公开(公告)号：US20230123795A1

公开(公告)日：2023-04-20

申请号：US17945861

申请日：2022-09-15

Applicant: Applied Materials, Inc.

Inventor： Wei-Sheng LEI ,  Zhengping YAO ,  Mahendran CHIDAMBARAM ,  Kangkang WANG ,  Zhihong John LIN ,  Ludovic GODET ,  Visweswaren SIVARAMAKRISHNAN

IPC: B23K26/364 ,  B23K26/0622

Abstract: A method and apparatus for dicing optical devices from a substrate are described herein. The method includes the formation of a plurality of trenches using radiation pulses delivered to the substrate. The radiation pulses are delivered in a pattern to form trenches with varying depth as the trenches extend outward from a top surface of the optical device. The varying depth of the trenches provides edges of each of the optical devices which are slanted. The radiation pulses are UV radiation pulses and are delivered in bursts around the silhouette of the optical devices.

公开(公告)号：US20230011303A1

公开(公告)日：2023-01-12

申请号：US17825136

申请日：2022-05-26

Applicant: Applied Materials, Inc.

Inventor： David Masayuki ISHIKAWA ,  Sumedh Dattatraya ACHARYA ,  Visweswaren SIVARAMAKRISHNAN

IPC: C23C14/56 ,  C23C14/24 ,  C23C14/50

Abstract: An evaporation system for providing a gas for a reactive deposition process, reactive deposition apparatuses, and methods of reactive deposition are provided. The evaporation system in includes a multi-zone diffuser assembly for single or double-sided continuous roll-to-roll or batch coating of web substrates. The diffuser assembly is sized to accommodate at least a portion of a coating drum. The diffuser assembly includes a plurality of interchangeable solid plates and diffuser plates for delivering an evaporated material toward a web substrate. The diffuser plates are fluidly coupled with an evaporation source.

公开(公告)号：US20240014371A1

公开(公告)日：2024-01-11

申请号：US18199749

申请日：2023-05-19

Applicant: Applied Materials, Inc.

Inventor： PrasannaKalleshwara Buddappa RAMACHANDRAPPA ,  Sambhu Nath KUNDU ,  Visweswaren SIVARAMAKRISHNAN ,  Subramanya P. HERLE

IPC: H01M4/04

CPC classification number: H01M4/0435 ,  H01M4/0471 ,  H01M4/0485 ,  H01M2004/027

Abstract: Embodiments of the present disclosure generally relate to battery technology, and more specifically, methods and systems for preparing lithium anodes. In one or more embodiments, a method for producing a lithium intercalated anode includes introducing a sacrificial substrate containing lithium films and an anode substrate containing graphite into a processing region within a chamber. The method also includes combining the sacrificial and anode substrates overlapping one another around a rewinder roller, rotating the rewinder roller to wind the sacrificial and anode substrates together to produce a rolled anode-sacrificial substrate bundle during a winding process. The method also includes heating the sacrificial substrate, the anode substrate, and/or the rolled anode-sacrificial substrate bundle while rotating the rewinder roller and applying a force to the rolled anode-sacrificial substrate bundle via an idle roller during the winding process.

公开(公告)号：US20220372614A1

公开(公告)日：2022-11-24

申请号：US17731565

申请日：2022-04-28

Applicant: Applied Materials, Inc.

Inventor： Sambhu KUNDU ,  PrasannaKalleshwara Buddappa RAMACHANDRAPPA ,  Subramanya P. HERLE ,  Visweswaren SIVARAMAKRISHNAN

IPC: C23C14/56

Abstract: Embodiments of the present disclosure generally relate to flexible substrate fabrication. In particular, embodiments described herein relate to an apparatus and methods for flexible substrate fabrication using nip rollers to improve tension uniformity. In one embodiment, a roller assembly includes a primary roller for transporting a flexible substrate, wherein the primary roller has a first end and a second end, wherein the flexible substrate has a coating disposed hereon, and wherein one or more edge regions are not covered by the coating. The roller assembly further includes a first nip roller disposed at the first end of the primary roller that contacts a first edge region of the one or more edge regions, and a second nip roller disposed at the second end of the primary roller that contacts a second edge region of the one or more edge regions.

