公开(公告)号：US20120285731A1

公开(公告)日：2012-11-15

申请号：US13459606

申请日：2012-04-30

申请人： Hiroaki KATSURA ,  Koso Matsuno ,  Yoji Ueda

发明人： Hiroaki KATSURA ,  Koso Matsuno ,  Yoji Ueda

IPC分类号： H05K1/02 ,  B32B37/12 ,  B32B38/16 ,  B32B37/14 ,  B32B37/06

CPC分类号： H01J11/10 ,  H01J9/32 ,  H01J11/48 ,  Y10T156/10

摘要： An electrode bonding structure sealed with a sealing resin, in which a flexible substrate is bonded to a first substrate via an adhesive, wherein: a region along a bottom face edge of an flexible substrate end part is bonded, via the adhesive, to an inner side region of a region along a top face edge of an first substrate end part; a gap is formed between an inner side region of the region along the bottom face edge of the flexible substrate end part and the region along the top face edge of the first substrate end part; the sealing resin is formed so as to enter, while covering a top face of the flexible substrate end part, at least a portion of the gap; and a height of the gap gets smaller towards the adhesive from the top face edge of the first substrate end part.

摘要翻译： 一种用密封树脂密封的电极接合结构，其中通过粘合剂将柔性基板结合到第一基板，其中：沿着柔性基板端部的底面边缘的区域经由粘合剂粘合到内部 沿着第一基板端部的顶面边缘的区域的侧面区域; 沿着柔性基板端部的底面边缘的区域的内侧区域和沿着第一基板端部的顶面边缘的区域之间形成间隙; 密封树脂形成为在覆盖柔性基板端部的顶面的同时进入间隙的至少一部分; 并且所述间隙的高度从所述第一基板端部的顶面边缘朝向所述粘合剂变小。

公开(公告)号：US20090032285A1

公开(公告)日：2009-02-05

申请号：US11814698

申请日：2005-01-27

申请人： Yoji Ueda ,  Susumu Matsuoka ,  Rikiya Okimoto ,  Shozo Ochi ,  Satoru Tomekawa

发明人： Yoji Ueda ,  Susumu Matsuoka ,  Rikiya Okimoto ,  Shozo Ochi ,  Satoru Tomekawa

IPC分类号： H05K3/46 ,  H05K1/14 ,  H05K1/00

CPC分类号： H05K1/024 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4652 ,  H05K2201/0191 ,  H05K2201/0355 ,  H05K2201/09318 ,  H05K2201/09327 ,  H05K2201/10378 ,  H05K2203/061 ,  H05K2203/1461 ,  Y10T428/24843

摘要： A method of manufacturing a multilayered circuit board includes the steps of: manufacturing a laminated body by laminating a prepreg of a predetermined thickness on at least one surface of a double-sided circuit board having a grounding link and a signal wiring patterned on both surfaces thereof; and applying heat and pressure to the laminated body and completing a layered structure in which the signal wiring is laid inside the prepreg at a boundary between the double-sided circuit board and the prepreg, wherein prepreg sheets of a predetermined thickness are used in a completed layered structure so that a thickness of a prepreg of the double-sided circuit board is smaller than a distance between a surface of the prepreg on a side not opposed to the double-sided circuit board and the signal wiring laid inside the prepreg.

摘要翻译： 一种制造多层电路板的方法包括以下步骤：通过在具有接地链路的双面电路板和在其两个表面上图案化的信号布线的至少一个表面层压预定厚度的预浸料来制造层压体 ; 并且对层压体施加热和压力，并且完成在双面电路板和预浸料坯之间的边界处将信号布线放置在预浸料坯内部的层状结构，其中预定厚度的预浸料片材用于完成 使得双面电路板的预浸料坯的厚度小于与双面电路板不相对的一侧上的预浸料坯的表面与布置在预浸料坯内部的信号线之间的距离。

公开(公告)号：US20080186045A1

公开(公告)日：2008-08-07

申请号：US12023144

申请日：2008-01-31

申请人： Yoji UEDA ,  Tsukasa SHIRAISHI ,  Yositake HAYASHI ,  Rikiya OKIMOTO

发明人： Yoji UEDA ,  Tsukasa SHIRAISHI ,  Yositake HAYASHI ,  Rikiya OKIMOTO

IPC分类号： G01R31/02 ,  H05K1/00 ,  H05K3/36

CPC分类号： H05K3/4638 ,  H05K1/0268 ,  H05K1/116 ,  H05K3/4623 ,  H05K2201/0969 ,  H05K2201/09781 ,  Y10T29/49126

摘要： An inspection mark structure has an inspection via hole, which is provided in substrate sheets to be heat-pressed constituting at least two layers of laminates; a round pattern electrode, which is formed on one main face side of the substrate sheet provided with the inspection via hole, and provided around the end face of the inspection via hole at such a predetermined distance as not to come into contact with the end face; and a conduction electrode, which is formed on the other main face side of the substrate sheet provided with the inspection via hole, and provided so as to be electrically connected with the end face of the inspection via hole.

