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公开(公告)号：US09608549B2
公开(公告)日：2017-03-28
申请号：US13630136
申请日：2012-09-28
Applicant: APPLIED MATERIALS, INC.
Inventor： Vijay D. Parkhe , Steven V. Sansoni , Cheng-Hsiung Matthew Tsai
IPC: H01L21/683 , H02N13/00
CPC classification number: H02N13/00 , H01L21/6833
Abstract: Embodiments of electrostatic chucks are provided herein. In some embodiments, an electrostatic chuck for retaining a substrate includes a base plate, a ceramic plate, supported by the base plate, having a substrate supporting surface, a first plurality of electrodes disposed within the ceramic plate having a first polarity, and a second plurality of electrodes disposed within the ceramic plate having a second polarity opposite from the first polarity, wherein the first and second plurality of electrodes are independently controllable to provide a desired chucking power and frequency.
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公开(公告)号：US10593521B2
公开(公告)日：2020-03-17
申请号：US13798028
申请日：2013-03-12
Applicant: APPLIED MATERIALS, INC.
Inventor： Larry Frazier , Cheng-Hsiung Matthew Tsai , John C. Forster , Mei Po Yeung , Michael S. Jackson
IPC: H01L21/67 , H01L21/687 , H01J37/32
Abstract: Methods and apparatus for processing substrates are disclosed herein. In some embodiments, a substrate support to support a substrate in a processing chamber includes a dielectric insulator plate; a conductive plate supported on the dielectric insulator plate, the conductive plate comprising a top surface and a bottom surface defining a thickness between the top surface and the bottom surface, wherein an edge portion of the conductive plate tapers in a radially outward direction; and a dielectric plate comprising a substrate support surface disposed upon the top surface of the conductor plate.
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公开(公告)号：US11939666B2
公开(公告)日：2024-03-26
申请号：US16889017
申请日：2020-06-01
Applicant: APPLIED MATERIALS, INC.
Inventor： Xiangjin Xie , Carmen Leal Cervantes , Feng Chen , Lu Chen , Wenjing Xu , Aravind Kamath , Cheng-Hsiung Matthew Tsai , Tae Hong Ha , Alexander Jansen , Xianmin Tang
CPC classification number: C23C14/564 , H01J37/32082 , H01L21/02043 , H01L21/67017 , H01J2237/022
Abstract: Methods and apparatus for processing a substrate include cleaning and self-assembly monolayer (SAM) formation for subsequent reverse selective atomic layer deposition. An apparatus may include a process chamber with a processing volume and a substrate support including a pedestal, a remote plasma source fluidly coupled to the process chamber and configured to produce radicals or ionized gas mixture with radicals that flow into the processing volume to remove residue or oxides from a surface of the substrate, a first gas delivery system with a first ampoule configured to provide at least one first chemical into the processing volume to produce a SAM on the surface of the substrate, a heating system located in the pedestal and configured to heat a substrate by flowing gas on a backside of the substrate, and a vacuum system fluidly coupled to the process chamber and configured to control heating of the substrate.
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公开(公告)号：USD960216S1
公开(公告)日：2022-08-09
申请号：US29830409
申请日：2022-03-11
Applicant: Applied Materials, Inc.
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公开(公告)号：USD947914S1
公开(公告)日：2022-04-05
申请号：US29759527
申请日：2020-11-23
Applicant: Applied Materials, Inc.
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Patent Agency Ranking
公开(公告)号：US11887878B2
公开(公告)日：2024-01-30
申请号：US16899750
申请日：2020-06-12
Applicant: APPLIED MATERIALS, INC.
Inventor： Shreesha Yogish Rao , Mukund Sundararajan , Cheng-Hsiung Matthew Tsai , Manjunatha P. Koppa , Steven V. Sansoni
IPC: H01L21/683 , H01J37/32
CPC classification number: H01L21/6833 , H01J37/32724 , H01J2237/002 , H01J2237/334
Abstract: Embodiments of a substrate support are provided herein. In some embodiments, a substrate support for use in a substrate processing chamber includes a lower assembly having a base plate assembly, wherein the base plate assembly includes a plurality of electrical feedthroughs disposed about a central protrusion; a ceramic puck disposed on the lower assembly and removeably coupled to the base plate assembly, wherein the ceramic puck has an electrode disposed therein that is electrically coupled to first pair of electrical feedthroughs of the plurality of electrical feedthroughs; and a flexible connector having a spiral portion disposed between the ceramic puck and each of the plurality of electrical feedthroughs to allow for differences in thermal expansion of the ceramic puck and the base plate assembly.
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公开(公告)号：US09147558B2
公开(公告)日：2015-09-29
申请号：US13742692
申请日：2013-01-16
Applicant: APPLIED MATERIALS, INC.
