公开(公告)号：US08916893B2

公开(公告)日：2014-12-23

申请号：US13192928

申请日：2011-07-28

Applicant: Yasunari Ooyabu ,  Toshitaka Nakamura ,  Hironaka Fujii ,  Hisataka Ito

Inventor： Yasunari Ooyabu ,  Toshitaka Nakamura ,  Hironaka Fujii ,  Hisataka Ito

IPC: H01L33/00 ,  H01L33/50 ,  B82Y30/00 ,  C04B35/44 ,  C04B35/645 ,  C09K11/08 ,  C09K11/61 ,  C09K11/77 ,  H01L33/58

CPC classification number: H01L33/504 ,  B82Y30/00 ,  C04B35/44 ,  C04B35/6455 ,  C04B2235/3225 ,  C04B2235/3229 ,  C04B2235/443 ,  C04B2235/5445 ,  C04B2235/5454 ,  C04B2235/652 ,  C04B2235/6562 ,  C04B2235/6581 ,  C04B2235/6582 ,  C04B2235/764 ,  C04B2235/9653 ,  C04B2235/9661 ,  C09K11/0883 ,  C09K11/615 ,  C09K11/7731 ,  C09K11/7734 ,  C09K11/7774 ,  H01L33/505 ,  H01L33/507 ,  H01L33/58 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  Y02B20/181 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light-emitting device includes a circuit board to which external electric power is supplied, a light emitting diode that is electrically connected onto the circuit board and emits light based on electric power from the circuit board, a housing provided on the circuit board so as to surround the light emitting diode and so that the upper end portion of the housing is positioned above the upper end portion of the light emitting diode, and a fluorescent laminate provided on the housing. The fluorescent laminate includes a first fluorescent layer that emits fluorescent light and a second fluorescent layer that emits fluorescent light having a wavelength that is longer than that of the first fluorescent layer. The second fluorescent layer is disposed on the housing and the first fluorescent layer is laminated on the second fluorescent layer.

Abstract translation: 发光装置包括：供给外部电力的电路基板，电连接到电路基板上的发光二极管，基于来自电路基板的电力发光;电路基板上设置的壳体， 以围绕发光二极管，并且使得壳体的上端部分位于发光二极管的上端部分的上方，以及设置在壳体上的荧光层压板。 荧光层叠体包括发射荧光的第一荧光层和发射波长比第一荧光层长的荧光的第二荧光层。 第二荧光层设置在壳体上，第一荧光层层压在第二荧光层上。

公开(公告)号：US08716733B2

公开(公告)日：2014-05-06

申请号：US13167331

申请日：2011-06-23

Applicant: Yasunari Ooyabu ,  Satoshi Sato ,  Hisataka Ito

Inventor： Yasunari Ooyabu ,  Satoshi Sato ,  Hisataka Ito

IPC: H01L33/50

CPC classification number: H01L33/505 ,  H01L2224/48091 ,  H01L2933/0041 ,  H05B33/22 ,  H01L2924/00014

Abstract: A transfer sheet for a phosphor layer includes a release substrate, a phosphor layer formed on the release substrate, and an adhesive layer formed on the phosphor layer.

Abstract translation: 荧光体层用转印片包括剥离基板，形成在剥离基板上的荧光体层，以及形成在荧光体层上的粘接层。

公开(公告)号：US20120305969A1

公开(公告)日：2012-12-06

申请号：US13484399

申请日：2012-05-31

Applicant: Satoshi SATO ,  Hisataka ITO ,  Yasunari OOYABU ,  Yuki SHINBORI

Inventor： Satoshi SATO ,  Hisataka ITO ,  Yasunari OOYABU ,  Yuki SHINBORI

IPC: G02B5/26 ,  H01L33/60

CPC classification number: H01L33/60 ,  H01L24/97 ,  H01L33/0095 ,  H01L2224/16225 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2933/0058 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A reflecting material contains a silicone resin composition prepared from a polysiloxane containing silanol groups at both ends, an ethylenic silicon compound, a silicon compound containing an epoxy group, an organohydrogenpolysiloxane, a condensation catalyst, and an addition catalyst; and a light reflecting component.