摘要翻译： 检查标记结构具有检查通孔，其设置在构成至少两层层压体的被加热的基板中; 圆形图案电极，其形成在设置有检查通孔的基板的一个主面侧上，并且设置在检查通孔的端面周围以不与端面接触的预定距离 ; 以及导电电极，其形成在设置有检查通孔的基板的另一主面侧，并且设置成与检查通孔的端面电连接。

公开(公告)号：US07155820B2

公开(公告)日：2007-01-02

申请号：US10695302

申请日：2003-10-27

申请人： Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Tousaku Nishiyama ,  Shozo Ochi

发明人： Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Tousaku Nishiyama ,  Shozo Ochi

IPC分类号： H01K3/10 ,  H01R12/04

CPC分类号： H05K3/4069 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4652 ,  H05K2201/0266 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

摘要： The present invention provides a method of manufacturing a printed circuit board, which includes preparing a dielectric substrate, coating surfaces of the dielectric substrate, filling a via hole with a conductor, peeling mold-releasing films, compressing the dielectric substrate and forming metal foils. The dielectric substrate has patterned wiring layers on both surfaces, and the wiring layers are connected electrically with each other by the conductor. The dielectric substrate is made of a glass cloth or a glass nonwoven fabric impregnated with a thermosetting epoxy resin mixed with fine particles, and the conductive filler in the conductor has an average particle diameter larger than that of the fine particles. Accordingly, the printed circuit board has an improved moisture resistance as a whole and also excellent connection reliability and repair resistance. In addition, the dielectric substrate of the printed circuit board has an improved mechanical strength such as flexural rigidity.

摘要翻译： 本发明提供一种制造印刷电路板的方法，其包括制备电介质基板，电介质基板的涂层表面，用导体填充通孔，剥离脱模膜，压缩电介质基板和形成金属箔。 电介质基板在两表面上具有图案化的布线层，并且布线层通过导体彼此电连接。 电介质基板由玻璃布或浸渍有与微粒混合的热固性环氧树脂的玻璃无纺布制成，并且导体中的导电填料的平均粒径大于微粒的平均粒径。 因此，印刷电路板整体上具有改善的耐湿性，并且还具有优异的连接可靠性和修复电阻。 此外，印刷电路板的电介质基板具有改善的机械强度，例如弯曲刚度。

公开(公告)号：US06518514B2

公开(公告)日：2003-02-11

申请号：US09928869

申请日：2001-08-13

申请人： Takeshi Suzuki ,  Tatsuo Ogawa ,  Yoshihiro Bessho ,  Satoru Tomekawa ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Susumu Matsuoka ,  Daizo Andoh ,  Fumio Echigo

发明人： Takeshi Suzuki ,  Tatsuo Ogawa ,  Yoshihiro Bessho ,  Satoru Tomekawa ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Susumu Matsuoka ,  Daizo Andoh ,  Fumio Echigo

IPC分类号： H01R1204

CPC分类号： H05K1/0373 ,  H05K1/036 ,  H05K3/20 ,  H05K3/202 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2203/1461 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

摘要： A circuit board is configured so as to include not less than two wiring layers, an insulator layer for electric insulation between the wiring layers, and an inner-via-hole conductive member provided in the insulator layer in a thickness direction of the insulator layer, for electric connection between the wiring layers. The insulator layer is made of a composite material containing an organic resin and a material having a smaller thermal expansion coefficient than that of the organic resin, and includes a surface part, a core part, and a surface part laminated in the stated order, the surface part having a high content of the organic resin, the core part having a low content of the organic resin. The wiring layers have a land portion that is connected with the inner-via-hole conductive member, the land portion being embedded so as to be substantially in contact with the core part, and the inner-via-hole conductive member has a thickness substantially equal to a thickness of the core part. According to this configuration, a part of the metal foil is embedded in the insulator layer so as to be in contact with the core layer. Therefore, this makes it possible to provide a circuit board in which portions of the conductive material can be selectively compressed, and which hence is capable of ensuring stable connection between layers.

