公开(公告)号：US20240227081A1

公开(公告)日：2024-07-11

申请号：US18614234

申请日：2024-03-22

Applicant: Applied Materials, Inc.

Inventor： Mahendran CHIDAMBARAM ,  Shmuel EREZ ,  Wei-Sheng LEI ,  John RUSCONI

IPC: B23K26/362 ,  B23K26/06 ,  B23K103/00

CPC classification number: B23K26/362 ,  B23K26/0643 ,  B23K26/0648 ,  B23K2103/50

Abstract: A system for fabricating devices includes a plurality of stages, each stage disposed below a corresponding optical head of a plurality of movable optical heads, each optical head corresponding to a laser source, each optical head comprising a swappable optical head positioned in a staggered position relative to one another such that each laser beam path of each optical head from each corresponding laser source does not intersect one another, a conveyor system coupled to the plurality of stages, and a sorting system comprising a robot capable of moving devices from the conveyor system to at least one backend storage port or to a backend processor.

公开(公告)号：US20230123795A1

公开(公告)日：2023-04-20

申请号：US17945861

申请日：2022-09-15

Applicant: Applied Materials, Inc.

Inventor： Wei-Sheng LEI ,  Zhengping YAO ,  Mahendran CHIDAMBARAM ,  Kangkang WANG ,  Zhihong John LIN ,  Ludovic GODET ,  Visweswaren SIVARAMAKRISHNAN

IPC: B23K26/364 ,  B23K26/0622

Abstract: A method and apparatus for dicing optical devices from a substrate are described herein. The method includes the formation of a plurality of trenches using radiation pulses delivered to the substrate. The radiation pulses are delivered in a pattern to form trenches with varying depth as the trenches extend outward from a top surface of the optical device. The varying depth of the trenches provides edges of each of the optical devices which are slanted. The radiation pulses are UV radiation pulses and are delivered in bursts around the silhouette of the optical devices.

公开(公告)号：US20230229086A1

公开(公告)日：2023-07-20

申请号：US18085649

申请日：2022-12-21

Applicant: Applied Materials, Inc.

Inventor： Michael David-Scott KEMP ,  Daihua ZHANG ,  Ludovic GODET ,  Mahendran CHIDAMBARAM ,  Sumedh Dattatraya ACHARYA

IPC: G03F7/20 ,  B41M7/00

CPC classification number: G03F7/2002 ,  B41M7/0081

Abstract: A method and apparatus for curing a substrate are described. The apparatus includes a curing apparatus with a casing and an ultraviolet (UV) radiation assembly coupled to the casing. The ultraviolet radiation assembly further includes a line UV radiation source. The casing includes an opening on one end. A substrate passes by the opening and is exposed to the UV radiation of the line UV radiation source. The curing apparatus further includes a purge assembly configured to continuously purge the process volume and the volume directly above the exposed portion of the substrate. The curing apparatus is configured to only cure a portion of the substrate at any one point in time, such that the curing apparatus is a scanning curing apparatus and includes a small process volume.

公开(公告)号：US20230002268A1

公开(公告)日：2023-01-05

申请号：US17836162

申请日：2022-06-09

Applicant: Applied Materials, Inc.

Inventor： Wei-Sheng LEI ,  Mahendran CHIDAMBARAM ,  Kangkang WANG ,  Ludovic GODET ,  Visweswaren SIVARAMAKRISHNAN

IPC: C03B33/02 ,  B23K26/0622 ,  B23K26/55

Abstract: A method and apparatus for substrate dicing are described. The method includes utilizing a laser to dice a substrate along a dicing path to form a perforated line around each device within the substrate. The dicing path is created by exposing the substrate to bursts of laser pulses at different locations around each device. The laser pulses are delivered to the substrate and may have a pulse repetition frequency of greater than about 25 MHz, a pulse width of less than about 15 picoseconds, and a laser wavelength of about 1.0 μm to about 5 μm.

公开(公告)号：US20220363060A1

公开(公告)日：2022-11-17

申请号：US17647780

申请日：2022-01-12

Applicant: Applied Materials, Inc.

Inventor： Daihua ZHANG ,  Kang LUO ,  Kazuya DAITO ,  Kenneth S. LEDFORD ,  Elsa MASSONNEAU ,  Alexey STEPANOV ,  Ludovic GODET ,  Mahendran CHIDAMBARAM ,  Visweswaren SIVARAMAKRISHNAN ,  Bahubali S. UPADHYE ,  Hemantha RAJU

IPC: B41J2/165

Abstract: Embodiments described herein relate to an inkjet service station and methods of servicing an inkjet printer with the inkjet service station. The inkjet service station is disposed in an inkjet printer of an inkjet chamber. The inkjet service station is operable to perform servicing operations on a processing apparatus of the inkjet printer. The servicing operations include at least one of printhead spitting, printhead purging, printhead flushing, printhead cleaning, printhead drying, or vacuum suction.

