公开(公告)号：US12097665B2

公开(公告)日：2024-09-24

申请号：US17571002

申请日：2022-01-07

Applicant: Applied Materials, Inc.

Inventor： Vijay D. Parkhe

IPC: B29C65/48 ,  B29C65/00

CPC classification number: B29C65/4835 ,  B29C66/727

Abstract: Embodiments described herein generally relate to porous plugs having sealing layers for use in substrate support pedestals and methods for forming the same. In one or more embodiments, the sealing layer can be formed in-situ by applying a fluoroelastomer composition to at least one of the porous plug and the walls of a cavity of an electrostatic chuck. The fluoroelastomer composition can be cured in-situ to form the sealing layer between the porous plug and the wall of the cavity. The porous plug is positioned within the cavity to control the flow of gas through a gas flow passage. The sealing layer is positioned adjacent to the porous plug and is capable of forming one or more of a radial seal between the porous plug and the wall of the cavity and an axial seal between the porous plug and a cooling base.

公开(公告)号：US12009244B2

公开(公告)日：2024-06-11

申请号：US16741330

申请日：2020-01-13

Applicant: Applied Materials, Inc.

Inventor： Vijay D. Parkhe ,  Steven E. Babayan ,  Konstantin Makhratchev ,  Zhiqiang Guo ,  Phillip R. Sommer ,  Dan A. Marohl

IPC: H01L21/683 ,  H01L21/67 ,  H05B1/02 ,  H05B3/02

CPC classification number: H01L21/6833 ,  H01L21/67103 ,  H01L21/67248 ,  H01L21/6831 ,  H05B1/023 ,  H05B1/0233 ,  H05B3/02

Abstract: Implementations described herein provide a substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a heating assembly. The substrate support assembly comprises a body having a substrate support surface and a lower surface, one or more main resistive heaters disposed in the body, a plurality of spatially tunable heaters disposed in the body, and a spatially tunable heater controller coupled to the plurality of spatially tunable heaters, the spatially tunable heater controller configured to independently control an output one of the plurality of spatially tunable heaters relative to another of the plurality of spatially tunable heaters.

公开(公告)号：US20240055289A1

公开(公告)日：2024-02-15

申请号：US17885367

申请日：2022-08-10

Applicant: Applied Materials, Inc.

Inventor： Vijay D. Parkhe

IPC: H01L21/683 ,  H01J37/32 ,  C23C16/458

CPC classification number: H01L21/6833 ,  H01J37/32724 ,  C23C16/4583

Abstract: Exemplary substrate support assemblies may include an electrostatic chuck body. The body may include a support plate defining a substrate support surface. The body may include a base plate coupled with the support plate. A bottom surface of the base plate may define an annular recess. The body may include a cooling plate coupled with the base plate. The assemblies may include a support stem coupled with the body. The assemblies may include a heater embedded within the body. The assemblies may include one or more electrodes embedded within the body. The assemblies may include an annular plate disposed within the annular recess. The annular plate may have a thermal conductivity of less than about 20 W/mK. The assemblies may include a vacuum sealing element disposed between the annular plate and the cooling plate. The assemblies may include a thermal gasket disposed radially inward of the vacuum sealing element.

公开(公告)号：US11776794B2

公开(公告)日：2023-10-03

申请号：US17317816

申请日：2021-05-11

Applicant: Applied Materials, Inc.

Inventor： Vijay D. Parkhe

IPC: H01J37/32 ,  H01L21/683 ,  H01L21/67

CPC classification number: H01J37/32724 ,  H01L21/6833 ,  H01J2237/2007 ,  H01J2237/334 ,  H01L21/67069

Abstract: Embodiments of the present disclosure generally relate to an electrostatic chuck assembly suitable for use in cryogenic applications. In one or more embodiments, an electrostatic chuck assembly is provided and includes an electrostatic chuck having a substrate supporting surface opposite a bottom surface, a cooling plate having a top surface, where the cooling plate contains an aluminum alloy having a coefficient of thermal expansion (CTE) of less than 22 ppm/° C., and a bonding layer securing the bottom surface of the electrostatic chuck and the top surface of the cooling plate, where the bonding layer contains a silicone material.

公开(公告)号：US20230113486A1

公开(公告)日：2023-04-13

申请号：US17954423

申请日：2022-09-28

Applicant: Applied Materials, Inc.