Inventor： Bonnie T. Chia , Song-Moon Suh , Cheng-Hsiung Matthew Tsai , Robert Dinsmore , Glen T. Mori
CPC classification number: H01J37/32715 , C23C14/564 , H01J37/32477 , H01J37/32853 , H01J37/3405 , H01J37/3417 , H01J37/3423 , H01J37/3447
Abstract: Shutter disks for use in process chambers are provided herein. In some embodiments, a shutter disk for use in a process chamber may include a body having an outer perimeter, a top surface of the body, wherein the top surface includes a central portion having a substantially horizontal planar surface, and at least one angled structure disposed radially outward of the central portion, each of the at least one angled structure having a top portion and an angled surface disposed at a downward angle in a radially outward direction from the top portion toward the outer perimeter, and a bottom surface of the body.
Abstract translation: 本文提供了用于处理室的快门盘。 在一些实施例中，用于处理室的快门盘可以包括具有外周边，主体顶表面的主体，其中顶表面包括具有基本上水平的平面表面的中心部分，以及至少一个倾斜结构 设置在所述中心部分的径向外侧，所述至少一个倾斜结构中的每一个具有顶部和从所述顶部朝向所述外周边沿径向向外的方向以向下的角度设置的成角度的表面，以及所述主体的底表面 。
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公开(公告)号：US08971009B2
公开(公告)日：2015-03-03
申请号：US13630196
申请日：2012-09-28
Applicant: Applied Materials, Inc.
Inventor： Vijay D. Parkhe , Steven V. Sansoni , Cheng-Hsiung Matthew Tsai
CPC classification number: F28F3/00 , B23Q3/15 , B23Q3/1543 , H01L21/67109 , H01L21/683 , H01L21/6831 , H02N13/00
Abstract: Embodiments of an apparatus for controlling a temperature of an electrostatic chuck in a process chamber are provided herein. In some embodiments, the apparatus includes an electrostatic chuck disposed in a process chamber, the electrostatic chuck including a ceramic plate having a substrate supporting surface, and a cooling assembly including a plurality of cooling plates disposed below the electrostatic chuck to adjust the cooling capacity of the electrostatic chuck. In some embodiments, the plurality of cooling plates includes an inner cooling plate configured to control a temperature of a center portion of the electrostatic chuck, and an outer cooling plate configured to control a temperature of an outer portion of the electrostatic chuck. In some embodiments, the plurality of cooling plates includes an upper cooling plate that contacts a bottom surface of the electrostatic chuck, and a lower cooling plate which contacts a bottom surface of the upper cooling plate.
Abstract translation: 本文提供了用于控制处理室中的静电卡盘的温度的装置的实施例。 在一些实施例中，该设备包括设置在处理室中的静电吸盘，静电吸盘包括具有基板支撑表面的陶瓷板，以及包括设置在静电卡盘下方的多个冷却板的冷却组件，以调节冷却能力 静电吸盘。 在一些实施例中，多个冷却板包括构造成控制静电卡盘的中心部分的温度的内部冷却板和被配置为控制静电卡盘的外部部分的温度的外部冷却板。 在一些实施例中，多个冷却板包括接触静电卡盘的底表面的上部冷却板和接触上部冷却板底面的下部冷却板。
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9.发明授权公开(公告)号：US12014906B2
公开(公告)日：2024-06-18
申请号：US17530809
申请日：2021-11-19
Applicant: Applied Materials, Inc.
Inventor： William R. Johanson , Keith A. Miller , Cheng-Hsiung Matthew Tsai , John C. Forster , Mukund Sundararajan
CPC classification number: H01J37/32724 , H01J37/32082 , H01J37/34 , H01J2237/002 , H01J2237/2007 , H01J2237/332
Abstract: Embodiments of substrate supports for use in substrate processing chambers are provided herein. In some embodiments, a substrate support includes: an upper assembly having a base plate assembly coupled to a lower surface of a cooling plate, wherein the base plate assembly includes a plurality of electrical feedthroughs, and wherein the cooling plate includes a plurality of openings aligned with the plurality of electrical feedthroughs; an electrostatic chuck disposed on the upper assembly and removably coupled to the cooling plate, wherein the electrostatic chuck has a chucking electrode disposed therein that is electrically coupled to a first pair of electrical feedthroughs of the plurality of electrical feedthroughs; and an inner tube coupled to the cooling plate and configured to provide an RF delivery path to the electrostatic chuck.
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公开(公告)号：US20230307211A1
公开(公告)日：2023-09-28
申请号：US17704840
申请日：2022-03-25
Applicant: Applied Materials, Inc.
Inventor： Aravind Miyar Kamath , Cheng-Hsiung Matthew Tsai , Manjunatha Koppa
CPC classification number: H01J37/32009 , H01J37/20 , H01J2237/3321 , H01J2237/20
Abstract: Process kits for processing chambers and processing chambers having a lower shield and lower shield ring are described. The lower shield has a ring-shaped body with an inner wall and an outer wall, a top wall and a bottom wall with an outer ledge wall extends outwardly from a lower portion of the outer wall to an outer ledge outer wall. The lower shield ring has a ramped lower inner wall with a top face spaced a distance from the bottom face of the upper inner wall so that the distance decreases from the lower inner wall to an inside surface of the outer wall. At least one upper opening extends through the top portion of the lower shield ring and at least one opening extends through the lower portion of the lower shield ring. Upper shields configured to cooperatively interact with the lower shield and lower shield ring are also described.
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