公开(公告)号：US09196403B2

公开(公告)日：2015-11-24

申请号：US13511061

申请日：2011-05-10

申请人： Toru Maeda ,  Asako Watanabe

发明人： Toru Maeda ,  Asako Watanabe

IPC分类号： H01F1/06 ,  H01F1/08 ,  H01F1/055 ,  H01F1/057 ,  B22F1/00 ,  C22C33/02 ,  C22C38/00

CPC分类号： H01F1/0552 ,  B22F1/0062 ,  B22F2998/10 ,  C22C33/0278 ,  C22C38/002 ,  C22C38/005 ,  C22C2202/02 ,  H01F1/0572 ,  H01F1/0573 ,  H01F1/0575 ,  H01F1/0576 ,  H01F1/0578 ,  H01F1/061 ,  H01F1/083 ,  H01F41/0293 ,  B22F3/02 ,  B22F2003/248

摘要： The present invention provides a powder for a magnetic member being excellent in moldability and difficult to oxidize, a powder compact produced from the powder, and a magnetic member suitable for a raw material of a magnetic member such as a rare earth magnet. A powder for a magnetic member includes magnetic particles 1 which constitute the powder for a magnetic member and each of which is composed of less than 40% by volume of a hydrogen compound 3 of a rare earth element, and the balance composed of an iron-containing material 2 which contains iron and an iron-boron alloy containing iron and boron. The hydrogen compound 3 of a rare earth element is dispersed in a phase of the iron-containing material 2. An antioxidant layer 4 having a low-oxygen permeability coefficient is provided on the surface of each of the magnetic particles 1.

摘要翻译： 本发明提供了一种成型性好，难以氧化的磁性部件粉末，由该粉末制成的粉末成形体，以及适用于稀土类磁铁等磁性部件的原料的磁性部件。 磁性部件用粉末包括构成磁性部件用粉末的磁性粒子1，它们各自由少于40体积％的稀土元素的氢化合物3构成，其余由铁 - 含有铁的含铁材料2和含有铁和硼的铁 - 硼合金。 稀土元素的氢化合物3分散在含铁材料2的相中。在每个磁性粒子1的表面上设置有低氧透过系数的抗氧化层4。

公开(公告)号：US08797137B2

公开(公告)日：2014-08-05

申请号：US13505003

申请日：2011-05-17

申请人： Asako Watanabe ,  Toru Maeda

发明人： Asako Watanabe ,  Toru Maeda

IPC分类号： H01F27/24 ,  H01F27/02 ,  H01F5/00 ,  H01F1/00 ,  H01F1/04 ,  C22C38/06 ,  H01F1/33 ,  H01F1/24 ,  H01F41/02 ,  C22C38/08 ,  C22C38/02 ,  C22C38/00 ,  C22C38/04 ,  H01F3/08

CPC分类号： C22C38/02 ,  B22F1/02 ,  C22C38/002 ,  C22C38/04 ,  C22C38/06 ,  C22C38/08 ,  C22C2202/02 ,  H01F1/24 ,  H01F1/33 ,  H01F3/08 ,  H01F41/0246

摘要： Provided is a soft magnetic powder used for obtaining a dust core having a low hysteresis loss, in particular, in a high temperature range. A soft magnetic powder includes an aggregate of composite magnetic particles, each including a soft magnetic particle containing Fe, Si, and Al, and an insulating coating film disposed on the surface thereof, and satisfies the expressions (1) and (2) below: Expression (1) . . . 27≦2.5a+b≦29 and Expression (2) . . . 6≦b≦9, where a represents the Si content (mass %) and b represents the Al content (mass %). The soft magnetic powder is capable of reducing the hysteresis loss, in a high-temperature environment, of a dust core obtained using the soft magnetic powder.

