公开(公告)号：US20250102398A1

公开(公告)日：2025-03-27

申请号：US18828801

申请日：2024-09-09

Applicant: Applied Materials, Inc.

Inventor： Yongan XU ,  Chan Juan XING ,  Jinxin FU ,  Ludovic GODET

IPC: G01M11/00

Abstract: A method and apparatus for determining a line angle and a line angle rotation of a grating or line feature is disclosed. An aspect of the present disclosure involves, measuring coordinate points of a first line feature using a measurement tool, determining a first slope of the first line feature from the coordinate points, and determining a first line angle from the slope of the first line feature. This process can be repeated to find a second slope of a second line feature that is adjacent to the first line feature. The slope of the first and second line features can be compared to find a line angle rotation. The line angle rotation is compared to a design specification and a stitch quality is determined.

公开(公告)号：US20250054171A1

公开(公告)日：2025-02-13

申请号：US18930188

申请日：2024-10-29

Applicant: Applied Materials, Inc.

Inventor： Jinxin FU ,  Yangyang SUN ,  Ludovic GODET

IPC: G06T7/521 ,  G06T1/00

Abstract: Embodiments herein provide for a method of determining an optical device modulation transfer function (MTF). The method described herein includes projecting a first instance of an image from a light engine to a detector. The first instance of the image is analyzed to determine a first function. A first fast Fourier transform (FFT) or a first MTF of the first function is obtained. The method further includes projecting a second instance of the image from the light engine to detector via one or more optical devices. The second instance of the image is analyzed to determine a second function. A second FFT or a second MTF is obtained of the second function. An optical device MTF of the one or more optical devices is determined by comparing the first FFT and the second FFT or by comparing the first MTF and the second MTF.

公开(公告)号：US20240295693A1

公开(公告)日：2024-09-05

申请号：US18629636

申请日：2024-04-08

Applicant: Applied Materials, Inc.

Inventor： Yingdong LUO ,  Zhengping YAO ,  Daihua ZHANG ,  David Alexander SELL ,  Jingyi YANG ,  Xiaopei DENG ,  Kevin MESSER ,  Samarth BHARGAVA ,  Rami HOURANI ,  Ludovic GODET

IPC: G02B6/122 ,  G02B6/12 ,  G02B6/124 ,  G02B6/13 ,  G02B27/00

CPC classification number: G02B6/1228 ,  G02B6/12004 ,  G02B6/124 ,  G02B6/13 ,  G02B27/0081

Abstract: Embodiments of the present disclosure generally relate to methods for forming a waveguide. Methods may include measuring a waveguide substrate, the waveguide having a substrate thickness distribution; and depositing an index-matched layer onto a surface of the waveguide, the index-matched layer having a first surface disposed on the waveguide substrate and a second surface opposing the first surface, wherein the index-matched layer is disposed only over a portion of the waveguide substrate, and a device slope of a second surface of the index-matched layer is substantially the same as the waveguide slope of the first surface of the waveguide.

公开(公告)号：US20240124969A1

公开(公告)日：2024-04-18

申请号：US18537504

申请日：2023-12-12

Applicant: Applied Materials, Inc.

Inventor： Nai-Wen PI ,  Jinxin FU ,  Kang LUO ,  Ludovic GODET

IPC: C23C14/48 ,  C03C23/00 ,  C23C14/00 ,  C23C14/02 ,  C23C14/58

CPC classification number: C23C14/48 ,  C03C23/0095 ,  C23C14/0031 ,  C23C14/021 ,  C23C14/5873 ,  G02B6/10

Abstract: Embodiments described herein provide for optical devices with methods of forming optical device substrates having at least one area of increased refractive index or scratch resistance. One method includes disposing an etch material on a discrete area of an optical device substrate or an optical device layer, disposing a diffusion material in the discrete area, and removing excess diffusion material to form an optical material in the optical device substrate or the optical device layer having a refractive index greater than or equal to 2.0 or a hardness greater than or equal to 5.5 Mohs.

公开(公告)号：US20240094630A1

公开(公告)日：2024-03-21

申请号：US18521853

申请日：2023-11-28

Applicant: Applied Materials, Inc.

Inventor： Amita JOSHI ,  Andrew CEBALLOS ,  Kenichi OHNO ,  Rami HOURANI ,  Ludovic GODET

IPC: G03F7/00 ,  C09D7/40 ,  C09D7/62 ,  C09D7/65 ,  G03F7/16

CPC classification number: G03F7/0002 ,  C09D7/62 ,  C09D7/65 ,  C09D7/67 ,  G03F7/167

Abstract: Embodiments of the present disclosure generally relate to imprint compositions and materials and related processes useful for nanoimprint lithography (NIL). In one or more embodiments, an imprint composition is provided and contains a plurality of passivated nanoparticles, one or more solvents, a surface ligand, an additive, and an acrylate. Each passivated nanoparticle contains a core and one or more shells, where the core contains one or more metal oxides and the shell contains one or more passivation materials. The passivation material of the shell contains one or more silicon-containing compounds.

公开(公告)号：US20240001700A1

公开(公告)日：2024-01-04

申请号：US18337294

申请日：2023-06-19

Applicant: Applied Materials, Inc.

