MINIMAL CONTACT GRIPPING OF THIN OPTICAL DEVICES

    公开(公告)号:US20230094653A1

    公开(公告)日:2023-03-30

    申请号:US18061327

    申请日:2022-12-02

    IPC分类号: B25B11/00

    摘要: Embodiments described herein provide for devices and methods for retaining optical devices. The devices and methods described herein provide for retention of the substrate without contacting sensitive portions of the substrate. The devices and methods utilize retention pads or vacuum pins to contact the exclusion zones i.e., inactive areas of the substrate to retain the substrate and prevent the substrate from moving laterally. Additionally, a holding force retains the substrate in the vertical direction, without contacting the substrate. The methods provide for adjusting the devices to account for multiple geometries of the substrate. The methods further provide for adjusting the devices, such as adjusting a gap between the optical device and a suction pad, to alter the holding force of the devices on the optical devices.

    MINIMAL CONTACT GRIPPING OF THIN OPTICAL DEVICES

    公开(公告)号:US20220161396A1

    公开(公告)日:2022-05-26

    申请号:US17237533

    申请日:2021-04-22

    IPC分类号: B25B11/00

    摘要: Embodiments described herein provide for devices and methods for retaining optical devices. The devices and methods described herein provide for retention of the substrate without contacting sensitive portions of the substrate. The devices and methods utilize retention pads or vacuum pins to contact the exclusion zones i.e., inactive areas of the substrate to retain the substrate and prevent the substrate from moving laterally. Additionally, a holding force retains the substrate in the vertical direction, without contacting the substrate. The methods provide for adjusting the devices to account for multiple geometries of the substrate. The methods further provide for adjusting the devices, such as adjusting a gap between the optical device and a suction pad, to alter the holding force of the devices on the optical devices.

    HIGH INDEX EDGE BLACKENING MATERIAL

    公开(公告)号:US20220221723A1

    公开(公告)日:2022-07-14

    申请号:US17647361

    申请日:2022-01-07

    摘要: Embodiments described herein include a waveguide combiner having an edge coated with an optically absorbent composition and a method of coating the edge of the waveguide combiner with the optically absorbent composition. The optically absorbent composition includes one or more types of nanoparticles or microparticles, at least one of one or more dyes or one or more pigments, and a polymer matrix of one or more binders. The method includes producing an optically absorbent formulation. The optically absorbent formulation includes one or more types of particles, at least one of one or more dyes or one or more pigments, one or more binders, and one or more solvents. The optically absorbent formulation is applied on an edge of a waveguide combiner using an edge blackening tool. The formulation is cured with radiation to form the optically absorbent composition.