摘要翻译： 提供一种用于获得具有低磁滞损耗的压粉磁芯的软磁性粉末，特别是在高温范围内。 软磁性粉末包括复合磁性粒子的集合体，各自包含含有Fe，Si，Al的软磁性粒子和配置在其表面的绝缘涂膜，满足下述式（1）和（2）： 表达式（1）。 。 。 27＆nlE; 2.5a + b＆nlE; 29和表达式（2）。 。 。 6＆nlE; b＆nlE; 9，其中a表示Si含量（质量％），b表示Al含量（质量％）。 该软磁性粉末能够降低在高温环境下使用软磁性粉末获得的粉尘芯的磁滞损耗。

公开(公告)号：US08585427B2

公开(公告)日：2013-11-19

申请号：US13046734

申请日：2011-03-12

申请人： Teiji Ukawa ,  Toru Maeda

发明人： Teiji Ukawa ,  Toru Maeda

IPC分类号： H01R13/64

CPC分类号： H01R13/627 ,  H01R11/12 ,  H01R12/774 ,  H01R12/81 ,  H01R13/66 ,  H01R24/28 ,  H01R24/62 ,  H01R24/84 ,  H01R2107/00 ,  H01R2201/12 ,  Y10T29/49204

摘要： A connector includes: a card edge connector; a first cable drawn out from the card edge connector in a first direction; a first terminal disposed in the card edge connector and connected to the first cable; a receptacle into and from which the card edge connector is inserted and extracted; a second cable drawn out from the receptacle in a second direction; and a second terminal disposed in the receptacle and connected to the second cable. Insertion/extraction directions of the card edge connector are substantially perpendicular to at least one of the first direction and the second direction. The card edge connector includes a first end face which is substantially parallel to the insertion/extraction directions, and the receptacle includes a first wall face which is substantially parallel to the insertion/extraction directions. In a state where the card edge connector and the receptacle are coupled to each other, the first end face and the first wall face are in contact with each other.

摘要翻译： 连接器包括：卡缘连接器; 从所述卡边缘连接器沿第一方向拉出的第一电缆; 第一端子，设置在所述卡缘连接器中并连接到所述第一电缆; 卡边缘连接器插入和拔出的插座; 从所述容器沿第二方向拉出的第二电缆; 以及设置在所述插座中并连接到所述第二电缆的第二端子。 卡边缘连接器的插入/取出方向基本上垂直于第一方向和第二方向中的至少一个。 卡边缘连接器包括基本上平行于插入/取出方向的第一端面，并且插座包括基本上平行于插入/取出方向的第一壁面。 在卡边缘连接器和插座彼此联接的状态下，第一端面和第一壁面彼此接触。

公开(公告)号：US08328928B2

公开(公告)日：2012-12-11

申请号：US13055747

申请日：2009-07-08

申请人： Toru Maeda ,  Tetsuro Tanikawa ,  Akinobu Teramoto ,  Masaaki Oda

发明人： Toru Maeda ,  Tetsuro Tanikawa ,  Akinobu Teramoto ,  Masaaki Oda

IPC分类号： C09D11/00 ,  H01B1/02

CPC分类号： B22F1/0062 ,  B22F2999/00 ,  H01L21/4867 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/111 ,  H01L2224/11318 ,  H01L2224/1152 ,  H01L2224/1329 ,  H01L2224/13324 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13364 ,  H01L2224/13369 ,  H01L2224/13399 ,  H01L2224/16 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/81097 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/8184 ,  H01L2225/06513 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  B22F1/0018 ,  H01L2924/00014 ,  H01L2924/00

摘要： Metal nanoink (100) for bonding an electrode of a semiconductor die and an electrode of a substrate and/or bonding an electrode of a semiconductor die and an electrode of another semiconductor die by sintering under pressure is produced by injecting oxygen into an organic solvent (105) in the form of oxygen nanobubbles (125) or oxygen bubbles (121) either before or after metal nanoparticles (101) whose surfaces are coated with a dispersant (102) are mixed into the organic solvent (105). Bumps are formed on the electrode of the semiconductor die and the electrode of the substrate by ejecting microdroplets of the metal nanoink (100) onto the electrodes, the semiconductor die is turned upside down and overlapped in alignment over the substrate, and then, the metal nanoparticles of the bumps are sintered under pressure by pressing and heating the bumps between the electrodes. As a result, generation of voids during sintering under pressure is minimized.