公开(公告)号：US20200373188A1

公开(公告)日：2020-11-26

申请号：US16993069

申请日：2020-08-13

Applicant: Applied Materials, Inc.

Inventor： Joseph YUDOVSKY ,  Visweswaren SIVARAMAKRISHNAN ,  Ludovic GODET ,  Rutger MEYER TIMMERMAN THIJSSEN

IPC: H01L21/683 ,  H01L21/687

Abstract: Embodiments described herein relate to a substrate chucking apparatus having a plurality of cavities formed therein. The cavities are formed in a body of the chucking apparatus. In one embodiment, a first plurality of ports are formed in a chucking surface of the body and extend to a bottom surface of the body. In another embodiment, a second plurality of ports are formed in a bottom surface of the plurality of cavities and extend through the body to a bottom surface of the body.

公开(公告)号：US20230002268A1

公开(公告)日：2023-01-05

申请号：US17836162

申请日：2022-06-09

Applicant: Applied Materials, Inc.

Inventor： Wei-Sheng LEI ,  Mahendran CHIDAMBARAM ,  Kangkang WANG ,  Ludovic GODET ,  Visweswaren SIVARAMAKRISHNAN

IPC: C03B33/02 ,  B23K26/0622 ,  B23K26/55

Abstract: A method and apparatus for substrate dicing are described. The method includes utilizing a laser to dice a substrate along a dicing path to form a perforated line around each device within the substrate. The dicing path is created by exposing the substrate to bursts of laser pulses at different locations around each device. The laser pulses are delivered to the substrate and may have a pulse repetition frequency of greater than about 25 MHz, a pulse width of less than about 15 picoseconds, and a laser wavelength of about 1.0 μm to about 5 μm.

公开(公告)号：US20220020590A1

公开(公告)日：2022-01-20

申请号：US16928252

申请日：2020-07-14

Applicant: Applied Materials, Inc.

Inventor： Wei-Sheng LEI ,  Kurtis LESCHKIES ,  Roman GOUK ,  Steven VERHAVERBEKE ,  Visweswaren SIVARAMAKRISHNAN

IPC: H01L21/268 ,  H01L21/768 ,  H01L21/67 ,  H01L21/68 ,  B23K26/00 ,  B23K26/386

Abstract: In an embodiment is provided a method of forming a blind via in a substrate comprising a mask layer, a conductive layer, and a dielectric layer that includes conveying the substrate to a scanning chamber; determining one or more properties of the blind via, the one or more properties comprising a top diameter, a bottom diameter, a volume, or a taper angle of about 80° or more; focusing a laser beam at the substrate to remove at least a portion of the mask layer; adjusting the laser process parameters based on the one or more properties; and focusing the laser beam, under the adjusted laser process parameters, to remove at least a portion of the dielectric layer within the volume to form the blind via. In some embodiments, the mask layer can be pre-etched. In another embodiment is provided an apparatus for forming a blind via in a substrate.

公开(公告)号：US20200071820A1

公开(公告)日：2020-03-05

申请号：US16546170

申请日：2019-08-20

Applicant: Applied Materials, Inc.

