Abstract:
To improve the performance of semiconductor devices. Over an n+-type semiconductor region for source/drain of an n-channel type MISFET and a first gate electrode, and over a p+-type semiconductor region for source/drain of a p-channel type MISFET and a second gate electrode, which are formed over a semiconductor substrate, a metal silicide layer including nickel platinum silicide is formed by a salicide process. After that, a tensile stress film is formed over the whole face of the semiconductor substrate, and then the tensile stress film over the p-channel type MISFET is removed by dry-etching, and, after a compression stress film is formed over the whole face of the semiconductor substrate, the compression stress film over the n-channel type MISFET is removed by dry-etching. The Pt concentration in the metal silicide layer is highest at the surface, and becomes lower as the depth from the surface increases.
Abstract:
An electronic flow meter includes a magnetic sensor, phase-A and phase-B drivers, a phase-A comparator, a phase-B comparator, a two-phase encoder, and a rotational speed timer. The two-phase encoder determines a normal/reverse direction where the impeller is rotated based on event signals sampled by the phase-A and the phase-B comparators, respectively, causing a counter to count up or to count down according to the normal/reverse direction as determined, thereby outputting an event count signal. The rotational speed timer calculates a rotational frequency of the impeller from the event count signal outputted by the two-phase encoder and sets frequencies of respective sampling signals of the phase-A and the phase-B comparators at a time when the rotational frequency of the impeller is measured next, and respective drive periods of the phase-A and the phase-B drivers in accordance with the rotational frequency of the impeller as calculated.
Abstract:
To improve the performance of semiconductor devices. Over an n+-type semiconductor region for source/drain of an n-channel type MISFET and a first gate electrode, and over a p+-type semiconductor region for source/drain of a p-channel type MISFET and a second gate electrode, which are formed over a semiconductor substrate, a metal silicide layer including nickel platinum silicide is formed by a salicide process. After that, a tensile stress film is formed over the whole face of the semiconductor substrate, and then the tensile stress film over the p-channel type MISFET is removed by dry-etching, and, after a compression stress film is formed over the whole face of the semiconductor substrate, the compression stress film over the n-channel type MISFET is removed by dry-etching. The Pt concentration in the metal silicide layer is highest at the surface, and becomes lower as the depth from the surface increases.
Abstract:
An electronic flow meter includes a magnetic sensor, phase-A and phase-B drivers, a phase-A comparator, a phase-B comparator, a two-phase encoder, and a rotational speed timer. The two-phase encoder determines a normal/reverse direction where the impeller is rotated based on event signals sampled by the phase-A and the phase-B comparators, respectively, causing a counter to count up or to count down according to the normal/reverse direction as determined, thereby outputting an event count signal. The rotational speed timer calculates a rotational frequency of the impeller from the event count signal outputted by the two-phase encoder and sets frequencies of respective sampling signals of the phase-A and the phase-B comparators at a time when the rotational frequency of the impeller is measured next, and respective drive periods of the phase-A and the phase-B drivers in accordance with the rotational frequency of the impeller as calculated.
Abstract:
The present invention aims at offering the filled structure of an oxide film etc. which can form an insulating film (oxide film) without void in a predetermined depressed portion by an economical and practical method and without increasing RF bias. According to the first invention, the oxide film filled structure is provided with the foundation (silicon substrate) having a depressed portion (trench), and the oxide film (silicon oxide film) formed in the depressed portion concerned. Here, the oxide film concerned includes the silicon oxide film region of silicon-richness in part at least.
Abstract:
A method for cultivation of Lyophyllum ulmarium to form a fruiting body. The Lyophyllum ulmarium is a strain capable of forming a white fruiting body with or without indistinct darker spots around the center thereof. Also provided is a strain of Lyophyllum ulmarium capable of forming such a white fruiting body.
Abstract:
A vehicle lighting device in which a housing having a concave portion, which is opened forward, and a lens for covering a front opening of the housing are joined together by a laser welding, wherein the housing is formed of a thermoplastic resin of a chromatic color, and carbon of 0.01 to 0.1% is contained in the thermoplastic resin of the chromatic color.
Abstract:
First, an first insulating film is formed along surfaces of a plurality of combinations of an gate electrode and an gate insulating films, and a semiconductor substrate, respectively. Then, on the first insulating film, an second insulating film different from the first insulating film is formed. The steps of forming the first insulating film and forming the second insulating film are alternately repeated until a concave formed by the surface of an later insulating film, which is a film formed later out of the first insulating film and the second insulating film, is positioned above the upper surface of the gate electrode. Thereafter, a third insulating film is formed on the later insulating film. Thus, a semiconductor device with high reliability can be obtained by improving a state of the insulating film formed between the gate electrodes.
Abstract:
A vehicle lighting device in which a housing having a concave portion, which is opened forward, and a lens for covering a front opening of the housing are joined together by a laser welding, wherein the housing is formed of a thermoplastic resin of a chromatic color, and carbon of 0.01 to 0.1% is contained in the thermoplastic resin of the chromatic color.
Abstract:
A manufacturing method of a semiconductor device is provided which can uniformly form a good and thin silicon oxide film or the like at a relatively low temperature. In step 1, a semiconductor substrate is exposed to monosilane (SiH4). Then, in step 2, the remaining monosilane (SiH4) is emitted. In step 3, the semiconductor substrate is exposed to nitrous oxide plasma. A desired silicon oxide film is formed by repeating one cycle including steps 1 to 3 until a necessary thickness of the film is obtained.