公开(公告)号：US11021782B2

公开(公告)日：2021-06-01

申请号：US15926897

申请日：2018-03-20

Applicant: Apple Inc.

Inventor： Hoishun Li ,  Ethan E. Currens ,  Weiming Huang ,  James A. Wright

IPC: C23C8/26 ,  C23C8/80 ,  C22C38/44 ,  C22C38/42 ,  C22C38/50 ,  C22C38/00 ,  C22C38/48 ,  C22C38/06 ,  C22C38/04 ,  C22C38/02 ,  C22C38/46 ,  C21D1/74 ,  C21D6/00 ,  C23C8/02 ,  C21D1/06 ,  C21D8/02

Abstract: The disclosure provides methods of making iron-based alloys, as well as resulting alloys. An iron-based alloy containing a small amount of nickel (e.g., 0.5 to 2.0 wt %) is annealed and machined. The alloy is sufficiently ductile to reduce the likelihood of cracking, while not sufficiently high to result in a hardened alloy. After the alloy is shaped, the alloy is hardened by nitriding.

公开(公告)号：US20170088927A1

公开(公告)日：2017-03-30

申请号：US15273314

申请日：2016-09-22

Applicant: Apple Inc.

Inventor： Brian S. Tryon ,  James A. Wright ,  Weiming Huang ,  Herng-Jeng Jou

IPC: C22F1/18 ,  C23C14/58 ,  C23C10/28 ,  C23C10/60 ,  C22C14/00 ,  C23C14/16

CPC classification number: C22F1/186 ,  C22C14/00 ,  C23C8/10 ,  C23C8/80 ,  C23C10/28 ,  C23C10/60 ,  C23C14/0015 ,  C23C14/16 ,  C23C14/5806 ,  C23C14/5853 ,  C23C28/321 ,  C23C28/345 ,  C23C28/42

Abstract: The disclosure is directed to treated titanium alloys comprising a titanium substrate coated with an oxidized surface coating or an oxide-interdiffused titanium substrate. By creating an oxidized surface coating or oxide-interdiffused titanium substrate at the titanium substrate surface, the resulting treated titanium alloy has a dark color (e.g., grey to black).

公开(公告)号：US12000030B2

公开(公告)日：2024-06-04

申请号：US17661695

申请日：2022-05-02

Applicant: Apple Inc.

Inventor： Herng-Jeng Jou ,  Jacob L. Smith ,  Weiming Huang

IPC: C22C9/00 ,  C23C14/14 ,  C23C14/34 ,  C25D3/38 ,  H01M4/02 ,  H01M4/66 ,  H01M10/0525

CPC classification number: C22C9/00 ,  C23C14/14 ,  C23C14/34 ,  C25D3/38 ,  H01M4/662 ,  H01M10/0525 ,  C22C2200/00 ,  H01M2004/021

Abstract: A method of forming a component can include electrochemically depositing a metallic material onto a carrier component to a thickness of greater than 50 microns. The metallic material can include crystal grains and at least 90% of the crystal grains can include nanotwin boundaries. The metallic material can include a Copper-Silver alloy (Cu—Ag) with between about 0.5-2 at %-Ag.

公开(公告)号：US20170233858A9

公开(公告)日：2017-08-17

申请号：US15273314

申请日：2016-09-22

Applicant: Apple Inc.

Inventor： Brian S. Tryon ,  James A. Wright ,  Weiming Huang ,  Herng-Jeng Jou

IPC: C22F1/18 ,  C23C14/58 ,  C23C10/28 ,  C23C10/60 ,  C22C14/00 ,  C23C14/16

CPC classification number: C22F1/186 ,  C22C14/00 ,  C23C8/10 ,  C23C8/80 ,  C23C10/28 ,  C23C10/60 ,  C23C14/0015 ,  C23C14/16 ,  C23C14/5806 ,  C23C14/5853 ,  C23C28/321 ,  C23C28/345 ,  C23C28/42

Abstract: The disclosure is directed to treated titanium alloys comprising a titanium substrate coated with an oxidized surface coating or an oxide-interdiffused titanium substrate. By creating an oxidized surface coating or oxide-interdiffused titanium substrate at the titanium substrate surface, the resulting treated titanium alloy has a dark color (e.g., grey to black).

公开(公告)号：US11207795B1

公开(公告)日：2021-12-28

申请号：US16137434

申请日：2018-09-20

Applicant: Apple Inc.

Inventor： Jeffrey L. Mattlin ,  Abhijeet Misra ,  Herng-Jeng Jou ,  James A. Wright ,  James A. Yurko ,  Lei Gao ,  Weiming Huang ,  William A. Counts

IPC: B28B7/36 ,  B29C43/32

Abstract: A mold apparatus to form a ceramic (or glass) includes a first mold portion having a first coefficient of thermal expansion and a second mold portion having a second coefficient of thermal expansion. In some embodiments, the first mold portion and/or the second mold portion are substantially immiscible with the ceramic material, such as silicon oxide, at a temperature greater than 600° C. In some embodiments, the first coefficient of thermal expansion and the second coefficient of thermal expansion are substantially similar to that of the glass or ceramic material. In some embodiments, the first coefficient of thermal expansion is different from the second coefficient of thermal expansion. In some embodiments, the first mold portion and the second mold portion contain a surface coating and a passivation layer.

