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公开(公告)号：US12275173B2
公开(公告)日：2025-04-15
申请号：US17656395
申请日：2022-03-24
Applicant: Apple Inc.
Inventor： James A. Curran , James A. Yurko , Todd S. Mintz
Abstract: A chemical treatment process has been identified as a simple and effective means of improving the bonding of injection-molded polymer to titanium surfaces. This process forms an oxide layer on a titanium surface that includes a layered double hydroxide. The layered double hydroxide both raises the bond strength and minimizes air or water leakage. The process enables the use of titanium alloys with injection molded polymer structural bonds in strong, lightweight, and water-resistant enclosures for consumer electronics.
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公开(公告)号：US11910552B2
公开(公告)日：2024-02-20
申请号：US16904501
申请日：2020-06-17
Applicant: Apple Inc.
Inventor： Manish Mittal , Brian S. Tryon , James A. Yurko , Jing Zhou , Matthew S. Rogers , Naoto Matsuyuki
CPC classification number: H05K5/04 , C08K3/08 , H05K5/0017 , H05K5/0086 , H05K5/0217 , C08K2003/0831
Abstract: An electronic device may have a housing. The device may include metal structures such as a metal member forming a portion of the housing, a portion of a strap, or other portions of the device. A gold-containing coating such as a layer of elemental gold or a gold alloy may cover the metal member to provide the metal member with a gold appearance or other desired appearance. To protect the metal member and the gold-containing coating, the metal member and gold-containing coating may be covered with a protective coating layer such as an organic protective layer. The organic protective layer may have a fluoropolymer layer with thiol coupling groups to promote adhesion to the gold-containing layer or may contain a polymer layer with silane and thiol coupling groups that serves as an adhesion promotion layer for an overlapping fluoropolymer layer with silane coupling groups.
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公开(公告)号：US11901585B2
公开(公告)日：2024-02-13
申请号：US16953656
申请日：2020-11-20
Applicant: Apple Inc.
Inventor： Hoishun Li , Herng-Jeng Jou , James A. Yurko , Wai Man Raymund Kwok , Zechariah D. Feinberg , Daniel C. Wagman , Eric S. Jol , Hani Esmaeili
IPC: H01M50/531 , H01M10/0525 , C22C9/00 , C22C5/06 , B82Y30/00
CPC classification number: H01M50/531 , C22C5/06 , C22C9/00 , H01M10/0525 , B82Y30/00
Abstract: A method of forming a component can include electrochemically depositing a metallic material onto a carrier component to a thickness of greater than 50 microns. The metallic material can include crystal grains and at least 90% of the crystal grains can include nanotwin boundaries. The metallic material can include at least one of copper or silver.
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公开(公告)号：US20210400830A1
公开(公告)日：2021-12-23
申请号：US16904501
申请日：2020-06-17
Applicant: Apple Inc.
Inventor： Manish Mittal , Brian S. Tryon , James A. Yurko , Jing Zhou , Matthew S. Rogers , Naoto Matsuyuki
Abstract: An electronic device may have a housing. The device may include metal structures such as a metal member forming a portion of the housing, a portion of a strap, or other portions of the device. A gold-containing coating such as a layer of elemental gold or a gold alloy may cover the metal member to provide the metal member with a gold appearance or other desired appearance. To protect the metal member and the gold-containing coating, the metal member and gold-containing coating may be covered with a protective coating layer such as an organic protective layer. The organic protective layer may have a fluoropolymer layer with thiol coupling groups to promote adhesion to the gold-containing layer or may contain a polymer layer with silane and thiol coupling groups that serves as an adhesion promotion layer for an overlapping fluoropolymer layer with silane coupling groups.
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公开(公告)号：US20140261898A1
公开(公告)日：2014-09-18
申请号：US13839157
申请日：2013-03-15
Applicant: Apple Inc.
Inventor： Edgar E. Vidal , James A. Yurko , Charles Pokross , Randy S. Beals , Lawrence H. Ryczek , Theodore A. Waniuk , Joseph C. Poole , Christopher D. Prest , Dermot J. Stratton
CPC classification number: C22C45/10 , C22C1/002 , C22C45/00 , C22C45/001 , C22C45/003
Abstract: Disclosed herein is a bulk metallic glasses (BMG) comprising 0.0001 wt % to 0.7 wt % of Be, 0.0001 wt % to 0.2 wt % of Be, or 0.06 wt % to 0.08 wt % of Be. Be may have the effect of reducing a liquidus temperature of the BMG relative to melting temperatures of individual alloying elements of the BMG.