摘要翻译： 通过将氧气注入到有机溶剂中来制造用于将半导体管芯的电极和基板的电极接合和/或接合半导体管芯的电极和另一个半导体管芯的电极的金属纳米管（100） 在其表面涂布有分散剂（102）的金属纳米颗粒（101）之前或之后，将氧纳米气泡（125）或氧气（121）的形式混合到有机溶剂（105）中。 通过将金属纳米线（100）的微滴喷射到电极上，在半导体管芯的电极和基板的电极上形成凸起，将半导体管芯上下颠倒并重叠在衬底上，然后将金属 通过按压和加热电极之间的凸块，在凸起的纳米颗粒被烧结。 结果，在压力下烧结过程中产生的空隙被最小化。

公开(公告)号：US08323725B2

公开(公告)日：2012-12-04

申请号：US12816833

申请日：2010-06-16

申请人： Toru Maeda ,  Naoto Igarashi ,  Haruhisa Toyoda ,  Hirokazu Kugai ,  Kazuyuki Hayashi ,  Hiroko Morii ,  Seiji Ishitani

发明人： Toru Maeda ,  Naoto Igarashi ,  Haruhisa Toyoda ,  Hirokazu Kugai ,  Kazuyuki Hayashi ,  Hiroko Morii ,  Seiji Ishitani

IPC分类号： H01F1/20

CPC分类号： B22F1/02 ,  B22F2998/10 ,  H01F1/24 ,  H01F1/26 ,  H01F41/0246 ,  Y10T428/2991 ,  B22F3/02 ,  B22F3/24

摘要： A soft magnetic material is a soft magnetic material including a composite magnetic particle (30) having a metal magnetic particle (10) mainly composed of Fe and an insulating coating (20) covering metal magnetic particle (10), and insulating coating (20) contains an iron phosphate compound and an aluminum phosphate compound. The atomic ratio of Fe contained in a contact surface of insulating coating (20) in contact with metal magnetic particle (10) is larger than the atomic ratio of Fe contained in the surface of insulating coating (20). The atomic ratio of Al contained in the contact surface of insulating coating (20) in contact with metal magnetic particle (10) is smaller than the atomic ratio of Al contained in the surface of insulating coating (20). Thus, iron loss can be reduced.

摘要翻译： 软磁性材料是包括具有主要由Fe构成的金属磁性粒子（10）和覆盖金属磁性粒子（10）的绝缘涂层（20）的复合磁性体（30）和绝缘涂层（20）的软磁性材料， 含有磷酸铁化合物和磷酸铝化合物。 包含在与金属磁性颗粒（10）接触的绝缘涂层（20）的接触表面中的Fe的原子比大于绝缘涂层（20）表面中所含的Fe的原子比。 绝缘涂层（20）与金属磁性颗粒（10）接触的接触表面中所含的Al的原子比小于绝缘涂层（20）表面中的Al的原子比。 因此，可以减少铁损。

公开(公告)号：US20120164320A1

公开(公告)日：2012-06-28

申请号：US13409850

申请日：2012-03-01

申请人： Toru Maeda ,  Naoto Igarashi ,  Haruhisa Toyoda ,  Seiji Ishitani ,  Hiroko Morii ,  Kazuyuki Hayashi

发明人： Toru Maeda ,  Naoto Igarashi ,  Haruhisa Toyoda ,  Seiji Ishitani ,  Hiroko Morii ,  Kazuyuki Hayashi

IPC分类号： B05D5/12

CPC分类号： H01F1/24 ,  B22F1/02 ,  B22F2998/10 ,  C22C33/02 ,  H01F1/26 ,  H01F3/08 ,  H01F41/0246 ,  Y10T428/2991 ,  Y10T428/2998 ,  B22F1/007 ,  B22F3/02 ,  B22F3/10

摘要： A manufacturing method of a soft magnetic material has a step of preparing a metal magnetic particle containing iron as the main component, and a step of forming an insulating film surrounding the surface of the metal magnetic particle. The step of forming the insulating film includes a step of mixing and stirring the metal magnetic particle, aluminum alkoxide, silicon alkoxide, and phosphoric acid.