Inventor： Yingdong LUO ,  Xiaopei DENG ,  Rami HOURANI ,  Ludovic GODET

IPC: B41M3/00 ,  G02B27/01 ,  B41J11/00 ,  B41M5/00

CPC classification number: B41M3/003 ,  G02B27/0172 ,  B41J11/0021 ,  B41M5/0047 ,  G02B2207/101

Abstract: A method of forming an optical device is provided. The method includes forming a first layer over a plurality of optical structures, the first layer including a first plurality of nanoparticles and a second plurality of nanoparticles. The first plurality of nanoparticles and the second plurality of nanoparticles are formed of a first material, the first plurality of nanoparticles have a first average volume, greater than 95% of the first plurality of nanoparticles have a volume within 10% of the first average volume, the second plurality of nanoparticles have a second average volume, greater than 95% of the second plurality of nanoparticles have a volume within 10% of the second average volume, and the second average volume is at least 25% larger the first average volume.

公开(公告)号：US20240001398A1

公开(公告)日：2024-01-04

申请号：US18337246

申请日：2023-06-19

Applicant: Applied Materials, Inc.

Inventor： Russell Chin Yee TEO ,  Yingdong LUO ,  Ludovic GODET ,  Daihua ZHANG ,  Zhengping YAO ,  James D. STRASSNER

IPC: B05C5/02 ,  B05D3/00 ,  B05D3/06 ,  B05D7/24

CPC classification number: B05C5/0291 ,  B05D3/007 ,  B05D3/067 ,  B05D7/24 ,  B05D2203/30

Abstract: A method of forming a substrate carrier is provided. The method includes forming a first electrode over a first surface of a substrate, the first electrode arranged in a first pattern including a plurality of segments, wherein portions of the plurality of segments are spaced apart from each other by a plurality of gaps; and dispensing a plurality of droplets of a dielectric material over the substrate and into the plurality of gaps. The plurality of droplets includes a first droplet and a second droplet, the first droplet is dispensed onto a first location over the substrate, the second droplet is dispensed onto a second location over the substrate, a size of the first droplet is at least 10% larger than a size of the second droplet.

公开(公告)号：US20230280511A1

公开(公告)日：2023-09-07

申请号：US18314953

申请日：2023-05-10

Applicant: Applied Materials, Inc.

Inventor： Sage Toko Garrett DOSHAY ,  Rutger MEYER TIMMERMAN THIJSSEN ,  Ludovic GODET ,  Chien-An CHEN ,  Pinkesh Rohit SHAH

IPC: G02B5/20

CPC classification number: G02B5/20 ,  G02B2207/101

Abstract: Embodiments of the present disclosure relate to methods for fabricating optical devices. One embodiment of the method includes disposing a structure material layer on a surface of a substrate and disposing a patterned photoresist over the structure material layer. The patterned photoresist has at least one device portion and at least one auxiliary portion. Each device portion and each auxiliary portion exposes unmasked portions of the structure material layer. The unmasked portions of structure material layer corresponding to each device portion and each auxiliary portion are etched. The etching the unmasked portions forms at least one optical device having device structures corresponding to the unmasked portions of at least one device portion and at least one auxiliary region having auxiliary structures corresponding to the unmasked portions of at least one auxiliary portion.

公开(公告)号：US20230229086A1

公开(公告)日：2023-07-20

申请号：US18085649

申请日：2022-12-21

Applicant: Applied Materials, Inc.

Inventor： Michael David-Scott KEMP ,  Daihua ZHANG ,  Ludovic GODET ,  Mahendran CHIDAMBARAM ,  Sumedh Dattatraya ACHARYA

IPC: G03F7/20 ,  B41M7/00

CPC classification number: G03F7/2002 ,  B41M7/0081

Abstract: A method and apparatus for curing a substrate are described. The apparatus includes a curing apparatus with a casing and an ultraviolet (UV) radiation assembly coupled to the casing. The ultraviolet radiation assembly further includes a line UV radiation source. The casing includes an opening on one end. A substrate passes by the opening and is exposed to the UV radiation of the line UV radiation source. The curing apparatus further includes a purge assembly configured to continuously purge the process volume and the volume directly above the exposed portion of the substrate. The curing apparatus is configured to only cure a portion of the substrate at any one point in time, such that the curing apparatus is a scanning curing apparatus and includes a small process volume.

公开(公告)号：US20230203647A1

公开(公告)日：2023-06-29

申请号：US18111385

申请日：2023-02-17

Applicant: Applied Materials, Inc.

Inventor： Karl J. ARMSTRONG ,  Ludovic GODET ,  Brian Alexander COHEN ,  Wayne MCMILLAN ,  James D. STRASSNER ,  Benjamin B. RIORDON

IPC: C23C16/40 ,  C23C14/04 ,  C23C16/04 ,  C23C16/455 ,  C23C14/08 ,  C23C14/06 ,  C23C14/14 ,  C23C16/24 ,  C23C16/34 ,  H01L21/677 ,  C23C16/56

CPC classification number: C23C16/405 ,  C23C14/042 ,  C23C16/042 ,  C23C16/45525 ,  C23C14/083 ,  C23C16/407 ,  C23C14/0652 ,  C23C14/14 ,  C23C16/24 ,  C23C16/345 ,  C23C14/086 ,  H01L21/67766 ,  H01L21/67763 ,  C23C16/56 ,  G02B6/132

Abstract: Embodiments of the present disclosure relate to forming multi-depth films for the fabrication of optical devices. One embodiment includes disposing a base layer of a device material on a surface of a substrate. One or more mandrels of the device material are disposed on the base layer. The disposing the one or more mandrels includes positioning a mask over of the base layer. The device material is deposited with the mask positioned over the base layer to form an optical device having the base layer with a base layer depth and the one or more mandrels having a first mandrel depth and a second mandrel depth.