LIGHT-EMITTING DEVICE
    7.
    发明申请
    LIGHT-EMITTING DEVICE 审中-公开
    发光装置

    公开(公告)号:US20120039064A1

    公开(公告)日:2012-02-16

    申请号:US13207068

    申请日:2011-08-10

    Abstract: A light-emitting device includes a circuit board to which external electric power is supplied; a light emitting diode that is electrically connected onto the circuit board and emits light based on electric power from the circuit board; a housing provided on the circuit board so as to surround the light emitting diode and so that the upper end portion of the housing is positioned above the upper end portion of the light emitting diode; an adhesive layer that is provided on the housing, the adhesive layer being provided entirely in the circumferential direction of the housing, and the adhesive layer having a length from the inner circumferential edge to the outer circumferential edge of mainly 0.3 mm or more and a thickness of 200 μm or less; and a phosphor ceramic that is allowed to adhere onto the housing with the adhesive layer interposed therebetween.

    Abstract translation: 发光装置包括供给外部电力的电路板; 电连接到电路板上并基于来自电路板的电力发光的发光二极管; 设置在所述电路板上以围绕所述发光二极管并且使得所述壳体的上端部分位于所述发光二极管的上端部分之上的壳体; 设置在所述壳体上的粘合剂层,所述粘合剂层整体设置在所述壳体的圆周方向上,并且所述粘合剂层具有从所述内周边缘到所述外周边缘的长度大致为0.3mm以上的厚度, 为200μm以下; 以及允许粘附到壳体上的荧光体陶瓷,其间插入有粘合剂层。

    SEMICONDUCTOR LIGHT EMITTING DEVICE
    10.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING DEVICE 有权
    半导体发光器件

    公开(公告)号:US20110309384A1

    公开(公告)日:2011-12-22

    申请号:US13165036

    申请日:2011-06-21

    Abstract: The present invention relates to a semiconductor light emitting device including: a substrate for element mounting; a wiring provided on the substrate; an LED element provided on the substrate and electrically connected to the wiring; an encapsulating resin layer for encapsulating the LED element; and a wavelength conversion layer which contains a phosphor material and converts a wavelength of light emitted by the LED element, in which the wavelength conversion layer is provided on an upper side of the LED element, and a diffusive reflection resin layer is provided in a state that side faces of the LED element are surrounded therewith, and an area at the LED element face side of the wavelength conversion layer is at least twice larger by area ratio than an area of light emitting area on an upper surface of the LED element.

    Abstract translation: 本发明涉及一种半导体发光器件,包括:用于元件安装的衬底; 设置在基板上的布线; LED元件,其设置在所述基板上并电连接到所述布线; 用于封装LED元件的封装树脂层; 以及波长转换层,其包含荧光体材料,并且将在其中设置有所述波长转换层的所述LED元件发射的光的波长转换为所述LED元件的上侧,并且扩散反射树脂层设置在所述状态 LED元件的侧面被围绕,并且波长转换层的LED元件面侧的面积比LED元件的上表面上的发光面积的面积的面积比至少大两倍。

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