公开(公告)号：US06949719B2

公开(公告)日：2005-09-27

申请号：US10831111

申请日：2004-04-26

申请人： Osamu Suenaga ,  Wataru Okase ,  Takenobu Matsuo

发明人： Osamu Suenaga ,  Wataru Okase ,  Takenobu Matsuo

IPC分类号： F27D1/00 ,  F27D17/00 ,  F28F13/14 ,  H01L21/22 ,  F27B5/14

CPC分类号： F28F13/14 ,  Y10T156/1348 ,  Y10T428/236 ,  Y10T428/24149 ,  Y10T428/24157

摘要： A thermal insulator can change a heat insulation characteristic partially with a simple structure. The thermal insulator is divided into a plurality of parts in accordance with a temperature of a heat source which is insulated by the thermal insulator. The plurality of parts are formed of different honeycomb structures, respectively, so as to provide different heat insulation characteristics. The plurality of parts may be formed by different materials, or a shape or dimension such as a cell pitch of the honeycomb structure may be varied. Heat is collected from air within the honeycomb cells, and is transferred to other parts for heating.

摘要翻译： 绝热体可以通过简单的结构部分地改变绝热特性。 热绝缘体根据由绝热体绝缘的热源的温度分为多个部分。 多个部件分别由不同的蜂窝结构形成，以提供不同的隔热特性。 多个部分可以由不同的材料形成，或者可以改变诸如蜂窝结构体的细胞间距的形状或尺寸。 从蜂窝状细胞内的空气中收集热量，并将其转移到其他部分进行加热。

公开(公告)号：US06716329B2

公开(公告)日：2004-04-06

申请号：US09846660

申请日：2001-05-01

申请人： Wataru Okase ,  Takenobu Matsuo

发明人： Wataru Okase ,  Takenobu Matsuo

IPC分类号： C25D2112

CPC分类号： C25D17/001 ,  C25D7/123

摘要： A plating system is composed of a transfer device for performing transfer of a wafer, a plating unit and a washing/drying unit provided around the transfer device. Each unit is structured to be detachable from the plating system. The plating unit is divided into a wafer transfer section and a plating section by a separator, and atmosphere of each section is independently set.

摘要翻译： 电镀系统由设置在转印装置周围的晶片，电镀单元和洗涤/干燥单元的转印用转印装置构成。 每个单元被构造成可从电镀系统拆卸。 电镀单元通过隔板分为晶片转印部和镀层部，各部分的气氛被独立设定。

公开(公告)号：US06337365B1

公开(公告)日：2002-01-08

申请号：US09381667

申请日：1999-09-24

申请人： Takenobu Matsuo ,  Tsuyoshi Wakabayashi ,  Misako Saito ,  Sadao Kobayashi ,  Yoshihide Wakayama ,  Masayuki Imafuku

发明人： Takenobu Matsuo ,  Tsuyoshi Wakabayashi ,  Misako Saito ,  Sadao Kobayashi ,  Yoshihide Wakayama ,  Masayuki Imafuku

IPC分类号： C08L9106

CPC分类号： C08K5/0075

摘要： An electronic/electric part used in a clean room in which the atmosphere is controlled to process a substrate in a semiconductor device industry, which contains a resin base material and additives added to the resin base material. The additives contain one or more materials selected from the group consisting of an anti-electrostatic agent made of a nonionic compound of a molecular weight of 350 or higher, an anti-oxidizing agent made of a phenolic compound of a molecular weight of 300 or higher, a lubricant, a plasticizer, a fire retardant, and a water repellent. The additives hardly releases gaseous organic substances from the resin base material under a condition where the part is used.

摘要翻译： 一种电子/电气部件，其用于在半导体器件工业中控制气氛以处理衬底的洁净室中，该半导体器件工业包含树脂基材和添加到树脂基材中的添加剂。 添加剂含有一种或多种选自由分子量为350以上的非离子化合物制成的抗静电剂的组分，由分子量为300以上的酚类化合物制成的抗氧化剂 润滑剂，增塑剂，阻燃剂和防水剂。 在使用该部件的条件下，添加剂在树脂基材中几乎不释放气态有机物质。

公开(公告)号：US5853803A

公开(公告)日：1998-12-29

申请号：US964608

申请日：1997-11-05

申请人： Kiyohisa Tateyama ,  Kimio Motoda ,  Tatsuya Iwasaki ,  Takenobu Matsuo ,  Kazuki Denpoh ,  Eiji Yamaguchi

发明人： Kiyohisa Tateyama ,  Kimio Motoda ,  Tatsuya Iwasaki ,  Takenobu Matsuo ,  Kazuki Denpoh ,  Eiji Yamaguchi

IPC分类号： B05C11/08 ,  G03F7/16 ,  H01L21/00 ,  H01L21/687 ,  B05D3/12

CPC分类号： H01L21/67173 ,  B05C11/08 ,  G03F7/162 ,  G03F7/168 ,  H01L21/6715 ,  H01L21/68707 ,  Y10S134/902

摘要： A method of resist-processing a rectangular substrate including a resist coating step of supplying resist solution to the substrate, while rotating it, to form resist film at least on one surface of it and a resist removing step of jetting removing liquid, which can solve resist, to both surfaces of it at its side peripheral portions to remove the resist film from them.