Inventor： Vijay D. Parkhe

IPC: H01L21/687 ,  H01L21/683 ,  H01L21/67 ,  G05D16/20

Abstract: A substrate support assembly includes a shaft body, a plate attached to an upper portion of the shaft body, and a plug or cap attached to a lower portion of the shaft body. The shaft body, the plate and the plug or cap define an internal shaft area having an isolated environment. The internal shaft area is a vacuum environment or comprises an inert gas.

公开(公告)号：US11450546B2

公开(公告)日：2022-09-20

申请号：US16844134

申请日：2020-04-09

Applicant: Applied Materials, Inc.

Inventor： Vijay D. Parkhe

IPC: H01L21/683 ,  H01J37/32

Abstract: Exemplary substrate support assemblies may include an electrostatic chuck body defining a substrate support surface. The support assemblies may include a support stem coupled with the electrostatic chuck body. The support assemblies may include an electrode embedded within the electrostatic chuck body proximate the substrate support surface. The support assemblies may include a ground electrode embedded within the electrostatic chuck body. The support assemblies may include one or more channels formed within the electrostatic chuck body between the electrode and the ground electrode.

公开(公告)号：US11192323B2

公开(公告)日：2021-12-07

申请号：US16876326

申请日：2020-05-18

Applicant: Applied Materials, Inc.

Inventor： Vijay D. Parkhe ,  Roger Alan Lindley

IPC: B32B3/24 ,  B32B3/26 ,  B32B5/18 ,  H01L21/683 ,  H01L21/687 ,  B32B7/12

Abstract: The present disclosure is a method of bonding an electrostatic chuck to a temperature control base. According to the embodiments, a bonding layer is formed between a dielectric body comprising the electrostatic chuck and a temperature control base. A flow aperture extends through the dielectric body and is aligned with a flow aperture in the temperature control base. The bonding layer is also configured with an opening that aligns with apertures in the dielectric body and the temperature control base. In one aspect, a porous plug may be disposed within the flow aperture to protect the bonding layer. In another aspect, a seal is disposed within the flow aperture to seal off the boding layer from gases in the flow aperture.

公开(公告)号：US20210320023A1

公开(公告)日：2021-10-14

申请号：US16844134

申请日：2020-04-09

Applicant: Applied Materials, Inc.

Inventor： Vijay D. Parkhe

IPC: H01L21/683 ,  H01J37/32

Abstract: Exemplary substrate support assemblies may include an electrostatic chuck body defining a substrate support surface. The support assemblies may include a support stem coupled with the electrostatic chuck body. The support assemblies may include an electrode embedded within the electrostatic chuck body proximate the substrate support surface. The support assemblies may include a ground electrode embedded within the electrostatic chuck body. The support assemblies may include one or more channels formed within the electrostatic chuck body between the electrode and the ground electrode.

公开(公告)号：US20210287929A1

公开(公告)日：2021-09-16

申请号：US16820225

申请日：2020-03-16

Applicant: Applied Materials, Inc.

Inventor： Vijay D. Parkhe

IPC: H01L21/687 ,  H01L21/67

Abstract: Exemplary semiconductor substrate supports may include a platen configured to support a semiconductor substrate. The substrate supports may include a stem coupled with the platen. The substrate supports may include a heater embedded within the platen. The heater may include a metal wire and a barrier layer extending about the metal wire.

公开(公告)号：US11088005B2

公开(公告)日：2021-08-10

申请号：US16421301

申请日：2019-05-23

Applicant: Applied Materials, Inc.

Inventor： Vijay D. Parkhe ,  Konstantin Makhratchev ,  Jason Della Rosa ,  Hamid Noobakhsh ,  Brad L. Mays ,  Douglas A. Buchberger, Jr.

IPC: H01L21/683 ,  H01T23/00 ,  H01L21/67

Abstract: A substrate support assembly includes a ceramic puck and a thermally conductive base having an upper surface that is bonded to the ceramic puck. The thermally conductive base includes a plurality of thermal zones and a thermally managed material embedded in the thermally conductive base at the upper surface of the thermally conductive base in one or more of the plurality of thermal zones. The thermally managed material has different thermal conductive properties along a first direction and a second direction. The thermally conductive base further includes a plurality of thermal isolators that extend from the upper surface of the thermally conductive base towards a lower surface of the thermally conductive base between two or more of the plurality of thermal zones without contacting the lower surface of the thermally conductive base. Each of the plurality of thermal isolators provides a degree of thermal isolation.