公开(公告)号：US20210260826A1

公开(公告)日：2021-08-26

申请号：US17256628

申请日：2019-05-09

Applicant: APPLIED MATERIALS, INC.

Inventor： Wei-Sheng LEI ,  Mahendran CHIDAMBARAM ,  Visweswaren SIVARAMAKRISHNAN ,  Kashif MAQSOOD

IPC: B29C64/268 ,  B29C64/153 ,  B29C64/393 ,  B22F10/28 ,  B22F12/41 ,  B22F10/366 ,  B22F12/49 ,  B28B1/00 ,  B28B17/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B23K26/082 ,  B23K26/06 ,  B23K26/342 ,  B23K26/70

Abstract: An additive manufacturing apparatus includes a platform, a dispenser configured to deliver a plurality of successive layers of feed material onto the platform, at least one light source configured to generate a first light beam and a second light beam, a polygon minor scanner, an actuator, and a galvo minor scanner. The polygon minor scanner is configured to receive the first light beam and reflect the first light beam towards the platform. Rotation of the first polygon mirror causes the light beam to move in a first direction along a path on a layer of feed material on the platform. The actuator is configured to cause the path to move along a second direction at a non-zero angle relative to the first direction. The galvo mirror scanner system is configured to receive the second light beam and reflect the second light beam toward the platform.

公开(公告)号：US20240409449A1

公开(公告)日：2024-12-12

申请号：US18804592

申请日：2024-08-14

Applicant: Applied Materials, Inc.

Inventor： Wei-Sheng LEI ,  Mahendran CHIDAMBARAM ,  Kangkang WANG ,  Ludovic GODET ,  Visweswaren SIVARAMAKRISHNAN

IPC: C03B33/02 ,  B23K26/00 ,  B23K26/0622 ,  B23K26/08 ,  B23K26/55 ,  B23K101/40 ,  B23K103/00 ,  C03B33/10 ,  C03C23/00

Abstract: A method includes forming a plurality of voids within a substrate along a dicing path by exposing the substrate to a first burst of laser pulses at a first location along the dicing path of a respective waveguide combiner. The substrate has a plurality of waveguides. Each laser pulse within the first burst forms a respective void within a first column at the first location to form the plurality of voids. The method further includes exposing the substrate to a second burst of laser pulses at a second location along the dicing path of the respective waveguide combiner. Each laser pulse within the second burst forms the respective void within a second column at the second location to form the plurality of voids. The first column and the second column are spaced by a pitch between a center of the first column and the second column along the dicing path.

公开(公告)号：US20230113276A1

公开(公告)日：2023-04-13

申请号：US17946716

申请日：2022-09-16

Applicant: Applied Materials, Inc.

Inventor： Wei-Sheng LEI ,  Girish Kumar GOPALAKRISHNAN NAIR ,  Kent Qiujing ZHAO ,  Daniel STOCK ,  Tobias STOLLEY ,  Thomas DEPPISCH ,  Jean DELMAS ,  Kenneth S. LEDFORD ,  Subramanya P. HERLE ,  Kiran VACHHANI ,  Mahendran CHIDAMBARAM ,  Roland TRASSL ,  Neil MORRISON ,  Frank SCHNAPPENBERGER ,  Kevin Laughton CUNNINGHAM ,  Stefan BANGERT ,  James CUSHING ,  Visweswaren SIVARAMAKRISHNAN

IPC: H01M50/102

Abstract: Methods and apparatuses for processing lithium batteries with a laser source having a wide process window, high efficiency, and low cost are provided. The laser source is adapted to achieve high average power and a high frequency of picosecond pulses. The laser source can produce a line-shaped beam either in a fixed position or in scanning mode. The system can be operated in a dry room or vacuum environment. The system can include a debris removal mechanism, for example, inert gas flow, to the processing site to remove debris produced during the patterning process.

公开(公告)号：US20210276129A1

公开(公告)日：2021-09-09

申请号：US17183777

申请日：2021-02-24

Applicant: Applied Materials, Inc.

Inventor： Mahendran CHIDAMBARAM ,  Shmuel EREZ ,  Wei-Sheng LEI ,  John RUSCONI

IPC: B23K26/362 ,  B23K26/06

Abstract: A process of producing optical devices is provided including transferring a first substrate comprising one or more devices to a laser dicing tool, the laser dicing tool including a filamentation stage and a singulation stage. One or more device contours are created on the first substrate in the filamentation stage. The optical devices are singulated from the first substrate along the one or more device contours in the singulation stage. The devices are transferred to storage or for further backend processing.