公开(公告)号：US20060081397A1

公开(公告)日：2006-04-20

申请号：US11079373

申请日：2005-03-14

申请人： Kouhei Enchi ,  Yoji Ueda

发明人： Kouhei Enchi ,  Yoji Ueda

IPC分类号： H05K7/06

CPC分类号： H05K1/165 ,  H01F17/0013 ,  H01F17/0033 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/086 ,  H05K2201/097 ,  H05K2201/10416

摘要： A multilayer circuit board includes: two or more layers of electrical insulative base members; and two or more layers of conductive patterned layers. At least two of the conductive patterned layers include coil patterns that will be a part of a coil, through holes are provided at predetermined positions of the electrical insulative base members, the positions being sandwiched between the coil patterns, so as to enable communication between respective end portions of the coil patterns, and conductive paste charged in the through holes allows electrical connection to be established between the respective end portions. The coil is formed so as to be wound in a direction perpendicular to a thickness direction of the multilayer circuit board. With this configuration, a multilayer circuit board can be provided, which facilitates increasing the winding number of a coil and has excellent flexibility of circuit design.

摘要翻译： 多层电路板包括：两层或多层电绝缘基底构件; 和两层或多层导电图案层。 导电图案化层中的至少两个包括将是线圈的一部分的线圈图案，通孔设置在电绝缘基底构件的预定位置处，该位置被夹在线圈图案之间，以便使各个 线圈图案的端部，以及填充在通孔中的导电浆料允许在各个端部之间建立电连接。 线圈被形成为沿与多层电路板的厚度方向垂直的方向缠绕。 利用这种结构，可以提供多层电路板，这有助于增加线圈的绕组数，并且具有优异的电路设计灵活性。

公开(公告)号：US06753483B2

公开(公告)日：2004-06-22

申请号：US09879385

申请日：2001-06-12

申请人： Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Tousaku Nishiyama ,  Shozo Ochi

发明人： Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Tousaku Nishiyama ,  Shozo Ochi

IPC分类号： H01R1204

CPC分类号： H05K3/4069 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4652 ,  H05K2201/0266 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

摘要： The present invention provides a printed circuit board, which includes a dielectric substrate having via holes formed in the thickness direction, and a conductor including a conductive filler is filled in the via holes. The dielectric substrate has patterned wiring layers on both surfaces, and the wiring layers are connected electrically with each other by the conductor. The dielectric substrate is made of a glass cloth or a glass nonwoven fabric impregnated with a thermosetting epoxy resin mixed with fine particles, and the conductive filler in the conductor has an average particle diameter larger than that of the fine particles. Accordingly, the printed circuit board has an improved moisture resistance as a whole and also excellent connection reliability and repair resistance. In addition, the dielectric substrate of the printed circuit board has an improved mechanical strength such as flexural rigidity. The present invention also provides a method of manufacturing such a printed circuit board.

摘要翻译： 本发明提供了一种印刷电路板，其包括具有沿厚度方向形成的通孔的电介质基板，并且包含导电填料的导体填充在通孔中。 电介质基板在两表面上具有图案化的布线层，并且布线层通过导体彼此电连接。 电介质基板由玻璃布或浸渍有与微粒混合的热固性环氧树脂的玻璃无纺布制成，并且导体中的导电填料的平均粒径大于微粒的平均粒径。 因此，印刷电路板整体上具有改善的耐湿性，并且还具有优异的连接可靠性和修复电阻。 此外，印刷电路板的电介质基板具有改善的机械强度，例如弯曲刚度。 本发明还提供一种制造这种印刷电路板的方法。

公开(公告)号：US06691409B2

公开(公告)日：2004-02-17

申请号：US10280964

申请日：2002-10-25

申请人： Takeshi Suzuki ,  Tatsuo Ogawa ,  Yoshihiro Bessho ,  Satoru Tomekawa ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Susumu Matsuoka ,  Daizo Andoh ,  Fumio Echigo

发明人： Takeshi Suzuki ,  Tatsuo Ogawa ,  Yoshihiro Bessho ,  Satoru Tomekawa ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Susumu Matsuoka ,  Daizo Andoh ,  Fumio Echigo

IPC分类号： H01K300

CPC分类号： H05K1/0373 ,  H05K1/036 ,  H05K3/20 ,  H05K3/202 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2203/1461 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

摘要： A circuit board is configured so as to include not less than two wiring layers, an insulator layer for electric insulation between the wiring layers, and an inner-via-hole conductive member provided in the insulator layer in a thickness direction of the insulator layer, for electric connection between the wiring layers. The insulator layer is made of a composite material containing an organic resin and a material having a smaller thermal expansion coefficient than that of the organic resin, and includes a surface part, a core part, and a surface part laminated in the stated order, the surface part having a high content of the organic resin, the core part having a low content of the organic resin. The wiring layers have a land portion that is connected with the inner-via-hole conductive member, the land portion being embedded so as to be substantially in contact with the core part, and the inner-via-hole conductive member has a thickness substantially equal to a thickness of the core part. According to this configuration, a part of the metal foil is embedded in the insulator layer so as to be in contact with the core layer. Therefore, this makes it possible to provide a circuit board in which portions of the conductive material can be selectively compressed, and which hence is capable of ensuring stable connection between layers.