摘要翻译： 一种抗蚀剂处理方法，包括抗蚀剂涂布步骤，该方法包括在将抗蚀剂溶液旋转的同时向其提供抗蚀剂溶液，以至少在其一个表面上形成抗蚀剂膜，以及除去液体的抗蚀剂去除步骤，其可以解决 在其侧边缘处抵抗其两个表面以从它们去除抗蚀剂膜。

公开(公告)号：US5359148A

公开(公告)日：1994-10-25

申请号：US96893

申请日：1993-07-26

申请人： Wataru Okase ,  Takashi Tanahashi ,  Takenobu Matsuo

发明人： Wataru Okase ,  Takashi Tanahashi ,  Takenobu Matsuo

IPC分类号： H01L21/203 ,  C23C16/44 ,  C30B25/14 ,  C30B31/16 ,  F16J15/02 ,  F16L23/16 ,  H01L21/00 ,  H01L21/205 ,  H01L21/22 ,  H01L21/302 ,  H01L21/31 ,  C23C16/00

CPC分类号： C23C16/4409 ,  C23C16/4401 ,  C30B25/14 ,  C30B31/16 ,  F16J15/022 ,  F16L23/16 ,  F16L23/22 ,  H01L21/67115 ,  Y10S285/911

摘要： A heat-treating apparatus has a reaction vessel being adapted for performing a heat process for a workpiece to be treated and having a joint pipe portion and an outer pipe jointed to the joint pipe portion and of the reaction vessel. A sealing member is disposed between the outer pipe and the joint pipe portion. The sealing member has a relatively soft core member and a film harder than the core member. The film is disposed on the surface of the core member and has a heat resistance and a chemical resistance. Since the core member of the sealing portion has flexibility, it easily deforms corresponding to the shape of the sealing portion. The film provided on the core member prevents the sealing member from thermally adhering to the sealing portion and from thermally deteriorating.

摘要翻译： 热处理装置具有适于对待处理的工件进行加热处理的反应容器，并具有连接到接合管部分和反应容器的接合管部分和外管。 密封构件设置在外管和接头管部之间。 密封构件具有相对软的芯构件和比芯构件更硬的膜。 该膜设置在芯构件的表面上并具有耐热性和耐化学性。 由于密封部的芯构件具有柔性，因此容易根据密封部的形状而变形。 设置在芯构件上的膜防止密封构件热粘附到密封部分并导致热劣化。

公开(公告)号：US06740164B2

公开(公告)日：2004-05-25

申请号：US10058290

申请日：2002-01-30

申请人： Wataru Okase ,  Takenobu Matsuo

发明人： Wataru Okase ,  Takenobu Matsuo

IPC分类号： H01L2144

CPC分类号： H01L21/2885 ,  C25D7/12 ,  C25D17/001

摘要： Plating apparatus and plating method that can plate more uniformly on a processing surface of a workpiece are provided. The plating apparatus is comprised of a plating solution bathe which is provided with a first electrode held in a state soaked in a plating solution; a workpiece holding mechanism which holds a workpiece to contact its processing surface to the plating solution; and a contact member, disposed in the workpiece holding mechanism, that electrically contacts with the circumferential edge of the workpiece so to form a conductive layer on the workpiece surface as a second electrode. The contact member is divided along the circumferential direction of the workpiece with which they are electrically contacted. Thus, even if the contact resistance between each section of the contact member with the workpiece is variable, it is possible to adjust the plating electric current for each section of the contact member.

摘要翻译： 提供了可以在工件的加工表面上更均匀地平板化的电镀装置和电镀方法。 电镀装置由电镀液沐浴组成，电镀液包含浸渍在电镀液中的状态的第一电极; 工件保持机构，其保持工件以将其处理表面接触到电镀液; 以及设置在所述工件保持机构中的与所述工件的周向边缘电接触以在所述工件表面上形成作为第二电极的导电层的接触构件。 接触构件沿着与它们电接触的工件的圆周方向分开。 因此，即使接触构件与工件的每个部分之间的接触电阻是可变的，也可以调节接触构件的每个部分的电镀电流。

公开(公告)号：US06403498B1

公开(公告)日：2002-06-11

申请号：US09194539

申请日：1998-11-30

申请人： Takenobu Matsuo ,  Tsuyoshi Wakabayashi ,  Teruyuki Hayashi ,  Misako Saito

发明人： Takenobu Matsuo ,  Tsuyoshi Wakabayashi ,  Teruyuki Hayashi ,  Misako Saito

IPC分类号： H01L2131

CPC分类号： H01L21/02043 ,  H01L21/3121

摘要： A substrate processing method of processing a surface of a substrate in manufacture of a semiconductor device, characterized by comprising a surface processing step for making a substance having an adsorption heat higher than that of an organic matter whose adsorption on the surface of the substrate, which has been cleaned, is undesirable, adsorbed on the surface of the substrate, and a film formation step for forming a thin film on the surface of the substrate which was processed in the above step.