公开(公告)号：US20210087664A1

公开(公告)日：2021-03-25

申请号：US17020346

申请日：2020-09-14

Applicant: Apple Inc.

Inventor： Eric W. Hamann ,  Weiming Huang ,  Brian M. Gable ,  Herng-Jeng Jou ,  William A. Counts

IPC: C22F1/047 ,  B32B15/01 ,  C22C21/08

Abstract: An aluminum alloy that may include 0.45 to 0.85 wt % Si, 0.15 to 0.25 wt % Cu, 0.40 to 0.80 wt % Fe, 1.20 to 1.65 wt % Mg, and 0.80 to 1.10 wt % Mn, where the balance is aluminum and incidental impurities. The alloy can include used beverage can (UBC) scrap.

公开(公告)号：US20220356546A1

公开(公告)日：2022-11-10

申请号：US17661695

申请日：2022-05-02

Applicant: Apple Inc.

Inventor： Herng-Jeng Jou ,  Jacob L. Smith ,  Weiming Huang

IPC: C22C9/00 ,  C23C14/14 ,  C23C14/34 ,  H01M10/0525 ,  H01M4/66 ,  C25D3/38

Abstract: A method of forming a component can include electrochemically depositing a metallic material onto a carrier component to a thickness of greater than 50 microns. The metallic material can include crystal grains and at least 90% of the crystal grains can include nanotwin boundaries. The metallic material can include a Copper-Silver alloy (Cu—Ag) with between about 0.5-2 at %-Ag.

公开(公告)号：US20200048744A1

公开(公告)日：2020-02-13

申请号：US16530830

申请日：2019-08-02

Applicant: Apple Inc.

Inventor： Brian M. Gable ,  Herng-Jeng Jou ,  Weiming Huang ,  Graeme W. Paul ,  William A. Counts ,  Eric W. Hamann ,  Katie L. Sassaman ,  Abhijeet Misra ,  Zechariah D. Feinberg ,  James A. Yurko ,  Brian P. Demers ,  Rafael Yu ,  Anuj Datta Roy ,  Susannah P. Calvin

IPC: C22C21/00 ,  C22F1/04 ,  C22C1/02

Abstract: The disclosure provides an aluminum alloy may include iron (Fe) of at least 0.10 wt %, silicon (Si) of at least 0.35 wt %, and magnesium (Mg) of at least 0.45 wt %, manganese (Mn) in amount of at least 0.005 wt %, and additional elements, the remaining wt % being Al and incidental impurities.

公开(公告)号：US20240279777A1

公开(公告)日：2024-08-22

申请号：US18645905

申请日：2024-04-25

Applicant: Apple Inc.

Inventor： Herng-Jeng Jou ,  Jacob L. Smith ,  Weiming Huang

IPC: C22C9/00 ,  C23C14/14 ,  C23C14/34 ,  C25D3/38 ,  H01M4/02 ,  H01M4/66 ,  H01M10/0525

CPC classification number: C22C9/00 ,  C23C14/14 ,  C23C14/34 ,  C25D3/38 ,  H01M4/662 ,  H01M10/0525 ,  C22C2200/00 ,  H01M2004/021

Abstract: A method of forming a component can include electrochemically depositing a metallic material onto a carrier component to a thickness of greater than 50 microns. The metallic material can include crystal grains and at least 90% of the crystal grains can include nanotwin boundaries. The metallic material can include a Copper-Silver alloy (Cu—Ag) with between about 0.5-2 at %-Ag.

公开(公告)号：US11345980B2

公开(公告)日：2022-05-31

申请号：US16530830

申请日：2019-08-02

Applicant: Apple Inc.

Inventor： Brian M. Gable ,  Herng-Jeng Jou ,  Weiming Huang ,  Graeme W. Paul ,  William A. Counts ,  Eric W. Hamann ,  Katie L. Sassaman ,  Abhijeet Misra ,  Zechariah D. Feinberg ,  James A. Yurko ,  Brian P. Demers ,  Rafael Yu ,  Anuj Datta Roy ,  Susannah P. Calvin

IPC: C22C21/00 ,  C22C1/02 ,  C22F1/04

Abstract: The disclosure provides an aluminum alloy may include iron (Fe) of at least 0.10 wt %, silicon (Si) of at least 0.35 wt %, and magnesium (Mg) of at least 0.45 wt %, manganese (Mn) in amount of at least 0.005 wt %, and additional elements, the remaining wt % being Al and incidental impurities.