公开(公告)号：US11419232B2

公开(公告)日：2022-08-16

申请号：US16869061

申请日：2020-05-07

Applicant: Apple Inc.

Inventor： Hoishun Li ,  Zechariah D. Feinberg ,  Theodore A. Waniuk

IPC: H05K5/04 ,  C22C38/00 ,  C22C16/00 ,  C22C14/00 ,  C23C14/08

Abstract: This application relates to a portable electronic device. The portable electronic device includes an enclosure having a metal oxide coating, the metal oxide coating including a metal alloy substrate that is doped with a dopant, and a metal oxide layer overlaying and formed from the metal alloy substrate so that the metal oxide layer includes the dopant.

公开(公告)号：US11901585B2

公开(公告)日：2024-02-13

申请号：US16953656

申请日：2020-11-20

Applicant: Apple Inc.

Inventor： Hoishun Li ,  Herng-Jeng Jou ,  James A. Yurko ,  Wai Man Raymund Kwok ,  Zechariah D. Feinberg ,  Daniel C. Wagman ,  Eric S. Jol ,  Hani Esmaeili

IPC: H01M50/531 ,  H01M10/0525 ,  C22C9/00 ,  C22C5/06 ,  B82Y30/00

CPC classification number: H01M50/531 ,  C22C5/06 ,  C22C9/00 ,  H01M10/0525 ,  B82Y30/00

Abstract: A method of forming a component can include electrochemically depositing a metallic material onto a carrier component to a thickness of greater than 50 microns. The metallic material can include crystal grains and at least 90% of the crystal grains can include nanotwin boundaries. The metallic material can include at least one of copper or silver.

公开(公告)号：US11312107B2

公开(公告)日：2022-04-26

申请号：US16256825

申请日：2019-01-24

Applicant: Apple Inc.

Inventor： James A. Curran ,  Hoishun Li ,  Nathaniel A. Dixon

IPC: B32B3/30 ,  B32B5/14 ,  B32B15/04 ,  B32B15/20 ,  C25D11/18 ,  H05K5/04 ,  H05K5/02 ,  C25D11/14 ,  C25D11/02 ,  C25D11/16 ,  C25D11/24 ,  B32B33/00

Abstract: This application relates to an enclosure for a portable electronic device. The enclosure includes a metal substrate and a dehydrated anodized layer overlaying the metal substrate. The dehydrated anodized layer includes pores having openings that extend from an external surface of the dehydrated anodized layer and towards the metal substrate, and a metal oxide material that plugs the openings of the pores, where a concentration of the metal oxide material is between about 3 wt % to about 10 wt %.

公开(公告)号：US20220055111A1

公开(公告)日：2022-02-24

申请号：US17445556

申请日：2021-08-20

Applicant: Apple Inc.

Inventor： Hoishun Li ,  Brian M. Gable

IPC: B22F10/10 ,  B33Y10/00 ,  B33Y80/00

Abstract: A method of forming a unitary sintered body can include cutting a first portion and a second portion from a sheet of feedstock. The feedstock can include ceramic or metallic particles suspended in a binder. The first portion can be positioned in contact with the second portion and the portions can be sintered together to form the unitary body.

公开(公告)号：US11021782B2

公开(公告)日：2021-06-01

申请号：US15926897

申请日：2018-03-20

Applicant: Apple Inc.

Inventor： Hoishun Li ,  Ethan E. Currens ,  Weiming Huang ,  James A. Wright

IPC: C23C8/26 ,  C23C8/80 ,  C22C38/44 ,  C22C38/42 ,  C22C38/50 ,  C22C38/00 ,  C22C38/48 ,  C22C38/06 ,  C22C38/04 ,  C22C38/02 ,  C22C38/46 ,  C21D1/74 ,  C21D6/00 ,  C23C8/02 ,  C21D1/06 ,  C21D8/02

Abstract: The disclosure provides methods of making iron-based alloys, as well as resulting alloys. An iron-based alloy containing a small amount of nickel (e.g., 0.5 to 2.0 wt %) is annealed and machined. The alloy is sufficiently ductile to reduce the likelihood of cracking, while not sufficiently high to result in a hardened alloy. After the alloy is shaped, the alloy is hardened by nitriding.

公开(公告)号：US12017275B2

公开(公告)日：2024-06-25

申请号：US17445556

申请日：2021-08-20

Applicant: Apple Inc.