摘要翻译： 软磁性材料的制造方法具有制备以铁为主要成分的金属磁性体的工序，以及形成包围金属磁性体的表面的绝缘膜的工序。 形成绝缘膜的步骤包括混合和搅拌金属磁性颗粒，醇铝，硅烷氧化物和磷酸的步骤。

公开(公告)号：US08153256B2

公开(公告)日：2012-04-10

申请号：US12160079

申请日：2006-11-22

申请人： Toru Maeda ,  Naoto Igarashi ,  Haruhisa Toyoda ,  Seiji Ishitani ,  Hiroko Morii ,  Kazuyuki Hayashi

发明人： Toru Maeda ,  Naoto Igarashi ,  Haruhisa Toyoda ,  Seiji Ishitani ,  Hiroko Morii ,  Kazuyuki Hayashi

IPC分类号： B32B5/16 ,  H01F1/12 ,  H01F1/24

CPC分类号： H01F1/24 ,  B22F1/02 ,  B22F2998/10 ,  C22C33/02 ,  H01F1/26 ,  H01F3/08 ,  H01F41/0246 ,  Y10T428/2991 ,  Y10T428/2998 ,  B22F1/007 ,  B22F3/02 ,  B22F3/10

摘要： The soft magnetic material includes a plurality of composite magnetic particles having a metal magnetic particle and an insulating film surrounding the surface of the metal magnetic particle. The metal magnetic particle contains iron as the main component. The insulating film contains aluminum, silicon, phosphorus, and oxygen. The insulating film satisfies the relationship 0.4≦MAl/(MAl+MSi)≦0.9 and the relationship of 0.25≦(MAl+MSi)/MP≦1.0 in the case that molar amount of aluminum contained in the insulating film is represented by MAl, the sum of the molar amount of aluminum contained in the insulating film and the molar amount of silicon contained in the insulating film is represented by (MAl+MSi), and the molar amount of phosphorus contained in the insulating film is represented by MP.

摘要翻译： 软磁性材料包括具有金属磁性颗粒的多个复合磁性颗粒和围绕金属磁性颗粒表面的绝缘膜。 金属磁性粒子含有铁作为主要成分。 绝缘膜含有铝，硅，磷和氧。 在绝缘膜中包含的铝的摩尔量表示的情况下，该绝缘膜满足关系0.4＆nlE; MA1 /（MA1 + MSi）＆nlE; 0.9以及0.25＆nlE;（MA1 + MSi）/MP_nlE1.0的关系 通过MA1，绝缘膜中所含的铝的摩尔量和绝缘膜中所含的硅的摩尔量之和由（MA1 + MSi）表示，绝缘膜中所含的磷的摩尔量由 MP。

公开(公告)号：US07998361B2

公开(公告)日：2011-08-16

申请号：US10599003

申请日：2005-03-29

申请人： Kazuhiro Hirose ,  Haruhisa Toyoda ,  Takao Nishioka ,  Naoto Igarashi ,  Toru Maeda ,  Yoshiyuki Shimada

发明人： Kazuhiro Hirose ,  Haruhisa Toyoda ,  Takao Nishioka ,  Naoto Igarashi ,  Toru Maeda ,  Yoshiyuki Shimada

IPC分类号： C04B35/00 ,  C09D5/23 ,  H01F1/00 ,  C01G49/08 ,  C04B35/26 ,  C04B35/64

CPC分类号： B22F1/02 ,  B22F2998/10 ,  H01F1/24 ,  H01F1/33 ,  H01F41/0246 ,  B22F3/02 ,  B22F3/24

摘要： A soft magnetic material includes: a plurality of composite magnetic particles formed from a metal magnetic particle and an insulative coating surrounding a surface of the metal magnetic particle and containing metallic salt phosphate and/or oxide; and a lubricant formed as fine particles added at a proportion of at least 0.001 percent by mass and no more than 0.1 percent by mass relative to the plurality of composite magnetic particles. With this structure, superior lubrication is provided during compacting and desired magnetic characteristics can be obtained after compacting.