Abstract translation: 反射材料含有由两端含有硅烷醇基的聚硅氧烷，乙烯基硅化合物，含有环氧基的硅化合物，有机氢聚硅氧烷，缩合催化剂和加成催化剂制备的有机硅树脂组合物; 和光反射部件。

公开(公告)号：US20120248485A1

公开(公告)日：2012-10-04

申请号：US13431240

申请日：2012-03-27

Applicant: Yuki SHINBORI ,  Yasunari Ooyabu ,  Satoshi Sato ,  Hisataka Ito

Inventor： Yuki SHINBORI ,  Yasunari Ooyabu ,  Satoshi Sato ,  Hisataka Ito

IPC: H01L33/40 ,  H01L33/60

CPC classification number: H01L33/56 ,  H01L33/505 ,  H01L33/62 ,  H01L2224/13 ,  H01L2933/005

Abstract: A method for producing a light emitting diode device includes the steps of preparing a phosphor layer formed in a sheet state; forming a light semiconductor layer on one surface in a thickness direction of the phosphor layer; forming an electrode portion on one surface of the light semiconductor layer; forming an encapsulating resin layer containing a light reflecting component so as to cover the light semiconductor layer and the electrode portion; producing the light emitting diode element by partially removing the encapsulating resin layer so as to expose one surface of the electrode portion; and allowing the electrode portion to be electrically connected to the terminal, so that the light emitting diode element is flip-chip mounted on the base board.

Abstract translation: 一种发光二极管器件的制造方法，其特征在于，具有：制作以片状形成的荧光体层的工序; 在所述荧光体层的厚度方向的一个表面上形成光半导体层; 在所述光半导体层的一个表面上形成电极部分; 形成包含光反射部件的封装树脂层，以覆盖所述光半导体层和所述电极部分; 通过部分地去除封装树脂层来制造发光二极管元件，以暴露电极部分的一个表面; 并且允许电极部分电连接到端子，使得发光二极管元件倒装芯片安装在基板上。

公开(公告)号：US08266794B2

公开(公告)日：2012-09-18

申请号：US12662108

申请日：2010-03-31

Applicant: Jun Ishii ,  Yasunari Ooyabu

Inventor： Jun Ishii ,  Yasunari Ooyabu

IPC: H05K3/02 ,  H05K3/10

CPC classification number: H05K1/056 ,  G11B5/484 ,  G11B5/486 ,  H05K3/4641 ,  H05K3/4644 ,  H05K2201/0317 ,  H05K2201/0338 ,  Y10T29/49002 ,  Y10T29/4902 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155

Abstract: A wired circuit board has a metal supporting board, a metal foil formed on the metal supporting board to have a thickness of less than 2.0 μm, a first insulating layer formed on the metal supporting board to cover the metal foil, and a conductive pattern formed on the first insulating layer.

Abstract translation: 布线电路板具有金属支撑板，金属箔形成在金属支撑板上以具有小于2.0μm的厚度，形成在金属支撑板上以覆盖金属箔的第一绝缘层和形成的导电图案 在第一绝缘层上。

公开(公告)号：US08247700B2

公开(公告)日：2012-08-21

申请号：US12382266

申请日：2009-03-12

Applicant: Jun Ishii ,  Yasunari Ooyabu ,  Visit Thaveeprungsriporn

Inventor： Jun Ishii ,  Yasunari Ooyabu ,  Visit Thaveeprungsriporn

IPC: H05K1/00

CPC classification number: H05K1/0259 ,  G11B5/484 ,  G11B5/486 ,  H05K1/056 ,  H05K1/167 ,  H05K2201/09554 ,  Y10T428/1328 ,  Y10T428/1393 ,  Y10T428/256 ,  Y10T428/257

Abstract: A wired circuit board has a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and having a pair of wires arranged in spaced-apart relation, and a semiconductive layer formed on the insulating layer and electrically connected to the metal supporting board and the conductive pattern. The conductive pattern has a first region in which a distance between the pair of wires is small and a second region in which the distance between the pair of wires is larger than that in the first region. The semiconductive layer is provided in the second region.

Abstract translation: 布线电路板具有金属支撑板，形成在金属支撑板上的绝缘层，形成在绝缘层上并具有间隔布置的一对电线的导电图案，以及形成在绝缘层上的半导体层 并且电连接到金属支撑板和导电图案。 导电图案具有第一区域，其中一对导线之间的距离小，并且一对导线之间的距离大于第一区域中的距离的第二区域。 半导体层设置在第二区域中。

公开(公告)号：US20120160412A1

公开(公告)日：2012-06-28

申请号：US13331219

申请日：2011-12-20

Applicant: Yasunari OOYABU ,  Hisataka ITO ,  Yuki SHINBORI ,  Satoshi SATO

Inventor： Yasunari OOYABU ,  Hisataka ITO ,  Yuki SHINBORI ,  Satoshi SATO

IPC: B32B7/12 ,  B32B37/12

CPC classification number: H01L33/52 ,  B29C33/68 ,  B29C43/18 ,  B29C43/203 ,  B32B37/16 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2933/005 ,  Y10T156/10 ,  Y10T428/2839 ,  Y10T428/2848 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A sealing member includes an elongated releasing film, and a plurality of sealing resin layers composed of a sealing resin, the plurality of sealing resin layers being laminated on the releasing film so that the plurality of sealing resin layers are arranged in a row along the longitudinal direction of the releasing film with a space provided therebetween.