摘要翻译： 电路板被构造成在布线层之间包括不少于两个布线层，用于电绝缘的绝缘体层和在绝缘体层的厚度方向上设置在绝缘体层中的内通孔导电构件， 用于布线层之间的电连接。 绝缘体层由包含有机树脂和热膨胀系数小于有机树脂的材料的复合材料制成，并且包括以所述顺序层压的表面部分，芯部分和表面部分， 表面部分具有高含量的有机树脂，芯部分的有机树脂含量低。 所述布线层具有与所述内通孔导电部件连接的台面部，所述接合部嵌入以与所述芯部大体接触，所述内通孔导电部件的厚度基本上 等于芯部的厚度。 根据该结构，将金属箔的一部分嵌入到绝缘体层中以与芯层接触。 因此，能够提供能够选择性地压缩导电材料的部分的电路基板，由此能够确保层之间的稳定的连接。

公开(公告)号：US08867228B2

公开(公告)日：2014-10-21

申请号：US13459606

申请日：2012-04-30

申请人： Hiroaki Katsura ,  Koso Matsuno ,  Yoji Ueda

发明人： Hiroaki Katsura ,  Koso Matsuno ,  Yoji Ueda

IPC分类号： H01R9/00 ,  H01J11/48 ,  H01J9/32 ,  H01J11/10

CPC分类号： H01J11/10 ,  H01J9/32 ,  H01J11/48 ,  Y10T156/10

摘要： An electrode bonding structure sealed with a sealing resin, in which a flexible substrate is bonded to a first substrate via an adhesive, wherein: a region along a bottom face edge of an flexible substrate end part is bonded, via the adhesive, to an inner side region of a region along a top face edge of an first substrate end part; a gap is formed between an inner side region of the region along the bottom face edge of the flexible substrate end part and the region along the top face edge of the first substrate end part; the sealing resin is formed so as to enter, while covering a top face of the flexible substrate end part, at least a portion of the gap; and a height of the gap gets smaller towards the adhesive from the top face edge of the first substrate end part.

摘要翻译： 一种用密封树脂密封的电极接合结构，其中通过粘合剂将柔性基板结合到第一基板，其中：沿着柔性基板端部的底面边缘的区域经由粘合剂粘合到内部 沿着第一基板端部的顶面边缘的区域的侧面区域; 沿着柔性基板端部的底面边缘的区域的内侧区域和沿着第一基板端部的顶面边缘的区域之间形成间隙; 密封树脂形成为在覆盖柔性基板端部的顶面的同时进入间隙的至少一部分; 并且所述间隙的高度从所述第一基板端部的顶面边缘朝向所述粘合剂变小。

公开(公告)号：US07423884B2

公开(公告)日：2008-09-09

申请号：US11079373

申请日：2005-03-14

申请人： Kouhei Enchi ,  Yoji Ueda

发明人： Kouhei Enchi ,  Yoji Ueda

IPC分类号： H05K1/18

CPC分类号： H05K1/165 ,  H01F17/0013 ,  H01F17/0033 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/086 ,  H05K2201/097 ,  H05K2201/10416

摘要： A multilayer circuit board includes: two or more layers of electrical insulative base members; and two or more layers of conductive patterned layers. At least two of the conductive patterned layers include coil patterns that will be a part of a coil, through holes are provided at predetermined positions of the electrical insulative base members, the positions being sandwiched between the coil patterns, so as to enable communication between respective end portions of the coil patterns, and conductive paste charged in the through holes allows electrical connection to be established between the respective end portions. The coil is formed so as to be wound in a direction perpendicular to a thickness direction of the multilayer circuit board. With this configuration, a multilayer circuit board can be provided, which facilitates increasing the winding number of a coil and has excellent flexibility of circuit design.

摘要翻译： 多层电路板包括：两层或多层电绝缘基底构件; 和两层或多层导电图案层。 导电图案化层中的至少两个包括将是线圈的一部分的线圈图案，通孔设置在电绝缘基底构件的预定位置处，该位置被夹在线圈图案之间，以便使各个 线圈图案的端部，以及填充在通孔中的导电浆料允许在各个端部之间建立电连接。 线圈被形成为沿与多层电路板的厚度方向垂直的方向缠绕。 利用这种结构，可以提供多层电路板，这有助于增加线圈的绕组数，并且具有优异的电路设计灵活性。