Inventor： Hoishun Li ,  Brian M. Gable

IPC: B33Y80/00 ,  B22F10/10 ,  B32B7/00 ,  B32B7/02 ,  B33Y10/00

CPC classification number: B22F10/10 ,  B32B7/02 ,  B33Y10/00 ,  B33Y80/00

Abstract: A method of forming a unitary sintered body can include cutting a first portion and a second portion from a sheet of feedstock. The feedstock can include ceramic or metallic particles suspended in a binder. The first portion can be positioned in contact with the second portion and the portions can be sintered together to form the unitary body.

公开(公告)号：US20210092856A1

公开(公告)日：2021-03-25

申请号：US17028380

申请日：2020-09-22

Applicant: Apple Inc.

Inventor： Herng-Jeng Jou ,  Hoishun Li ,  James A. Yurko

IPC: H05K5/04 ,  G06F1/16 ,  C23C14/02 ,  H04B1/3827 ,  G04G17/08 ,  B24B7/10

Abstract: A housing for an electronic device can include a metallic component at least partially defining an external surface of the device. The metallic component can have an average grain size less than 45 nanometers in a first region that extends from the external surface to a depth of at least 100 microns below the external surface, and an average grain size greater than 45 nanometers in a second region adjacent to the first surface.

公开(公告)号：US20180265958A1

公开(公告)日：2018-09-20

申请号：US15926897

申请日：2018-03-20

Applicant: Apple Inc.

Inventor： Hoishun Li ,  Ethan E. Currens ,  Weiming Huang ,  James A. Wright

IPC: C23C8/26 ,  C23C8/80 ,  C21D1/06 ,  C22C38/44 ,  C22C38/42 ,  C22C38/50 ,  C22C38/46 ,  C22C38/48 ,  C22C38/06 ,  C22C38/04 ,  C22C38/02 ,  C22C38/00

CPC classification number: C23C8/26 ,  C21D1/06 ,  C21D1/74 ,  C21D6/004 ,  C21D8/0257 ,  C21D2211/001 ,  C21D2211/005 ,  C21D2261/00 ,  C22C38/001 ,  C22C38/002 ,  C22C38/02 ,  C22C38/04 ,  C22C38/06 ,  C22C38/42 ,  C22C38/44 ,  C22C38/46 ,  C22C38/48 ,  C22C38/50 ,  C23C8/02 ,  C23C8/80

Abstract: The disclosure provides methods of making iron-based alloys, as well as resulting alloys. An iron-based alloy containing a small amount of nickel (e.g., 0.5 to 2.0 wt %) is annealed and machined. The alloy is sufficiently ductile to reduce the likelihood of cracking, while not sufficiently high to result in a hardened alloy. After the alloy is shaped, the alloy is hardened by nitriding.

公开(公告)号：US20180017995A1

公开(公告)日：2018-01-18

申请号：US15212029

申请日：2016-07-15

Applicant: Apple Inc.

Inventor： Brian M. Gable ,  Carlo Di Nallo ,  Colin M. Ely ,  Craig A. Horton ,  Erik G. de Jong ,  Fletcher R. Rothkopf ,  Henry B. Wettersten ,  Hoishun Li ,  Jason C. Sauers ,  Jayesh Nath ,  Mario Martinis ,  Mattia Pascolini ,  Michael P. Coleman ,  Rex T. Ehman ,  Zheyu Wang

IPC: G06F1/16 ,  H01Q1/22 ,  H04M1/02 ,  H05K5/04 ,  H05K5/00

CPC classification number: G06F1/1656 ,  B29L2031/3481 ,  G06F1/163 ,  G06F1/1637 ,  H01Q1/22 ,  H01Q1/243 ,  H01Q21/28 ,  H04B1/3888 ,  H04M1/0202 ,  H04M1/0249 ,  H04M1/18 ,  H05K5/0013 ,  H05K5/04

Abstract: A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.

公开(公告)号：US20150354045A1

公开(公告)日：2015-12-10

申请号：US14736000

申请日：2015-06-10

Applicant: Apple Inc.

Inventor： Brian M. Gable ,  James A. Wright ,  Hoishun Li

IPC: C22F1/053 ,  C22C21/10 ,  C22F1/00

CPC classification number: C22F1/053 ,  C22C21/10 ,  C22F1/002

Abstract: 7000 series aluminum alloys containing copper are provided. The aluminum alloys have high yield strength, and in some aspects allow press quenchability and/or have extrusion speeds more rapid than conventional 7000 series Al alloys.

Abstract translation: 提供含有铜的7000系列铝合金。 铝合金具有高屈服强度，并且在一些方面允许压制淬火性和/或具有比常规7000系列Al合金更快的挤出速度。