Abstract translation: 本文公开了包含0.0001重量％至0.7重量％的Be，0.0001重量％至0.2重量％的Be或0.06重量％至0.08重量％的Be的块状金属玻璃（BMG）。 可能具有降低BMG相对于BMG的各个合金元素的熔融温度的液相线温度的作用。
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Patent Agency Ranking
公开(公告)号：US11207795B1
公开(公告)日：2021-12-28
申请号：US16137434
申请日：2018-09-20
Applicant: Apple Inc.
Inventor： Jeffrey L. Mattlin , Abhijeet Misra , Herng-Jeng Jou , James A. Wright , James A. Yurko , Lei Gao , Weiming Huang , William A. Counts
Abstract: A mold apparatus to form a ceramic (or glass) includes a first mold portion having a first coefficient of thermal expansion and a second mold portion having a second coefficient of thermal expansion. In some embodiments, the first mold portion and/or the second mold portion are substantially immiscible with the ceramic material, such as silicon oxide, at a temperature greater than 600° C. In some embodiments, the first coefficient of thermal expansion and the second coefficient of thermal expansion are substantially similar to that of the glass or ceramic material. In some embodiments, the first coefficient of thermal expansion is different from the second coefficient of thermal expansion. In some embodiments, the first mold portion and the second mold portion contain a surface coating and a passivation layer.
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公开(公告)号：US10856443B2
公开(公告)日：2020-12-01
申请号：US16407011
申请日：2019-05-08
Applicant: Apple Inc.
Inventor： William A. Counts , Abhijeet Misra , Nagarajan Kalyanasundaram , James A. Yurko
Abstract: This application relates to an enclosure for a portable electronic device is described. The enclosure can include metal bands included along the enclosure and a support structure. The support structure can include a thermally conductive core that is capable of conducting thermal energy generated by the operational components and rails that are bound between the metal bands and the thermally conductive core, where the rails are characterized as having a rate of thermal conductivity that is less than a rate of thermal conductivity of the thermally conductive core so that the thermal energy generated by the operational component is directed away from the operational component and away from the metal bands.
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公开(公告)号：US20250075334A1
公开(公告)日：2025-03-06
申请号：US18523718
申请日：2023-11-29
Applicant: Apple Inc.
Inventor： Brian S. Tryon , Jozef M. Matlak , James A. Yurko
IPC: C23C28/04
Abstract: An electronic device may be provided with conductive structures such as a titanium housing wall. A visible-light-reflecting coating may be formed on the titanium housing wall. The coating may have adhesion and transition layers and an uppermost opaque coloring layer. In a first example, the uppermost opaque coloring layer includes CrC on a CrSiN transition layer. In a second example, the uppermost opaque coloring layer includes CrN on a CrN transition layer. The coating may exhibit a relatively uniform metallic silver or gray color that is smudge resistant even when the underlying titanium housing wall has a three-dimensional shape.
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公开(公告)号：US11985781B2
公开(公告)日：2024-05-14
申请号：US17446432
申请日：2021-08-30
Applicant: Apple Inc.
Inventor： Herng-Jeng Jou , Hoishun Li , James A. Yurko
CPC classification number: H05K5/0286 , B21D22/02 , H04M1/026
Abstract: A component for an electronic device can include a metal injection molded (MIM) metallic body that at least partially defines an exterior surface. The metallic body can have an average porosity less than 1% in a first region that extends from the external surface to a depth of at least 100 microns below the external surface, and an average porosity greater than 1% in a second region adjacent to the first region.
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公开(公告)号：US20230092781A1
公开(公告)日：2023-03-23
申请号：US17656395
申请日：2022-03-24
Applicant: Apple Inc.
Inventor： James A. Curran , James A. Yurko , Todd S. Mintz
Abstract: A chemical treatment process has been identified as a simple and effective means of improving the bonding of injection-molded polymer to titanium surfaces. This process forms an oxide layer on a titanium surface that includes a layered double hydroxide. The layered double hydroxide both raises the bond strength and minimizes air or water leakage. The process enables the use of titanium alloys with injection molded polymer structural bonds in strong, lightweight, and water-resistant enclosures for consumer electronics.
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