公开(公告)号：US12129567B2

公开(公告)日：2024-10-29

申请号：US15148034

申请日：2016-05-06

Applicant: HUTCHINSON TECHNOLOGY INCORPORATED

Inventor： Kurt F. Fischer ,  Alexander W. Haas ,  Matthew J. Horner ,  Peter F. Ladwig ,  Carl C. Minton ,  Paul V. Pesavento ,  David D. Smahel ,  Christopher J. Sperl ,  Darrell C. Sydlo ,  Ritesh K. Tiwari ,  Kyle T. Tobias ,  Maryam O. Yusuf

IPC: C25D5/34 ,  C23C18/16 ,  C25D5/02 ,  C25D7/00 ,  C25D7/06 ,  G11B5/48 ,  H01J37/32 ,  H05K1/05 ,  H05K3/18

CPC classification number: C25D5/34 ,  C23C18/1653 ,  C25D5/022 ,  C25D7/00 ,  C25D7/0614 ,  C25D7/0678 ,  G11B5/486 ,  H01J37/32403 ,  H01J37/32825 ,  H05K1/053 ,  H05K3/182 ,  G11B5/484 ,  H05K2203/0709 ,  H05K2203/095

Abstract: Methods for producing flexible circuits can include creating treating a surface of the flexible circuit with at least one of an atmospheric plasma and a beam of ions. The atmospheric plasma is formed by directing a flow of gas between an electrode and the surface of the flexible circuit and generating a voltage between the electrode and the flexible circuit to create a plasma from the gas. A mean ion energy of the ions in the ion beam ranges from about 500 electron volts to about 1,500 electron volts.

公开(公告)号：US20240102174A1

公开(公告)日：2024-03-28

申请号：US18536762

申请日：2023-12-12

Applicant: Hutchinson Technology Incorporated

Inventor： Douglas P. Riemer ,  Peter F. Ladwig

IPC: C23F1/16 ,  C09K13/06 ,  C23F1/02 ,  G11B5/48 ,  H05K1/02 ,  H05K3/06

CPC classification number: C23F1/16 ,  C09K13/06 ,  C23F1/02 ,  G11B5/484 ,  H05K1/0277 ,  H05K3/067 ,  H05K2203/0779

Abstract: An etch chemistry solution for treating metallic surfaces in which the etch chemistry solution includes an oxidizing agent and gluconic acid. The etch chemistry solution may also include an oxidizing agent and a short-chained polyethylene polymer glycol or a short-chained polyethylene copolymer glycol. The metallic surfaces are usually used in circuits such as flexible circuits.

公开(公告)号：US09990946B2

公开(公告)日：2018-06-05

申请号：US15692784

申请日：2017-08-31

Applicant: TDK CORPORATION

Inventor： Hideki Kuwajima ,  Taku Someya

IPC: G11B5/48

CPC classification number: G11B5/4826 ,  G11B5/484

Abstract: To control the resonance generated in the head assembly and improve property on the head location controlling. A head assembly includes: a slider having a head element; a slider supporting plate for holding the slider; a load beam for holding the slider supporting plate; a support projection which is arranged on the front end part of the load beam and on which the slider supporting plate is supported rotatably; a drive unit that rotates the slider supporting plate around the support projection; a dynamic vibration absorber arranged on the slider supporting plate, wherein the dynamic vibration absorber is disposed closer to the rear end side of the load beam than the support projection and has vibration freedom in the rotating direction of the slide supporting plate.

公开(公告)号：US09942983B2

公开(公告)日：2018-04-10

申请号：US15368855

申请日：2016-12-05

Applicant: NITTO DENKO CORPORATION

Inventor： Yoshito Fujimura

IPC: G11B5/48 ,  H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00

CPC classification number: H05K1/056 ,  G11B5/484 ,  H05K1/111 ,  H05K1/181 ,  H05K3/0023 ,  H05K3/0041 ,  Y02P70/611

Abstract: A suspension board with circuit includes a metal supporting board, a conductor layer, a first insulating layer disposed between the metal supporting board and the conductor layer and having a first thickness, a second insulating layer having a second thickness in a portion disposed on the first insulating layer, and a pedestal disposed on the metal supporting board. The pedestal includes a first layer prepared from the same material as that of the first insulating layer and a second layer prepared from the same material as that of the second insulating layer. The thickness of the pedestal is different from any one of the first thickness, the second thickness, and the total sum of the first thickness and the second thickness.

公开(公告)号：US20180070438A1

公开(公告)日：2018-03-08

申请号：US15696270

申请日：2017-09-06

Applicant: Nitto Denko Corporation

Inventor： Daisuke YAMAUCHI ,  Hiroyuki TANABE

IPC: H05K1/02 ,  H05K1/05 ,  H05K1/11 ,  H05K3/46 ,  G11B5/48

CPC classification number: H05K1/0224 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0228 ,  H05K1/056 ,  H05K1/09 ,  H05K1/115 ,  H05K3/4038 ,  H05K3/4644 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/09227 ,  H05K2201/09254 ,  H05K2201/093 ,  H05K2201/10083

Abstract: In a suspension board, a first insulating layer is formed on a support substrate. A ground layer and a power wiring trace are formed on the first insulating layer. The ground layer has electric conductivity higher than that of the support substrate. A second insulating layer is formed on the first insulating layer to cover the ground layer and the power wiring trace. A write wiring trace is formed on the second insulating layer to overlap with the ground layer. In a stacking direction of the support substrate, the first insulating layer and the second insulating layer, a distance between the ground layer and the write wiring trace is larger than a distance between the power wiring trace and the write wiring trace.

