effector body, the end effector body may further comprise replaceable contact pads for supporting a substrate and the contact surface of the contact pads head may also be coated with an electrically-dissipative material.

公开(公告)号：US20220037126A1

公开(公告)日：2022-02-03

申请号：US16983164

申请日：2020-08-03

Applicant: Applied Materials, Inc.

Inventor： Jennifer Y. Sun ,  Ren-Guan Duan ,  Gayatri Natu ,  Tae Won Kim ,  Jiyong Huang ,  Nitin Deepak ,  Paul Brillhart ,  Lin Zhang ,  Yikai Chen ,  Sanni Sinikka Seppälä ,  Ganesh Balasubramanian ,  JuanCarlos Rocha ,  Shankar Venkataraman ,  Katherine Elizabeth Woo

IPC: H01J37/32 ,  C23C16/30 ,  C23C16/455 ,  C23C16/44

Abstract: Embodiments of the disclosure relate to articles, coated chamber components and methods of coating chamber components with a protective coating that includes at least one metal fluoride having a formula selected from the group consisting of M1xFw, M1xM2yFw and M1xM2yM3zFw, where at least one of M1, M2, or M3 is magnesium or lanthanum. The protective coating can be deposited by atomic layer deposition, chemical vapor deposition, electron beam ion assisted deposition, or physical vapor deposition.

公开(公告)号：US11547030B2

公开(公告)日：2023-01-03

申请号：US16890346

申请日：2020-06-02

Applicant: APPLIED MATERIALS, INC.

Inventor： Gayatri Natu ,  Geetika Bajaj ,  Prerna Goradia ,  Darshan Thakare ,  David Fenwick ,  XiaoMing He ,  Sanni Seppaelae ,  Jennifer Sun ,  Rajkumar Thanu ,  Jeff Hudgens ,  Karuppasamy Muthukamatchy ,  Arun Dhayalan

IPC: H05K9/00 ,  H01J37/32 ,  H01J37/20 ,  B25J18/00 ,  H01L21/687 ,  H05F1/02 ,  B65G49/07

Abstract: Disclosed in some embodiments is a chamber component (such as an end effector body) coated with an ultrathin electrically-dissipative material to provide a dissipative path from the coating to the ground. The coating may be deposited via a chemical precursor deposition to provide a uniform, conformal, and porosity free coating in a cost effective manner. In an embodiment wherein the chamber component comprises an end effector body, the end effector body may further comprise replaceable contact pads for supporting a substrate and the contact surface of the contact pads head may also be coated with an electrically-dissipative material.

公开(公告)号：US20220351960A1

公开(公告)日：2022-11-03

申请号：US17347789

申请日：2021-06-15

Applicant: Applied Materials, Inc.

Inventor： Lisa J. Enman ,  Mark Saly ,  Sanni Seppaelae ,  Gayatri Natu

IPC: H01L21/02 ,  C23C16/455 ,  C23C16/30 ,  C23C16/56

Abstract: Methods and precursors for depositing metal fluoride films on a substrate surface are described. The method includes exposing the substrate surface to a metal precursor and a fluoride precursor. The fluoride precursor is volatile at a temperature in a range of from 20° C. to 200° C. The metal precursor reacts with the fluoride precursor to form a non-volatile metal fluoride film.

公开(公告)号：US20250027195A1

公开(公告)日：2025-01-23

申请号：US18223199

申请日：2023-07-18

Applicant: Applied Materials, Inc.

Inventor： Yogesh Tomar ,  Nikshep Patil ,  Kirubanandan Shanmugam Naina ,  Hanish Kumar Panavalappil Kumarankutty ,  Gayatri Natu ,  Mahesh Chelvaraj Arcot ,  Senthil Kumar Nattamai Subramanian ,  Hari Venkatesh Rajendran ,  Michael Rice ,  Christopher Laurent Beaudry

IPC: C23C16/455 ,  C23C16/44 ,  C23C16/52

Abstract: A method includes performing an atomic layer deposition (ALD) process with respect to a plurality of target elements to coat interiors of the plurality of target elements with a protective coating. Performing the ALD process includes alternating delivery of a first precursor inside the plurality of target elements for a first duration to form an adsorption layer on the interiors of the plurality of target elements, alternating purging of the first precursor from the plurality of target elements for a second duration, and alternating delivery of a second precursor inside the plurality of target elements for a third duration to cause the second precursor to react with the adsorption layer and form a target layer on the interiors of the plurality of target elements.

公开(公告)号：US11702744B2

公开(公告)日：2023-07-18

申请号：US17673345

申请日：2022-02-16

Applicant: Applied Materials, Inc.

Inventor： Nitin Deepak ,  Gayatri Natu ,  Albert Barrett Hicks, III ,  Prerna Sonthalia Goradia ,  Jennifer Y. Sun

IPC: C23C16/455 ,  C23C16/30

CPC classification number: C23C16/45553 ,  C23C16/30

Abstract: Methods of forming a metal oxyfluoride films are provided. A substrate is placed in an atomic layer deposition (ALD) chamber having a processing region. Flows of zirconium-containing gas, a zirconium precursor gas, for example, Tris(dimethylamino)cyclopentadienyl zirconium, an oxygen-containing gas, a fluorine containing gas, and an yttrium precursor, for example, tris(butylcyclopentadienyl)yttrium gas are delivered to the processing region, where a metal oxyfluoride film such as an yttrium zirconium oxyfluoride film, is formed.

