公开(公告)号：US09608178B2

公开(公告)日：2017-03-28

申请号：US13165036

申请日：2011-06-21

Applicant: Hisataka Ito ,  Toshitaka Nakamura ,  Hironaka Fujii

Inventor： Hisataka Ito ,  Toshitaka Nakamura ,  Hironaka Fujii

IPC: H01L29/18 ,  H01L33/00 ,  H01L33/54 ,  H01L33/50

CPC classification number: H01L33/54 ,  H01L33/505 ,  H01L33/507 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention relates to a semiconductor light emitting device including: a substrate for element mounting; a wiring provided on the substrate; an LED element provided on the substrate and electrically connected to the wiring; an encapsulating resin layer for encapsulating the LED element; and a wavelength conversion layer which contains a phosphor material and converts a wavelength of light emitted by the LED element, in which the wavelength conversion layer is provided on an upper side of the LED element, and a diffusive reflection resin layer is provided in a state that side faces of the LED element are surrounded therewith, and an area at the LED element face side of the wavelength conversion layer is at least twice larger by area ratio than an area of light emitting area on an upper surface of the LED element.

公开(公告)号：US08916893B2

公开(公告)日：2014-12-23

申请号：US13192928

申请日：2011-07-28

Applicant: Yasunari Ooyabu ,  Toshitaka Nakamura ,  Hironaka Fujii ,  Hisataka Ito

Inventor： Yasunari Ooyabu ,  Toshitaka Nakamura ,  Hironaka Fujii ,  Hisataka Ito

IPC: H01L33/00 ,  H01L33/50 ,  B82Y30/00 ,  C04B35/44 ,  C04B35/645 ,  C09K11/08 ,  C09K11/61 ,  C09K11/77 ,  H01L33/58

CPC classification number: H01L33/504 ,  B82Y30/00 ,  C04B35/44 ,  C04B35/6455 ,  C04B2235/3225 ,  C04B2235/3229 ,  C04B2235/443 ,  C04B2235/5445 ,  C04B2235/5454 ,  C04B2235/652 ,  C04B2235/6562 ,  C04B2235/6581 ,  C04B2235/6582 ,  C04B2235/764 ,  C04B2235/9653 ,  C04B2235/9661 ,  C09K11/0883 ,  C09K11/615 ,  C09K11/7731 ,  C09K11/7734 ,  C09K11/7774 ,  H01L33/505 ,  H01L33/507 ,  H01L33/58 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  Y02B20/181 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light-emitting device includes a circuit board to which external electric power is supplied, a light emitting diode that is electrically connected onto the circuit board and emits light based on electric power from the circuit board, a housing provided on the circuit board so as to surround the light emitting diode and so that the upper end portion of the housing is positioned above the upper end portion of the light emitting diode, and a fluorescent laminate provided on the housing. The fluorescent laminate includes a first fluorescent layer that emits fluorescent light and a second fluorescent layer that emits fluorescent light having a wavelength that is longer than that of the first fluorescent layer. The second fluorescent layer is disposed on the housing and the first fluorescent layer is laminated on the second fluorescent layer.

Abstract translation: 发光装置包括：供给外部电力的电路基板，电连接到电路基板上的发光二极管，基于来自电路基板的电力发光;电路基板上设置的壳体， 以围绕发光二极管，并且使得壳体的上端部分位于发光二极管的上端部分的上方，以及设置在壳体上的荧光层压板。 荧光层叠体包括发射荧光的第一荧光层和发射波长比第一荧光层长的荧光的第二荧光层。 第二荧光层设置在壳体上，第一荧光层层压在第二荧光层上。

公开(公告)号：US08716733B2

公开(公告)日：2014-05-06

申请号：US13167331

申请日：2011-06-23

Applicant: Yasunari Ooyabu ,  Satoshi Sato ,  Hisataka Ito

Inventor： Yasunari Ooyabu ,  Satoshi Sato ,  Hisataka Ito

IPC: H01L33/50

CPC classification number: H01L33/505 ,  H01L2224/48091 ,  H01L2933/0041 ,  H05B33/22 ,  H01L2924/00014

Abstract: A transfer sheet for a phosphor layer includes a release substrate, a phosphor layer formed on the release substrate, and an adhesive layer formed on the phosphor layer.

Abstract translation: 荧光体层用转印片包括剥离基板，形成在剥离基板上的荧光体层，以及形成在荧光体层上的粘接层。

公开(公告)号：US08642362B2

公开(公告)日：2014-02-04

申请号：US13403467

申请日：2012-02-23

Applicant: Hisataka Ito ,  Yasushi Inoue ,  Sadahito Misumi

Inventor： Hisataka Ito ,  Yasushi Inoue ,  Sadahito Misumi

IPC: H01L33/52

CPC classification number: H01L33/52 ,  H01L24/17 ,  H01L33/0079 ,  H01L33/44 ,  H01L2224/16225 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2933/0016 ,  H01L2924/00

Abstract: A method for producing a light-emitting diode device includes the steps of: preparing a light-emitting laminate including an optical semiconductor layer, and an electrode unit formed on the optical semiconductor layer; forming an encapsulating resin layer on the optical semiconductor layer so as to cover the electrode unit, the encapsulating resin layer containing a light reflection component; partially removing the encapsulating resin layer so as to expose the top face of the electrode unit, thereby producing a light-emitting diode element; and disposing the light-emitting diode element and a base substrate provided with terminals so that the light-emitting diode element and the base substrate face each other, and that the electrode unit and the terminals are electrically connected, thereby flip chip mounting the light-emitting diode element on the base substrate.

