公开(公告)号：US08169090B2

公开(公告)日：2012-05-01

申请号：US11915806

申请日：2006-05-30

申请人： Satoru Katsurayama ,  Yushi Sakamoto ,  Masaya Koda

发明人： Satoru Katsurayama ,  Yushi Sakamoto ,  Masaya Koda

IPC分类号： H01L23/29

CPC分类号： C08G59/40 ,  C08G59/18 ,  C08L63/00 ,  H01L23/293 ,  H01L24/27 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： An encapsulation resin composition for preapplication, comprising (a) an epoxy resin, and (b) a curing agent having flux activity, wherein the tack after B-staging is at least 0 gf/5 mmφ and at most 5 gf/5 mmφ, and the melt viscosity at 130° C. is at least 0.01 Pa·s and at most 1.0 Pa·s; a preapplied encapsulated component and semiconductor device using the composition, and a process of fabrication thereof. The resin composition is less susceptible to air entrapment during provisional placement of semiconductor chips, and excels in workability and reliability.

摘要翻译： 一种用于预应用的封装树脂组合物，包括（a）环氧树脂和（b）具有助焊剂活性的固化剂，其中B阶段后的粘性至少为0gf / 5mm。 至多为5gf /5mmφ，130℃下的熔融粘度为0.01Pa·s以上1.0Pa·s以下。 使用该组合物的预先施加的封装组件和半导体器件及其制造方法。 在半导体芯片的临时放置期间，树脂组合物不易受到空气滞留的影响，并且操作性和可靠性优异。

公开(公告)号：US20110060248A1

公开(公告)日：2011-03-10

申请号：US12866721

申请日：2009-03-18

申请人： Tomotoshi Ishida ,  Yushi Sakamoto

发明人： Tomotoshi Ishida ,  Yushi Sakamoto

IPC分类号： A61B5/103

CPC分类号： G01B21/00 ,  A61B5/0013 ,  A61B5/1113 ,  A61B5/1116 ,  A61B5/6824 ,  A61B5/6828 ,  A61B2503/20 ,  A61B2562/0219 ,  A61B2562/08 ,  G01B21/22 ,  G06T13/40

摘要： Disclosed is a physical configuration detector, a physical configuration detecting program, and a physical configuration detecting method, which can detect the physical configuration of an object, regardless of whether the object is in motion or not, and which can also decrease the amount of work necessary to prepare for dictionaries and the like. A physical configuration detector comprises: a sensor data acquisition unit (121) that acquires sensor data from directional sensors (10) attached to various points on the body a worker; a physical configuration calculator (122) that uses sensor data (113) to calculate the physical configuration which indicate the direction s the various points face; a positional data generator (123) that generates position data for the various points within a space, by using pre-stored shape data (111) and the physical configuration data (114) of the various points; a two-dimensional image generator (124) that generates two-dimensional image data indicating the various points by using position data (115) and shape data (111) for the various points; and a display controller (128) that displays the two-dimensional image data for the various points on a display (103).

摘要翻译： 公开了一种物理配置检测器，物理配置检测程序和物理配置检测方法，其可以检测物体的物理配置，而不管物体是否运动，并且还可以减少工作量 为字典等做准备。 物理配置检测器包括：传感器数据获取单元，其从附接到身体上的各个点的方向传感器（10）获取传感器数据; 使用传感器数据（113）来计算指示各个点所面向的方向s的物理配置的物理配置计算器（122） 通过使用预存储的形状数据（111）和各个点的物理配置数据（114）来生成空间内的各个点的位置数据的位置数据生成器（123） 二维图像生成器，通过使用各个点的位置数据和形状数据，生成表示各点的二维图像数据; 以及显示控制器（128），其在显示器（103）上显示用于各个点的二维图像数据。

公开(公告)号：US20110022432A1

公开(公告)日：2011-01-27

申请号：US12742739

申请日：2008-11-04

申请人： Tomotoshi Ishida ,  Yushi Sakamoto

发明人： Tomotoshi Ishida ,  Yushi Sakamoto

IPC分类号： G06Q10/00

CPC分类号： G06Q10/06 ,  G06Q10/06398

摘要： To measure an action of a worker and analyze the measurement data to determine the type of the action and also determine the type of a work, thereby providing information for improving the work itself. A work information processing apparatus (110) receives, via an antenna (143), detection values obtained by sensors (101A, 101B, 101C); determines, from an action information table, actions corresponding to the received detection values; arranges the actions in time sequence; and determines, from a work dictionary table, a work corresponding to the actions arranged in time sequence, thereby determining the actions and the work for each of workers.

