Invention Grant
- Patent Title: Semiconductor substrate support with internal channels
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Application No.: US16844134Application Date: 2020-04-09
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Publication No.: US11450546B2Publication Date: 2022-09-20
- Inventor: Vijay D. Parkhe
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01J37/32
Abstract:
Exemplary substrate support assemblies may include an electrostatic chuck body defining a substrate support surface. The support assemblies may include a support stem coupled with the electrostatic chuck body. The support assemblies may include an electrode embedded within the electrostatic chuck body proximate the substrate support surface. The support assemblies may include a ground electrode embedded within the electrostatic chuck body. The support assemblies may include one or more channels formed within the electrostatic chuck body between the electrode and the ground electrode.
Public/Granted literature
- US20210320023A1 SEMICONDUCTOR SUBSTRATE SUPPORT WITH INTERNAL CHANNELS Public/Granted day:2021-10-14
Information query
IPC分类:
