Invention Application
US20120160412A1 SEALING MEMBER, SEALING METHOD, AND METHOD FOR PRODUCING OPTICAL SEMICONDUCTOR DEVICE
审中-公开
密封部件，密封方法和用于制造光学半导体器件的方法
- Patent Title: SEALING MEMBER, SEALING METHOD, AND METHOD FOR PRODUCING OPTICAL SEMICONDUCTOR DEVICE
- Patent Title (中): 密封部件，密封方法和用于制造光学半导体器件的方法
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Application No.: US13331219Application Date: 2011-12-20
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Publication No.: US20120160412A1Publication Date: 2012-06-28
- Inventor: Yasunari OOYABU , Hisataka ITO , Yuki SHINBORI , Satoshi SATO
- Applicant: Yasunari OOYABU , Hisataka ITO , Yuki SHINBORI , Satoshi SATO
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Priority: JP2010-292861 20101228
- Main IPC: B32B7/12
- IPC: B32B7/12 ; B32B37/12
Abstract:
A sealing member includes an elongated releasing film, and a plurality of sealing resin layers composed of a sealing resin, the plurality of sealing resin layers being laminated on the releasing film so that the plurality of sealing resin layers are arranged in a row along the longitudinal direction of the releasing film with a space provided therebetween.
Information query