Abstract translation: 一种发光二极管器件的制造方法，其特征在于，包括以下工序：制造包含光半导体层的发光层叠体和形成在所述光半导体层上的电极单元; 在所述光学半导体层上形成封装树脂层，以覆盖所述电极单元，所述封装树脂层包含光反射部件; 部分地去除封装树脂层以露出电极单元的顶面，从而产生发光二极管元件; 并且配置发光二极管元件和设置有端子的基底，使得发光二极管元件和基底基板彼此面对，并且电极单元和端子电连接，由此倒装芯片安装发光二极管元件， 发光二极管元件。

公开(公告)号：US20120305969A1

公开(公告)日：2012-12-06

申请号：US13484399

申请日：2012-05-31

Applicant: Satoshi SATO ,  Hisataka ITO ,  Yasunari OOYABU ,  Yuki SHINBORI

Inventor： Satoshi SATO ,  Hisataka ITO ,  Yasunari OOYABU ,  Yuki SHINBORI

IPC: G02B5/26 ,  H01L33/60

CPC classification number: H01L33/60 ,  H01L24/97 ,  H01L33/0095 ,  H01L2224/16225 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2933/0058 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A reflecting material contains a silicone resin composition prepared from a polysiloxane containing silanol groups at both ends, an ethylenic silicon compound, a silicon compound containing an epoxy group, an organohydrogenpolysiloxane, a condensation catalyst, and an addition catalyst; and a light reflecting component.

Abstract translation: 反射材料含有由两端含有硅烷醇基的聚硅氧烷，乙烯基硅化合物，含有环氧基的硅化合物，有机氢聚硅氧烷，缩合催化剂和加成催化剂制备的有机硅树脂组合物; 和光反射部件。

公开(公告)号：US20120248485A1

公开(公告)日：2012-10-04

申请号：US13431240

申请日：2012-03-27

Applicant: Yuki SHINBORI ,  Yasunari Ooyabu ,  Satoshi Sato ,  Hisataka Ito

Inventor： Yuki SHINBORI ,  Yasunari Ooyabu ,  Satoshi Sato ,  Hisataka Ito

IPC: H01L33/40 ,  H01L33/60

CPC classification number: H01L33/56 ,  H01L33/505 ,  H01L33/62 ,  H01L2224/13 ,  H01L2933/005

Abstract: A method for producing a light emitting diode device includes the steps of preparing a phosphor layer formed in a sheet state; forming a light semiconductor layer on one surface in a thickness direction of the phosphor layer; forming an electrode portion on one surface of the light semiconductor layer; forming an encapsulating resin layer containing a light reflecting component so as to cover the light semiconductor layer and the electrode portion; producing the light emitting diode element by partially removing the encapsulating resin layer so as to expose one surface of the electrode portion; and allowing the electrode portion to be electrically connected to the terminal, so that the light emitting diode element is flip-chip mounted on the base board.

Abstract translation: 一种发光二极管器件的制造方法，其特征在于，具有：制作以片状形成的荧光体层的工序; 在所述荧光体层的厚度方向的一个表面上形成光半导体层; 在所述光半导体层的一个表面上形成电极部分; 形成包含光反射部件的封装树脂层，以覆盖所述光半导体层和所述电极部分; 通过部分地去除封装树脂层来制造发光二极管元件，以暴露电极部分的一个表面; 并且允许电极部分电连接到端子，使得发光二极管元件倒装芯片安装在基板上。

公开(公告)号：US20120217532A1

公开(公告)日：2012-08-30

申请号：US13403422

申请日：2012-02-23

Applicant: Kazuhiro Fuke ,  Takashi Taniguchi ,  Takamitsu Ota ,  Hisataka Ito

Inventor： Kazuhiro Fuke ,  Takashi Taniguchi ,  Takamitsu Ota ,  Hisataka Ito

IPC: H01L33/52 ,  C08K3/22 ,  C08L63/00

CPC classification number: H01L33/486 ,  C08G59/3245 ,  C08G59/4215 ,  C08K3/013 ,  C08K3/22 ,  C08L63/00 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/3025 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention relates to a resin composition for forming an insulating resin layer for optical semiconductor element housing package having a concave portion in which a metal lead frame and an optical semiconductor element mounted thereon are housed, in which the resin composition includes the following ingredients (A) to (D), and the ingredients (C) and (D) are contained in a blend ratio (C)/(D) of 0.26 to 3.0 as a weight ratio thereof: (A) an epoxy resin; (B) an acid anhydride curing agent; (C) a white pigment; and (D) an inorganic filler.

