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公开(公告)号:US20240279777A1
公开(公告)日:2024-08-22
申请号:US18645905
申请日:2024-04-25
Applicant: Apple Inc.
Inventor: Herng-Jeng Jou , Jacob L. Smith , Weiming Huang
CPC classification number: C22C9/00 , C23C14/14 , C23C14/34 , C25D3/38 , H01M4/662 , H01M10/0525 , C22C2200/00 , H01M2004/021
Abstract: A method of forming a component can include electrochemically depositing a metallic material onto a carrier component to a thickness of greater than 50 microns. The metallic material can include crystal grains and at least 90% of the crystal grains can include nanotwin boundaries. The metallic material can include a Copper-Silver alloy (Cu—Ag) with between about 0.5-2 at %-Ag.
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公开(公告)号:US11345980B2
公开(公告)日:2022-05-31
申请号:US16530830
申请日:2019-08-02
Applicant: Apple Inc.
Inventor: Brian M. Gable , Herng-Jeng Jou , Weiming Huang , Graeme W. Paul , William A. Counts , Eric W. Hamann , Katie L. Sassaman , Abhijeet Misra , Zechariah D. Feinberg , James A. Yurko , Brian P. Demers , Rafael Yu , Anuj Datta Roy , Susannah P. Calvin
Abstract: The disclosure provides an aluminum alloy may include iron (Fe) of at least 0.10 wt %, silicon (Si) of at least 0.35 wt %, and magnesium (Mg) of at least 0.45 wt %, manganese (Mn) in amount of at least 0.005 wt %, and additional elements, the remaining wt % being Al and incidental impurities.
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公开(公告)号:US20210092856A1
公开(公告)日:2021-03-25
申请号:US17028380
申请日:2020-09-22
Applicant: Apple Inc.
Inventor: Herng-Jeng Jou , Hoishun Li , James A. Yurko
Abstract: A housing for an electronic device can include a metallic component at least partially defining an external surface of the device. The metallic component can have an average grain size less than 45 nanometers in a first region that extends from the external surface to a depth of at least 100 microns below the external surface, and an average grain size greater than 45 nanometers in a second region adjacent to the first surface.
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公开(公告)号:US20210087656A1
公开(公告)日:2021-03-25
申请号:US17020234
申请日:2020-09-14
Applicant: Apple Inc.
Inventor: Katie L. Sassaman , Brian M. Gable , Herng-Jeng Jou , Weiming Huang , James A. Yurko
Abstract: The disclosure is directed to aluminum alloys made from recycled components. The alloys have copper (Cu) from 0.051 to 0.10 wt %, chromium (Cr) from 0.01 to 0.10 wt %, zinc (Zn) from 0.02 to 0.20 wt %, manganese (Mn) from 0.03 to 0.10 wt %, iron (Fe) in an amount of at least 0.10 wt %, silicon (Si) in an amount of at least 0.35 wt %, magnesium (Mg) in amount of at least 0.45 wt %, and the remaining wt % being Al and incidental impurities. In other aspects, the disclosure is directed to aluminum alloys having copper (Cu) from 0.010 to 0.050 wt %, chromium (Cr) from 0.01 to 0.10 wt %, zinc (Zn) from 0.01 to 0.20 wt %, manganese (Mn) from 0.03 to 0.10 wt %, iron (Fe) in an amount of at least 0.10 wt %, silicon (Si) in an amount of at least 0.35 wt %, magnesium (Mg) in amount of at least 0.45 wt %, and the remaining wt % being Al and incidental impurities. The b* color of the alloys ranges from −2 to 2, and the L* color ranges from 70 to 100.
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公开(公告)号:US20150368772A1
公开(公告)日:2015-12-24
申请号:US14744774
申请日:2015-06-19
Applicant: Apple Inc.
Inventor: Herng-Jeng Jou , Abhijeet Misra
Abstract: The disclosure provides an aluminum alloy comprising second phase particles having an Al(FeMn)Si phase with an (Fe+Mn):Si ratio of 0.5 to 2.5 and a mean particle diameter of 0.5 μm to 10 μm. The disclosure also provides an aluminum alloy comprising 0.02 to 0.11 wt % Fe, 0 to 0.16 wt % Mn, 0 to 0.08 wt. % Cr, 0.40 to 0.90 wt % Mg, and 0.20 to 0.60 wt % Si, wherein the aluminum alloy is homogenized at a temperature from 550 to 590° C.
