METHODS OF MANUFACTURING A MAGNETORESISTIVE RANDOM ACCESS MEMORY DEVICE
    3.
    发明申请
    METHODS OF MANUFACTURING A MAGNETORESISTIVE RANDOM ACCESS MEMORY DEVICE 有权
    制造磁阻随机访问存储器件的方法

    公开(公告)号:US20150287911A1

    公开(公告)日:2015-10-08

    申请号:US14611717

    申请日:2015-02-02

    CPC classification number: H01L43/12 G11C11/161 H01L27/228

    Abstract: In a method of manufacturing a MRAM device, a lower electrode is formed on a substrate. A first magnetic layer, a tunnel barrier layer, and a second magnetic layer are sequentially formed on the lower electrode layer. An etching mask is formed on the second magnetic layer. An ion beam etching process in which a first ion beam and a second ion beam are simultaneously emitted onto the substrate is performed to form a MTJ structure including a first magnetic layer pattern, a tunnel layer pattern, and a second magnetic layer pattern from the first magnetic layer, the tunnel barrier layer, and the second magnetic layer, respectively, the MTJ structure has no by-products remaining after the ion beam etching process is performed.

    Abstract translation: 在制造MRAM器件的方法中,在基片上形成下电极。 第一磁性层,隧道势垒层和第二磁性层依次形成在下部电极层上。 在第二磁性层上形成蚀刻掩模。 执行其中第一离子束和第二离子束同时发射到衬底上的离子束蚀刻工艺,以形成包括第一磁性层图案,隧道层图案和第二磁性层图案的MTJ结构 磁性层,隧道势垒层和第二磁性层,在执行离子束蚀刻处理之后,MTJ结构没有剩余副产物。

    Non-Volatile Memory Devices and Methods of Fabricating the Same
    5.
    发明申请
    Non-Volatile Memory Devices and Methods of Fabricating the Same 有权
    非易失性存储器件及其制造方法

    公开(公告)号:US20140264680A1

    公开(公告)日:2014-09-18

    申请号:US14195891

    申请日:2014-03-04

    CPC classification number: H01L27/222 H01L27/228 H01L43/08

    Abstract: A nonvolatile memory device is provided. The nonvolatile memory device comprises a plurality of impurity regions formed in a substrate, a first contact electrically connected to at least one of the impurity regions, a second contact electrically connected to at least one of the impurity regions, a first information storage portion formed at a first height from the substrate and electrically connected to the first contact, and a second information storage portion formed at a second height, which is different from the first height, from the substrate and electrically connected to the second contact.

    Abstract translation: 提供非易失性存储器件。 非易失性存储器件包括形成在衬底中的多个杂质区,与至少​​一个杂质区电连接的第一触点,与至少一个杂质区电连接的第二触点,形成在第一信息存储部 与基板电连接并与第一触点电连接的第一高度,以及形成在与第一高度不同的第二高度处的与第二触点电连接的第二信息存储部。

    VACUUM PACKING ENVELOPE FOR COOKING
    7.
    发明申请
    VACUUM PACKING ENVELOPE FOR COOKING 审中-公开
    真空包装包装烹饪

    公开(公告)号:US20130272629A1

    公开(公告)日:2013-10-17

    申请号:US13460298

    申请日:2012-04-30

    CPC classification number: B65D81/3461 B65D2205/00

    Abstract: The vacuum packing envelope for cooking which is characterized in that a sealing part (110) having a certain width is formed for vacuum packing food by heating and thermally melting a film, and a vapor discharge part (130) which is disposed at a portion of the sealing rim part (110) for automatically discharging vapor with the aid of an inner pressure when heating and cooking food, comprises an easy peel tape (120) which crosses, in a horizontal direction, the sealing rim part; and a vapor discharge part (130) which is formed in the sealing weak part (111) where the easy peel tape (120) and the sealing rim part (110) overlap with each other.

    Abstract translation: 一种用于烹饪的真空包装容器,其特征在于,通过加热和热熔化膜形成具有一定宽度的密封部分(110),用于真空包装食品;以及蒸汽排出部分(130),其设置在 用于在加热和烹调食物时借助于内部压力自动排出蒸汽的密封边缘部分(110)包括在水平方向上与密封边缘部分交叉的易剥离带(120); 以及形成在易剥离带(120)和密封边缘部(110)彼此重叠的密封弱部(111)中的蒸汽排出部(130)。

    Methods of forming pattern structures
    8.
    发明授权
    Methods of forming pattern structures 有权
    形成图案结构的方法

    公开(公告)号:US08334148B2

    公开(公告)日:2012-12-18

    申请号:US13184127

    申请日:2011-07-15

    CPC classification number: H01L27/228 H01L43/12

    Abstract: An example embodiment relates to a method of forming a pattern structure, including forming an object layer on a substrate, and forming a hard mask on the object layer. A plasma reactive etching process is performed on the object layer using an etching gas including a fluorine containing gas and ammonia (NH3) gas together with oxygen gas to form a pattern. The oxygen gas is used for suppressing the removal of the hard mask during the etching process.

    Abstract translation: 示例性实施例涉及一种形成图案结构的方法,包括在基底上形成物体层,并在物体层上形成硬掩模。 使用包含含氟气体和氨(NH 3)气体的蚀刻气体与氧气一起在物体层上进行等离子体反应蚀刻工艺以形成图案。 氧气用于在蚀刻过程中抑制硬掩模的去除。

    METHOD OF FABRICATING SEMICONDUCTOR DEVICE
    9.
    发明申请
    METHOD OF FABRICATING SEMICONDUCTOR DEVICE 有权
    制造半导体器件的方法

    公开(公告)号:US20110189851A1

    公开(公告)日:2011-08-04

    申请号:US13016228

    申请日:2011-01-28

    CPC classification number: H01L21/28

    Abstract: A method of fabricating a semiconductor device, the method including providing a substrate; forming an underlying layer on the substrate; forming a sacrificial layer on the underlying layer; forming an opening in the sacrificial layer by patterning the sacrificial layer such that the opening exposes a predetermined region of the underlying layer; forming a mask layer in the opening; forming an oxide mask by partially or completely oxidizing the mask layer; removing the sacrificial layer; and etching the underlying layer using the oxide mask as an etch mask to form an underlying layer pattern.

    Abstract translation: 一种制造半导体器件的方法,所述方法包括提供衬底; 在衬底上形成下层; 在下层上形成牺牲层; 通过图案化所述牺牲层在所述牺牲层中形成开口,使得所述开口暴露所述下层的预定区域; 在开口中形成掩模层; 通过部分或完全氧化掩模层形成氧化物掩模; 去除牺牲层; 并使用氧化物掩模作为蚀刻掩模蚀刻下层,以形成下层图案。

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