Abstract translation: 本发明涉及一种用于形成光学半导体元件容纳封装的绝缘树脂层的树脂组合物，其具有容纳金属引线框架和安装在其上的光学半导体元件的凹部，其中树脂组合物包括以下成分（ A）〜（D），成分（C）和成分（D）以其重量比为0.26〜3.0的配合比（C）/（D））：（A）环氧树脂; （B）酸酐固化剂; （C）白色颜料; 和（D）无机填料。

公开(公告)号：US20120160412A1

公开(公告)日：2012-06-28

申请号：US13331219

申请日：2011-12-20

Applicant: Yasunari OOYABU ,  Hisataka ITO ,  Yuki SHINBORI ,  Satoshi SATO

Inventor： Yasunari OOYABU ,  Hisataka ITO ,  Yuki SHINBORI ,  Satoshi SATO

IPC: B32B7/12 ,  B32B37/12

CPC classification number: H01L33/52 ,  B29C33/68 ,  B29C43/18 ,  B29C43/203 ,  B32B37/16 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2933/005 ,  Y10T156/10 ,  Y10T428/2839 ,  Y10T428/2848 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A sealing member includes an elongated releasing film, and a plurality of sealing resin layers composed of a sealing resin, the plurality of sealing resin layers being laminated on the releasing film so that the plurality of sealing resin layers are arranged in a row along the longitudinal direction of the releasing film with a space provided therebetween.

Abstract translation: 密封构件包括细长释放膜和由密封树脂构成的多个密封树脂层，所述多个密封树脂层层压在所述脱模膜上，使得所述多个密封树脂层沿着所述纵向排列成一排 释放膜的方向具有设置在其间的空间。

公开(公告)号：US20120083056A1

公开(公告)日：2012-04-05

申请号：US13248816

申请日：2011-09-29

Applicant: Yuki SHINBORI ,  Yasunari OOYABU ,  Satoshi SATO ,  Hisataka ITO

Inventor： Yuki SHINBORI ,  Yasunari OOYABU ,  Satoshi SATO ,  Hisataka ITO

IPC: H01L33/58

CPC classification number: H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2933/005 ,  H01L2924/00014

Abstract: A light emitting diode sealing member includes a light emitting diode sealing layer, and a lens mold layer laminated on the light emitting diode sealing layer.

Abstract translation: 发光二极管密封构件包括发光二极管密封层和层叠在发光二极管密封层上的透镜模层。

公开(公告)号：US20120032219A1

公开(公告)日：2012-02-09

申请号：US13192928

申请日：2011-07-28

Applicant: Yasunari OOYABU ,  Toshitaka NAKAMURA ,  Hironaka FUJII ,  Hisataka ITO

Inventor： Yasunari OOYABU ,  Toshitaka NAKAMURA ,  Hironaka FUJII ,  Hisataka ITO

IPC: H01L33/50

CPC classification number: H01L33/504 ,  B82Y30/00 ,  C04B35/44 ,  C04B35/6455 ,  C04B2235/3225 ,  C04B2235/3229 ,  C04B2235/443 ,  C04B2235/5445 ,  C04B2235/5454 ,  C04B2235/652 ,  C04B2235/6562 ,  C04B2235/6581 ,  C04B2235/6582 ,  C04B2235/764 ,  C04B2235/9653 ,  C04B2235/9661 ,  C09K11/0883 ,  C09K11/615 ,  C09K11/7731 ,  C09K11/7734 ,  C09K11/7774 ,  H01L33/505 ,  H01L33/507 ,  H01L33/58 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  Y02B20/181 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light-emitting device includes a circuit board to which external electric power is supplied, a light emitting diode that is electrically connected onto the circuit board and emits light based on electric power from the circuit board, a housing provided on the circuit board so as to surround the light emitting diode and so that the upper end portion of the housing is positioned above the upper end portion of the light emitting diode, and a fluorescent laminate provided on the housing. The fluorescent laminate includes a first fluorescent layer that emits fluorescent light and a second fluorescent layer that emits fluorescent light having a wavelength that is longer than that of the first fluorescent layer. The second fluorescent layer is disposed on the housing and the first fluorescent layer is laminated on the second fluorescent layer.

Abstract translation: 发光装置包括：供给外部电力的电路基板，电连接到电路基板上并基于来自电路基板的电力发光的发光二极管，设置在电路基板上的壳体， 以围绕发光二极管，并且使得壳体的上端部分位于发光二极管的上端部分的上方，以及设置在壳体上的荧光层压板。 荧光层叠体包括发射荧光的第一荧光层和发射波长比第一荧光层长的荧光的第二荧光层。 第二荧光层设置在壳体上，第一荧光层层压在第二荧光层上。