公开(公告)号：US20210100141A1

公开(公告)日：2021-04-01

申请号：US16890336

申请日：2020-06-02

Applicant: APPLIED MATERIALS, INC.

Inventor： Gayatri Natu ,  Geetika Bajaj ,  Prerna Goradia ,  Darshan Thakare ,  David Fenwick ,  XiaoMing He ,  Sanni Seppaelae ,  Jennifer Sun ,  Rajkumar Thanu ,  Jeff Hudgens ,  Karuppasamy Muthukamatchy ,  Arun Dhayalan

IPC: H05K9/00 ,  H01J37/20 ,  H01J37/32

Abstract: Disclosed in some embodiments is a chamber component (such as an end effector body) coated with an ultrathin electrically-dissipative material to provide a dissipative path from the coating to the ground. The coating may be deposited via a chemical precursor deposition to provide a uniform, conformal, and porosity free coating in a cost effective manner. In an embodiment wherein the chamber component comprises an end effector body, the end effector body may further comprise replaceable contact pads for supporting a substrate and the contact surface of the contact pads head may also be coated with an electrically-dissipative material.

公开(公告)号：US20240284650A1

公开(公告)日：2024-08-22

申请号：US18648278

申请日：2024-04-26

Applicant: APPLIED MATERIALS, INC.

Inventor： Gayatri Natu ,  Geetika Bajaj ,  Prerna Goradia ,  Darshan Thakare ,  David Fenwick ,  XiaoMing He ,  Sanni Seppaelae ,  Jennifer Sun ,  Rajkumar Thanu ,  Jeff Hudgens ,  Karuppasamy Muthukamatchy ,  Arun Dhayalan

IPC: H05K9/00 ,  H01J37/20 ,  H01J37/32 ,  H01L21/687 ,  H05F1/02

CPC classification number: H05K9/0064 ,  H01J37/20 ,  H01J37/32477 ,  H01J37/32495 ,  H01L21/68707 ,  H01L21/68757 ,  H05F1/02

Abstract: A coated chamber component comprises a chamber component and a coating deposited on a surface of the chamber component, the coating comprising an electrically-dissipative material. The electrically-dissipative material is to provide a dissipative path from the coating to a ground. The coating is uniform, conformal, and has a thickness ranging from about 10 nm to about 900 nm.

公开(公告)号：US20230077895A1

公开(公告)日：2023-03-16

申请号：US17985065

申请日：2022-11-10

Applicant: Applied Materials, Inc.

Inventor： Gayatri Natu ,  Geetika Bajaj ,  Prerna Goradia ,  Darshan Thakare ,  David Fenwick ,  XiaoMing He ,  Sanni Seppaelae ,  Jennifer Sun ,  Rajkumar Thanu ,  Jeff Hudgens ,  Karuppasamy Muthukamatchy ,  Arun Dhayalan

IPC: H05K9/00 ,  H01J37/32 ,  H01J37/20 ,  B25J18/00 ,  H01L21/687 ,  H05F1/02 ,  B65G49/07

Abstract: Disclosed in some embodiments is a chamber component (such as an end effector body) coated with an ultrathin electrically-dissipative material to provide a dissipative path from the coating to the ground. The coating may be deposited via a chemical precursor deposition to provide a uniform, conformal, and porosity free coating in a cost effective manner. In an embodiment wherein the chamber component comprises an end effector body, the end effector body may further comprise replaceable contact pads for supporting a substrate and the contact surface of the contact pads head may also be coated with an electrically-dissipative material.

公开(公告)号：US11540432B2

公开(公告)日：2022-12-27

申请号：US16890336

申请日：2020-06-02

Applicant: APPLIED MATERIALS, INC.

Inventor： Gayatri Natu ,  Geetika Bajaj ,  Prerna Goradia ,  Darshan Thakare ,  David Fenwick ,  XiaoMing He ,  Sanni Seppaelae ,  Jennifer Sun ,  Rajkumar Thanu ,  Jeff Hudgens ,  Karuppasamy Muthukamatchy ,  Arun Dhayalan

IPC: H05K9/00 ,  H01J37/32 ,  H01J37/20 ,  B25J1/00 ,  H01L21/687 ,  H05F1/02 ,  B65G49/07

Abstract: Disclosed in some embodiments is a chamber component (such as an end effector body) coated with an ultrathin electrically-dissipative material to provide a dissipative path from the coating to the ground. The coating may be deposited via a chemical precursor deposition to provide a uniform, conformal, and porosity free coating in a cost effective manner. In an embodiment wherein the chamber component comprises an end effector body, the end effector body may further comprise replaceable contact pads for supporting a substrate and the contact surface of the contact pads head may also be coated with an electrically-dissipative material.