摘要翻译： 测量工作人员的行动并分析测量数据以确定动作的类型，并确定作品的类型，从而提供改进作品本身的信息。 工作信息处理装置（110）经由天线（143）接收由传感器（101A，101B，101C）获得的检测值; 从动作信息表中确定与所接收的检测值对应的动作; 按时间顺序排列动作; 并且从工作字典表确定与按时间顺序排列的动作相对应的工作，从而确定每个工人的动作和工作。

公开(公告)号：US20110254663A1

公开(公告)日：2011-10-20

申请号：US13125125

申请日：2009-06-12

申请人： Yushi Sakamoto ,  Hideaki Suzuki ,  Tomotoshi Ishida ,  Shinichi Taniguchi ,  Masahiro Watanabe

发明人： Yushi Sakamoto ,  Hideaki Suzuki ,  Tomotoshi Ishida ,  Shinichi Taniguchi ,  Masahiro Watanabe

IPC分类号： G08B5/22

CPC分类号： G06Q10/06 ,  G05B19/4183 ,  G05B2219/31286 ,  G05B2219/31432 ,  Y02P90/10

摘要： Although techniques for determining the positions of workers and products and displaying their tracks on a two-dimensional layout were available in the past, they were inconvenient in that work times and process shifts over time could not be grasped. A technique for grasping work contents of a worker highly accurately utilizing electronic tags was also available. However, it was also inconvenient in that the workers had to read the electronic tags intentionally while at work. The work information processor (100) is capable of showing passage of time and process shifts by specifying steps at given points in time by a position sensor (161) attached to a worker. Also represented is a work information processor that stores work content definition information for specifying work contents based on the information detected by the sensor and displays work contents along the passage of time, specifies work contents based on values detected by multiple sensors and the times of said detections according to work content definition information, and specifies work contents according to pieces of work content definition information.

摘要翻译： 虽然过去可以使用确定工人和产品的位置以及在二维布局上显示轨迹的方法，但是在工作时间上并不方便，而且随着时间的推移，流程的变化是无法理解的。 也可以使用高精度地利用电子标签来掌握作业内容的技术。 然而，工作上也要不得不刻意阅读电子标签也是不方便的。 工作信息处理器（100）能够通过由附加到工作者的位置传感器（161）指定给定时间点的步骤来显示时间和处理偏移的通过。 还表示了工作信息处理器，其基于由传感器检测到的信息来存储用于指定工作内容的工作内容定义信息，并且随着时间的推移显示工作内容，基于由多个传感器检测到的值和所述多个传感器的时间来指定工作内容 根据工作内容定义信息进行检测，并根据工作内容定义信息指定工作内容。

公开(公告)号：US20080042272A1

公开(公告)日：2008-02-21

申请号：US11793816

申请日：2006-03-09

申请人： Mitsuo Sugino ,  Takeshi Hosomi ,  Yushi Sakamoto

发明人： Mitsuo Sugino ,  Takeshi Hosomi ,  Yushi Sakamoto

IPC分类号： H01L23/52

CPC分类号： H01L23/5329 ,  H01L21/563 ,  H01L23/14 ,  H01L23/5222 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/05085 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01059 ,  H01L2924/01061 ,  H01L2924/01073 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/10253 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/01083 ,  H01L2924/00

摘要： A semiconductor device 100 has a BGA substrate 110, a semiconductor chip 101, a bump 106 and an underfill 108 filling the periphery of the bump. An interlayer dielectric 104 in the semiconductor chip 101 contains a low dielectric constant film. The bump 106 is comprised of a lead-free solder. The underfill 108 is comprised of a resin material having an elastic modulus of 150 MPa to 800 MPa both inclusive, and a linear expansion coefficient of the BGA substrate 110 in an in-plane direction of the substrate is less than 14 ppm/° C.

摘要翻译： 半导体器件100具有填充凸起周边的BGA衬底110，半导体芯片101，凸块106和底部填充108。 半导体芯片101中的层间电介质104包含低介电常数膜。 凸块106由无铅焊料构成。 底部填充物108由弹性模量为150MPa〜800MPa的树脂材料构成，BGA基板110的面内方向的线膨胀系数小于14ppm /℃。

公开(公告)号：US06562482B1

公开(公告)日：2003-05-13

申请号：US09630266

申请日：2000-08-01

申请人： Yushi Sakamoto

发明人： Yushi Sakamoto

IPC分类号： H01L2912

CPC分类号： C08G59/628 ,  Y10T428/12528

摘要： A liquid potting composition, a semiconductor device manufactured using such composition and a process for manufacturing a semiconductor device using such composition. The liquid potting composition comprises: (a) a liquid epoxy resin; (b) a hardener comprising a multi-hydroxy aromatic compound containing at least two hydroxy groups and at least one carboxyl group; and (c) an accelerator. Suitable hardening agents include 2,3-dihydroxybenzoic acid; 2,4-dihydroxybenzoic acid; 2,5-dihydroxybenzoic acid; 3,4-dihydroxybenzoic acid; gallic acid; 1,4-dihydroxy-2-naphthoic acid; 3,5-dihydroxy-2-naphthoic acid; phenolphthaline; diphenolic acid and mixtures thereof.