Abstract translation: 本发明提供一种铝合金,其包括具有(Fe + Mn):Si比为0.5〜2.5,平均粒径为0.5μm〜10μm的Al(FeMn)Si相的第二相粒子。 本公开还提供了一种铝合金,其包含0.02至0.11重量%的Fe,0至0.16重量%的Mn,0至0.08重量% %Cr,0.40〜0.90重量%Mg和0.20〜0.60重量%的Si,其中铝合金在550-590℃的温度下均化。
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公开(公告)号:US11901585B2
公开(公告)日:2024-02-13
申请号:US16953656
申请日:2020-11-20
Applicant: Apple Inc.
Inventor: Hoishun Li , Herng-Jeng Jou , James A. Yurko , Wai Man Raymund Kwok , Zechariah D. Feinberg , Daniel C. Wagman , Eric S. Jol , Hani Esmaeili
IPC: H01M50/531 , H01M10/0525 , C22C9/00 , C22C5/06 , B82Y30/00
CPC classification number: H01M50/531 , C22C5/06 , C22C9/00 , H01M10/0525 , B82Y30/00
Abstract: A method of forming a component can include electrochemically depositing a metallic material onto a carrier component to a thickness of greater than 50 microns. The metallic material can include crystal grains and at least 90% of the crystal grains can include nanotwin boundaries. The metallic material can include at least one of copper or silver.
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公开(公告)号:US20190211432A1
公开(公告)日:2019-07-11
申请号:US16244750
申请日:2019-01-10
Applicant: Apple Inc.
Inventor: Abhijeet Misra , James A. Wright , Herng-Jeng Jou
Abstract: The disclosure provides aluminum alloys having varying ranges of alloying elements and properties.
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公开(公告)号:US20170088927A1
公开(公告)日:2017-03-30
申请号:US15273314
申请日:2016-09-22
Applicant: Apple Inc.
Inventor: Brian S. Tryon , James A. Wright , Weiming Huang , Herng-Jeng Jou
CPC classification number: C22F1/186 , C22C14/00 , C23C8/10 , C23C8/80 , C23C10/28 , C23C10/60 , C23C14/0015 , C23C14/16 , C23C14/5806 , C23C14/5853 , C23C28/321 , C23C28/345 , C23C28/42
Abstract: The disclosure is directed to treated titanium alloys comprising a titanium substrate coated with an oxidized surface coating or an oxide-interdiffused titanium substrate. By creating an oxidized surface coating or oxide-interdiffused titanium substrate at the titanium substrate surface, the resulting treated titanium alloy has a dark color (e.g., grey to black).
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公开(公告)号:US20220356546A1
公开(公告)日:2022-11-10
申请号:US17661695
申请日:2022-05-02
Applicant: Apple Inc.
Inventor: Herng-Jeng Jou , Jacob L. Smith , Weiming Huang
Abstract: A method of forming a component can include electrochemically depositing a metallic material onto a carrier component to a thickness of greater than 50 microns. The metallic material can include crystal grains and at least 90% of the crystal grains can include nanotwin boundaries. The metallic material can include a Copper-Silver alloy (Cu—Ag) with between about 0.5-2 at %-Ag.
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公开(公告)号:US20210159477A1
公开(公告)日:2021-05-27
申请号:US16953656
申请日:2020-11-20
Applicant: Apple Inc.
Inventor: Hoishun Li , Herng-Jeng Jou , James A. Yurko , Wai Man Raymund Kwok , Zechariah D. Feinberg , Daniel C. Wagman , Eric S. Jol , Hani Esmaeili
IPC: H01M2/26 , H01M10/0525 , C22C5/06 , C22C9/00
Abstract: A method of forming a component can include electrochemically depositing a metallic material onto a carrier component to a thickness of greater than 50 microns. The metallic material can include crystal grains and at least 90% of the crystal grains can include nanotwin boundaries. The metallic material can include at least one of copper or silver.
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