公开(公告)号：US20180018993A1

公开(公告)日：2018-01-18

申请号：US15677747

申请日：2017-08-15

Applicant: Kabushiki Kaisha Toshiba

Inventor： Takafumi Kikuchi ,  Kenichiro Aoki

IPC: G11B5/48

CPC classification number: G11B5/483 ,  G11B5/48 ,  G11B5/4833 ,  G11B5/484 ,  G11B5/4853 ,  G11B5/486 ,  H05K1/18

Abstract: According to one embodiment, a suspension assembly includes a support plate, a trace member on the support plate and a drive element mounted on the trace member. The trace member includes a metal plate, and a multilayered member on the metal plate. The multilayered member includes a first insulating layer, a conductive layer stacked on the first insulating layer, a second insulating layer stacked on the conductive layer. The multilayered member includes a mount portion on which the drive element is mounted, and a branching portion arranged along the mount portion with a gap therebetween. At least one portion of the branching portion is formed into a thin portion having a thickness less than other portions of the multilayered member.

公开(公告)号：US09841457B1

公开(公告)日：2017-12-12

申请号：US15340582

申请日：2016-11-01

Applicant: NHK SPRING CO., LTD. ,  WESTERN DIGITAL TECHNOLOGIES, INC.

Inventor： Futa Sasaki ,  Hajime Arai ,  Tomohisa Okada ,  Nobumasa Nishiyama ,  Kazuhiro Nagaoka

IPC: G01R31/28

CPC classification number: G01R31/2803 ,  G01R31/2829 ,  G11B5/455 ,  G11B5/484

Abstract: A test coupon includes a pseudo element circuit which is constituted of a main circuit section and an adjusting section. The main circuit section includes a first pattern conductor and second pattern conductors. The first pattern conductor and the second pattern conductors overlap one another with a dielectric layer interposed therebetween. The first pattern conductor electrically conducts to the second pattern conductors. The main circuit section represents the R-component and the L-component of an equivalent circuit, and is a dominant circuit element which determines a signal waveform. The adjusting section includes linear conductors. A peak of a voltage waveform is suppressed by the R- and L-components of the adjusting section.

公开(公告)号：US20170339786A1

公开(公告)日：2017-11-23

申请号：US15671549

申请日：2017-08-08

Applicant: NITTO DENKO CORPORATION

Inventor： Hiroyuki TANABE ,  Naohiro TERADA ,  Yuu SUGIMOTO ,  Daisuke YAMAUCHI

IPC: H05K1/05 ,  H05K1/11 ,  G11B5/48 ,  H05K3/40 ,  H05K3/44

CPC classification number: H05K1/05 ,  G11B5/4826 ,  G11B5/484 ,  G11B5/4853 ,  H05K1/0278 ,  H05K1/0393 ,  H05K1/11 ,  H05K1/18 ,  H05K1/181 ,  H05K3/4007 ,  H05K3/44 ,  H05K2201/10151 ,  H05K2201/10227

Abstract: A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, and a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider. The base insulating layer has a terminal region, when projected in the thickness direction, overlapped with at least the connecting terminal and a circumferential region not overlapped with the terminal region and around the terminal region, and the thickness of the terminal region is thicker than that of the circumferential region.

公开(公告)号：US20170092308A1

公开(公告)日：2017-03-30

申请号：US15374276

申请日：2016-12-09

Applicant: Kabushiki Kaisha Toshiba

Inventor： Takafumi Kikuchi ,  Kenichiro Aoki

IPC: G11B5/48

CPC classification number: G11B5/483 ,  G11B5/48 ,  G11B5/4833 ,  G11B5/484 ,  G11B5/4853 ,  G11B5/486 ,  H05K1/18

Abstract: According to one embodiment, a suspension assembly includes a support plate, a trace member on the support plate and a drive element mounted on the trace member. The trace member includes a metal plate, and a multilayered member on the metal plate. The multilayered member includes a first insulating layer, a conductive layer stacked on the first insulating layer, a second insulating layer stacked on the conductive layer. The multilayered member includes a mount portion on which the drive element is mounted, and a branching portion arranged along the mount portion with a gap therebetween. At least one portion of the branching portion is formed into a thin portion having a thickness less than other portions of the multilayered member.

公开(公告)号：US09576603B2

公开(公告)日：2017-02-21

申请号：US14950978

申请日：2015-11-24

Applicant: NITTO DENKO CORPORATION

Inventor： Tomoaki Okuno ,  Yoshito Fujimura ,  Naohiro Terada

IPC: G11B21/16 ,  G11B5/60 ,  H05K1/05

CPC classification number: G11B5/60 ,  G11B5/4826 ,  G11B5/484 ,  G11B5/4853 ,  H05K1/056

Abstract: A suspension board with circuit includes a first layer having electrically conductive properties, a second layer having insulation properties and formed at one side in a thickness direction of the first layer, a third layer having electrically conductive properties and formed at one side in the thickness direction of the second layer, and a fourth layer having insulation properties and formed at one side in the thickness direction of the third layer. The first layer includes an electronic component connecting terminal for being electrically connected to an electronic component. The second layer includes a first opening portion passing through in the thickness direction. The third layer includes a first conductive circuit having a magnetic head, and a second conductive circuit. The fourth layer and the second layer are formed with a second opening portion.

Abstract translation: 具有电路的悬挂板包括具有导电特性的第一层，具有绝缘性能并形成在第一层的厚度方向的一侧的第二层，具有导电性能的第三层，并且形成在厚度方向的一侧 以及具有绝缘性的第四层，并且形成在第三层的厚度方向的一侧。 第一层包括用于电连接到电子部件的电子部件连接端子。 第二层包括在厚度方向上穿过的第一开口部分。 第三层包括具有磁头的第一导电电路和第二导电电路。 第四层和第二层形成有第二开口部分。