摘要翻译： 液体灌封组合物，使用这种组合物制造的半导体器件和使用这种组合物制造半导体器件的方法。 液体灌封组合物包括：（a）液体环氧树脂; （b）包含含有至少两个羟基和至少一个羧基的多羟基芳族化合物的固化剂; 和（c）加速器。 合适的硬化剂包括2,3-二羟基苯甲酸; 2,4-二羟基苯甲酸; 2,5-二羟基苯甲酸; 3,4-二羟基苯甲酸 没食子酸 1,4-二羟基-2-萘甲酸; 3,5-二羟基-2-萘甲酸; 酚酞; 二酚酸及其混合物。

公开(公告)号：US4571314A

公开(公告)日：1986-02-18

申请号：US664018

申请日：1984-10-23

申请人： Setsuo Suzuki ,  Koji Morishita ,  Yushi Sakamoto

发明人： Setsuo Suzuki ,  Koji Morishita ,  Yushi Sakamoto

IPC分类号： B29C39/20 ,  B29K63/00 ,  B29L9/00 ,  C08G59/22 ,  C08G59/24 ,  C09D4/00 ,  G11B7/253 ,  G11B23/00 ,  B29D11/00

CPC分类号： G11B7/2542 ,  C08G59/226 ,  C08G59/24 ,  C09D4/00 ,  G11B23/0092 ,  G11B7/2533 ,  G11B7/252 ,  Y10T428/31515

摘要： A process for producing a substrate for optical recording medium (optical disk recording medium), which comprises coating at least one inner surface of a casting mold with a radiation-curable or thermosetting resin, curing the resin to form a coating film on the mold surface or surfaces, casting into the mold an epoxy resin composition comprising an alicyclic epoxy resin or a mixture of an alicyclic epoxy resin and an aromatic epoxy resin, an organic polybasic acid anhydride, a curing accelerator and an anti-discoloring (anti-oxidative) agent, curing the epoxy resin composition to transfer the coating film of the mold to the surface of the cured product of the epoxy resin composition, thereby forming a double or triple layer cast laminate. The above casting mold may have a mold-releasing film on the inner surfaces and the coating film may be formed on this mold-releasing film.

摘要翻译： 一种用于制造光记录介质（光盘记录介质）的基板的方法，其包括用辐射固化或热固性树脂涂覆铸模的至少一个内表面，固化树脂以在模具表面上形成涂膜 或表面，将包含脂环族环氧树脂或脂环族环氧树脂和芳族环氧树脂的混合物的环氧树脂组合物，有机多元酸酐，固化促进剂和抗变色（抗氧化剂）剂浇铸到模具中 固化环氧树脂组合物以将模具的涂膜转移到环氧树脂组合物的固化产物的表面，从而形成双层或三层铸塑层压板。 上述铸模可以在内表面上具有脱模膜，并且可以在该脱模膜上形成涂膜。

公开(公告)号：US07759794B2

公开(公告)日：2010-07-20

申请号：US11793816

申请日：2006-03-09

申请人： Mitsuo Sugino ,  Takeshi Hosomi ,  Yushi Sakamoto

发明人： Mitsuo Sugino ,  Takeshi Hosomi ,  Yushi Sakamoto

IPC分类号： H01L23/48 ,  H01L23/29

CPC分类号： H01L23/5329 ,  H01L21/563 ,  H01L23/14 ,  H01L23/5222 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/05085 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01059 ,  H01L2924/01061 ,  H01L2924/01073 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/10253 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/01083 ,  H01L2924/00

摘要： A semiconductor device 100 has a BGA substrate 110, a semiconductor chip 101, a bump 106 and an underfill 108 filling the periphery of the bump. An interlayer dielectric 104 in the semiconductor chip 101 contains a low dielectric constant film. The bump 106 is comprised of a lead-free solder. The underfill 108 is comprised of a resin material having an elastic modulus of 150 MPa to 800 MPa both inclusive, and a linear expansion coefficient of the BGA substrate 110 in an in-plane direction of the substrate is less than 14 ppm/° C.