Abstract translation: 密封构件包括细长释放膜和由密封树脂构成的多个密封树脂层，所述多个密封树脂层层压在所述脱模膜上，使得所述多个密封树脂层沿着所述纵向排列成一排 释放膜的方向具有设置在其间的空间。

公开(公告)号：US20120083056A1

公开(公告)日：2012-04-05

申请号：US13248816

申请日：2011-09-29

Applicant: Yuki SHINBORI ,  Yasunari OOYABU ,  Satoshi SATO ,  Hisataka ITO

Inventor： Yuki SHINBORI ,  Yasunari OOYABU ,  Satoshi SATO ,  Hisataka ITO

IPC: H01L33/58

CPC classification number: H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2933/005 ,  H01L2924/00014

Abstract: A light emitting diode sealing member includes a light emitting diode sealing layer, and a lens mold layer laminated on the light emitting diode sealing layer.

Abstract translation: 发光二极管密封构件包括发光二极管密封层和层叠在发光二极管密封层上的透镜模层。

公开(公告)号：US20120032219A1

公开(公告)日：2012-02-09

申请号：US13192928

申请日：2011-07-28

Applicant: Yasunari OOYABU ,  Toshitaka NAKAMURA ,  Hironaka FUJII ,  Hisataka ITO

Inventor： Yasunari OOYABU ,  Toshitaka NAKAMURA ,  Hironaka FUJII ,  Hisataka ITO

IPC: H01L33/50

CPC classification number: H01L33/504 ,  B82Y30/00 ,  C04B35/44 ,  C04B35/6455 ,  C04B2235/3225 ,  C04B2235/3229 ,  C04B2235/443 ,  C04B2235/5445 ,  C04B2235/5454 ,  C04B2235/652 ,  C04B2235/6562 ,  C04B2235/6581 ,  C04B2235/6582 ,  C04B2235/764 ,  C04B2235/9653 ,  C04B2235/9661 ,  C09K11/0883 ,  C09K11/615 ,  C09K11/7731 ,  C09K11/7734 ,  C09K11/7774 ,  H01L33/505 ,  H01L33/507 ,  H01L33/58 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  Y02B20/181 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light-emitting device includes a circuit board to which external electric power is supplied, a light emitting diode that is electrically connected onto the circuit board and emits light based on electric power from the circuit board, a housing provided on the circuit board so as to surround the light emitting diode and so that the upper end portion of the housing is positioned above the upper end portion of the light emitting diode, and a fluorescent laminate provided on the housing. The fluorescent laminate includes a first fluorescent layer that emits fluorescent light and a second fluorescent layer that emits fluorescent light having a wavelength that is longer than that of the first fluorescent layer. The second fluorescent layer is disposed on the housing and the first fluorescent layer is laminated on the second fluorescent layer.

Abstract translation: 发光装置包括：供给外部电力的电路基板，电连接到电路基板上并基于来自电路基板的电力发光的发光二极管，设置在电路基板上的壳体， 以围绕发光二极管，并且使得壳体的上端部分位于发光二极管的上端部分的上方，以及设置在壳体上的荧光层压板。 荧光层叠体包括发射荧光的第一荧光层和发射波长比第一荧光层长的荧光的第二荧光层。 第二荧光层设置在壳体上，第一荧光层层压在第二荧光层上。

公开(公告)号：US20120012875A1

公开(公告)日：2012-01-19

申请号：US13181138

申请日：2011-07-12

Applicant: Yasunari OOYABU ,  Hironaka FUJII ,  Toshitaka NAKAMURA ,  Hisataka ITO

Inventor： Yasunari OOYABU ,  Hironaka FUJII ,  Toshitaka NAKAMURA ,  Hisataka ITO

IPC: H01L33/50 ,  H01L21/66

CPC classification number: H01L33/507 ,  H01L33/58 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2933/0041 ,  H05B33/14 ,  H05B33/145 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A component for a light-emitting device includes a fluorescent layer that is capable of emitting fluorescent light and a housing that is connected to the fluorescent layer for housing a light-emitting diode.

Abstract translation: 用于发光器件的部件包括能够发射荧光的荧光层和连接到用于容纳发光二极管的荧光层的壳体。