Inventor： Subramanya P. HERLE ,  Vicente M. LIM ,  Basavaraj PATTANSHETTY ,  Ajay MORE ,  Marco MOHR ,  Bjoern STICKSEL-WEIS ,  Nilesh Chimanrao BAGUL ,  Visweswaren SIVARAMAKRISHNAN

IPC: C23C16/448 ,  C23C14/24 ,  C23C14/08 ,  C23C16/455 ,  C23C16/50

Abstract: A method and apparatus for direct liquid injection (DLI) of chemical precursors into a processing chamber is provided. The DLI system includes a liquid precursor source vaporization system, which vaporizes liquid stably and efficiently. In one implementation, the DLI system is a closed loop integrated system which combines, an injection valve (IV) along with a Liquid Flow Meter (LFM), an ampoule assembly as a source of pressurized precursor, an inert push gas to pressurize the precursor in the ampoule assembly, a temperature controller to maintain a targeted temperature regime, leak detection and controlled carrier gas flow to gas heater.

公开(公告)号：US20140076236A1

公开(公告)日：2014-03-20

申请号：US14087671

申请日：2013-11-22

Applicant: Applied Materials, Inc.

Inventor： Ramprakash SANKARAKRISHNAN ,  Dale R. DU BOIS ,  Ganesh BALASUBRAMANIAN ,  Karthik JANAKIRAMAN ,  Juan Carlos ROCHA-ALVAREZ ,  Thomas NOWAK ,  Visweswaren SIVARAMAKRISHNAN ,  Hichem M'SAAD

IPC: C23C16/44 ,  F16K31/06

CPC classification number: F16K31/0655 ,  B08B5/00 ,  B08B7/0021 ,  C23C16/4405 ,  C23C16/4409 ,  C23C16/45561 ,  F16K1/221 ,  F16K1/224 ,  F16K31/06 ,  F16K31/088 ,  Y10S438/905

Abstract: A method and apparatus for cleaning a process chamber are provided. In one embodiment, a process chamber is provided that includes a remote plasma source and a process chamber having at least two processing regions. Each processing region includes a substrate support assembly disposed in the processing region, a gas distribution system configured to provide gas into the processing region above the substrate support assembly, and a gas passage configured to provide gas into the processing region below the substrate support assembly. A first gas conduit is configured to flow a cleaning agent from the remote plasma source through the gas distribution assembly in each processing region while a second gas conduit is configured to divert a portion of the cleaning agent from the first gas conduit to the gas passage of each processing region.

Abstract translation: 提供了一种用于清洁处理室的方法和设备。 在一个实施例中，提供了包括远程等离子体源和具有至少两个处理区域的处理室的处理室。 每个处理区域包括设置在处理区域中的基板支撑组件，配置成将气体提供到基板支撑组件上方的处理区域中的气体分配系统，以及构造成将气体提供到基板支撑组件下方的处理区域中的气体通道。 第一气体管道构造成使来自远程等离子体源的清洁剂通过每个处理区域中的气体分配组件流动，而第二气体管道构造成将一部分清洁剂从第一气体导管转移到第一气体导管的气体通道 每个处理区域。

公开(公告)号：US20240409449A1

公开(公告)日：2024-12-12

申请号：US18804592

申请日：2024-08-14

Applicant: Applied Materials, Inc.

Inventor： Wei-Sheng LEI ,  Mahendran CHIDAMBARAM ,  Kangkang WANG ,  Ludovic GODET ,  Visweswaren SIVARAMAKRISHNAN

IPC: C03B33/02 ,  B23K26/00 ,  B23K26/0622 ,  B23K26/08 ,  B23K26/55 ,  B23K101/40 ,  B23K103/00 ,  C03B33/10 ,  C03C23/00

Abstract: A method includes forming a plurality of voids within a substrate along a dicing path by exposing the substrate to a first burst of laser pulses at a first location along the dicing path of a respective waveguide combiner. The substrate has a plurality of waveguides. Each laser pulse within the first burst forms a respective void within a first column at the first location to form the plurality of voids. The method further includes exposing the substrate to a second burst of laser pulses at a second location along the dicing path of the respective waveguide combiner. Each laser pulse within the second burst forms the respective void within a second column at the second location to form the plurality of voids. The first column and the second column are spaced by a pitch between a center of the first column and the second column along the dicing path.