摘要翻译： 软磁性材料包括：多个由金属磁性颗粒形成的复合磁性颗粒和围绕金属磁性颗粒的表面的包含金属盐磷酸盐和/或氧化物的绝缘涂层; 以及相对于多个复合磁性粒子以比例为0.001质量％以上0.1质量％以下的微粒子形成的润滑剂。 利用这种结构，在压实过程中提供了优异的润滑，并且在压实后可获得所需的磁特性。

公开(公告)号：US07975901B2

公开(公告)日：2011-07-12

申请号：US12794911

申请日：2010-06-07

申请人： Toru Maeda ,  Tetsuya Utano ,  Akinobu Teramoto

发明人： Toru Maeda ,  Tetsuya Utano ,  Akinobu Teramoto

IPC分类号： B23K31/02 ,  B23K37/00 ,  C23F1/00

CPC分类号： H01L24/85 ,  B23K20/007 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/85009 ,  H01L2224/85013 ,  H01L2224/85045 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/00014 ,  H01L2924/01001 ,  H01L2924/00

摘要： A bonding apparatus including a chamber for maintaining an inert gas atmosphere; a first plasma torch for performing a surface treatment on pads and electrodes, the first plasma torch being attached in the chamber, to apply gas plasma to a substrate and a semiconductor chip that is placed inside the chamber; a second plasma torch for performing a surface treatment on an initial ball and/or wire at a tip end of a capillary that is positioned inside the chamber, the second plasma torch being attached in the chamber, to apply gas plasma to the initial ball and/or wire; and a bonding unit for bonding the surface-treated initial ball and/or wire to the surface-treated pads and electrodes in the chamber, thereby cleaning of the surface of the electrodes and pads as well as the wire can be effectively performed.

摘要翻译： 一种接合装置，包括用于维持惰性气体气氛的室; 用于对焊盘和电极执行表面处理的第一等离子体焰炬，第一等离子体焰炬附接在腔室中，以将气体等离子体施加到衬底和放置在腔室内的半导体芯片; 第二等离子体焰炬，用于对位于所述腔室内的毛细管的前端处的初始球和/或线进行表面处理，所述第二等离子体焰炬附接在所述腔室中，以将气体等离子体施加到所述初始球体;以及 /或电线; 以及用于将表面处理的初始球和/或线结合到腔室中的表面处理的垫和电极的接合单元，从而可以有效地执行电极和垫的表面以及线的清洁。

公开(公告)号：US20100294435A1

公开(公告)日：2010-11-25

申请号：US12794911

申请日：2010-06-07

申请人： Toru MAEDA ,  Tetsuya UTANO ,  Akinobu TERAMOTO

发明人： Toru MAEDA ,  Tetsuya UTANO ,  Akinobu TERAMOTO

IPC分类号： H01L21/44

CPC分类号： H01L24/85 ,  B23K20/007 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/85009 ,  H01L2224/85013 ,  H01L2224/85045 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/00014 ,  H01L2924/01001 ,  H01L2924/00

摘要： A bonding apparatus including a chamber for maintaining an inert gas atmosphere; a first plasma torch for performing a surface treatment on pads and electrodes, the first plasma torch being attached in the chamber, to apply gas plasma to a substrate and a semiconductor chip that is placed inside the chamber; a second plasma torch for performing a surface treatment on an initial ball and/or wire at a tip end of a capillary that is positioned inside the chamber, the second plasma torch being attached in the chamber, to apply gas plasma to the initial ball and/or wire; and a bonding unit for bonding the surface-treated initial ball and/or wire to the surface-treated pads and electrodes in the chamber, thereby cleaning of the surface of the electrodes and pads as well as the wire can be effectively performed.

摘要翻译： 一种接合装置，包括用于维持惰性气体气氛的室; 用于对焊盘和电极执行表面处理的第一等离子体焰炬，第一等离子体焰炬附接在腔室中，以将气体等离子体施加到衬底和放置在腔室内的半导体芯片; 第二等离子体焰炬，用于对位于所述腔室内的毛细管的前端处的初始球和/或线进行表面处理，所述第二等离子体焰炬附接在所述腔室中，以将气体等离子体施加到所述初始球体;以及 /或电线; 以及用于将表面处理的初始球和/或线结合到腔室中的表面处理的垫和电极的接合单元，从而可以有效地执行电极和垫的表面以及线的清洁。