发明申请
US20120285731A1 ELECTRODE BONDING STRUCTURE, AND MANUFACTURING METHOD FOR ELECTRODE BONDING STRUCTURE 有权
电极结合结构及电极结合结构的制造方法

ELECTRODE BONDING STRUCTURE, AND MANUFACTURING METHOD FOR ELECTRODE BONDING STRUCTURE
摘要:
An electrode bonding structure sealed with a sealing resin, in which a flexible substrate is bonded to a first substrate via an adhesive, wherein: a region along a bottom face edge of an flexible substrate end part is bonded, via the adhesive, to an inner side region of a region along a top face edge of an first substrate end part; a gap is formed between an inner side region of the region along the bottom face edge of the flexible substrate end part and the region along the top face edge of the first substrate end part; the sealing resin is formed so as to enter, while covering a top face of the flexible substrate end part, at least a portion of the gap; and a height of the gap gets smaller towards the adhesive from the top face edge of the first substrate end part.
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