摘要翻译： 半导体器件100具有填充凸起周边的BGA衬底110，半导体芯片101，凸块106和底部填充108。 半导体芯片101中的层间电介质104包含低介电常数膜。 凸块106由无铅焊料构成。 底部填充物108由弹性模量为150MPa〜800MPa的树脂材料构成，BGA基板110的面内方向的线膨胀系数小于14ppm /℃。

公开(公告)号：US20090166897A1

公开(公告)日：2009-07-02

申请号：US11915806

申请日：2006-05-30

申请人： Satoru Katsurayama ,  Yushi Sakamoto ,  Masaya Koda

发明人： Satoru Katsurayama ,  Yushi Sakamoto ,  Masaya Koda

IPC分类号： H01L23/29 ,  H01L21/78 ,  C08L63/00 ,  C08K5/101

CPC分类号： C08G59/40 ,  C08G59/18 ,  C08L63/00 ,  H01L23/293 ,  H01L24/27 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： An encapsulation resin composition for preapplication, comprising (a) an epoxy resin, and (b) a curing agent having flux activity, wherein the tack after B-staging is at least 0 gf/5 mmφ and at most 5 gf/5 mmφ, and the melt viscosity at 130° C. is at least 0.01 Pa·s and at most 1.0 Pa·s; a preapplied encapsulated component and semiconductor device using the composition, and a process of fabrication thereof. The resin composition is less susceptible to air entrapment during provisional placement of semiconductor chips, and excels in workability and reliability.

摘要翻译： 一种用于预应用的封装树脂组合物，其包含（a）环氧树脂和（b）具有助焊剂活性的固化剂，其中B阶段后的粘性为至少0gf / 5mm 2和至多5gf / 130℃下的熔体粘度为至少0.01Pa.s且至多1.0Pa.s; 使用该组合物的预先施加的封装组件和半导体器件及其制造方法。 在半导体芯片的临时放置期间，树脂组合物不易受到空气滞留的影响，并且操作性和可靠性优异。

公开(公告)号：US5908881A

公开(公告)日：1999-06-01

申请号：US965407

申请日：1997-11-06

申请人： Yushi Sakamoto

发明人： Yushi Sakamoto

IPC分类号： C08G59/14 ,  C08G59/62 ,  C08K3/08

CPC分类号： C08G59/621 ,  C08G59/145 ,  C08K3/08 ,  H01L2924/0002

摘要： The object of the present invention is to provide a paste for bonding a semiconductor, which has excellent low stress and excellent heat conductivity and is useful industrially. The object has been achieved by a heat-conductive paste comprising(A) an epoxy resin which is liquid at room temperature and which has at least two epoxy groups in the molecule,(B) an epoxy group-containing reactive diluent having a viscosity of 100 cp or less at room temperature,(C) a phenolic compound as a curing agent represented by the following general formula (1), which is crystalline at room temperature: ##STR1## wherein R is hydrogen atom or an alkyl group of 1-5 carbon atoms, and (D) a silver powder,wherein the amount of the silver powder (D) is 70-90% by weight of the total paste; the silver powder (D) contains an atomized silver powder consisting of flake-shaped particles having longitudinal lengths ranging from 10.mu. to 50.mu. and thicknesses ranging from 1.mu. to 5.mu., in an amount of at least 30% by weight of the total silver powder; and the paste is produced by first melt-mixing the component (C) with the components (A) and (B) or with the component (B), and then kneading the resulting mixture with the component (D) or with the components (D) and (A).

摘要翻译： 本发明的目的是提供一种用于粘合半导体的糊状物，其具有优异的低应力和优异的导热性并且在工业上是有用的。 该目的已经通过导热膏实现，其包括（A）在室温下为液体并且在分子中具有至少两个环氧基的环氧树脂，（B）含环氧基的反应性稀释剂，其粘度为 室温下为100cp以下，（C）作为下述通式（1）表示的固化剂的酚类化合物，其在室温下为结晶性：其中R为氢原子或1-5个碳原子的烷基 ，和（D）银粉末，其中银粉末（D）的量为总糊料的70-90重量％ 银粉（D）含有雾化的银粉末，其由纵向长度为10至50微米且厚度范围为1至5微米的片状颗粒组成，其量为总量的至少30重量％ 银粉; 通过首先将组分（C）与组分（A）和（B）或组分（B）熔融混合，然后将所得混合物与组分（D）或组分（D）混合， D）和（A）。