摘要翻译： 一种在制造半导体器件中处理衬底表面的衬底处理方法，其特征在于包括：表面处理步骤，用于使吸附热量高于在衬底表面吸附的有机物的吸附热量的物质， 已被清洗，不希望的，吸附在基材的表面上，以及在上述步骤中处理的基材表面上形成薄膜的成膜步骤。

公开(公告)号：US6077894A

公开(公告)日：2000-06-20

申请号：US147061

申请日：1998-09-29

申请人： Misako Saito ,  Takenobu Matsuo ,  Tsuyoshi Wakabayashi ,  Sadao Kobayashi ,  Yoshihide Wakayama ,  Masayuki Imafuku

发明人： Misako Saito ,  Takenobu Matsuo ,  Tsuyoshi Wakabayashi ,  Sadao Kobayashi ,  Yoshihide Wakayama ,  Masayuki Imafuku

IPC分类号： H01L21/68 ,  A43B1/14 ,  A43B3/16 ,  H01L21/67 ,  H01L21/673 ,  H01L21/677 ,  C08K5/20

CPC分类号： H01L21/67757 ,  A43B1/14 ,  A43B3/163 ,  H01L21/67 ,  H01L21/67366 ,  H01L21/67396

摘要： There are instruments used for handling a substrate in a clean room at room temperature and atmospheric pressure, which contain a resin base and at least one additive selected from the group consisting of a lubricant, a plasticizer, an anti-oxidizing agent and an antistatic agent, and the additives do not generate gaseous organic material compound under conditions of room temperature and atmospheric pressure.

摘要翻译： PCT No.PCT / JP97 / 01039 Sec。 371日期：1998年9月29日 102（e）1998年9月29日PCT PCT 1997年3月27日PCT公布。 公开号WO97 / 37381 日期1997年10月9日在室温和大气压下在洁净室中处理基材的仪器包括树脂基材和至少一种选自润滑剂，增塑剂，抗氧化剂 试剂和抗静电剂，并且添加剂在室温和大气压条件下不产生气态有机材料化合物。

公开(公告)号：US5514196A

公开(公告)日：1996-05-07

申请号：US226853

申请日：1994-04-13

申请人： Takashi Tanahashi ,  Syuji Moriya ,  Tsuyoshi Wakabayashi ,  Takenobu Matsuo

发明人： Takashi Tanahashi ,  Syuji Moriya ,  Tsuyoshi Wakabayashi ,  Takenobu Matsuo

IPC分类号： F24F3/16 ,  B01D46/00

CPC分类号： F24F3/16 ,  F24F2003/1614 ,  F24F2003/1625

摘要： An air cleaning apparatus includes an air passage chamber having a suction port, from which air is sucked, and a discharge port from which the air sucked from the suction port is discharged, an air blower, provided in the air passage chamber, for sucking the air from the suction port into the air passage chamber and discharging the sucked air from the discharge port, and a particle removing mechanism for removing particles contained in the air sucked from the suction port, the entire body of the particle removing mechanism being formed of a material which generates little impurity gas detrimental to processing in a processing space.

摘要翻译： 一种空气净化装置，具有：具有吸入口的吸入口和从吸入口吸入的空气从其排出的排出口的空气通道室，设置在该通气室内的用于吸入 空气从吸入口进入空气通道室并从排出口排出吸入空气;以及颗粒去除机构，用于去除从吸入口吸入的空气中所含的颗粒，颗粒去除机构的整体由 产生对处理空间中的处理有害的少量杂质气体的材料。

公开(公告)号：US5445521A

公开(公告)日：1995-08-29

申请号：US250379

申请日：1994-05-27

申请人： Eiji Yamaguchi ,  Kaoru Fujihara ,  Takenobu Matsuo ,  Hirofumi Kitayama

发明人： Eiji Yamaguchi ,  Kaoru Fujihara ,  Takenobu Matsuo ,  Hirofumi Kitayama

IPC分类号： C23C16/44 ,  C23C16/455 ,  C23C16/52 ,  C30B25/14 ,  F27D19/00 ,  F27D5/00

CPC分类号： C23C16/45557 ,  C23C16/4401 ,  C23C16/52 ,  C30B25/14 ,  F27D19/00 ,  F27D2019/0009 ,  F27D2019/0068

摘要： A heat treating device including a pressure detecting unit for outputting an output signal when a pressure in a heat processing furnace becomes a set value, an air release pipe having a first valve and a check valve, a differential pressure gauge shut off by a second valve in terms of pressure from the interior of the heat processing furnace, and an air feed pipe having a third valve. One ends of each of the air release pipe and the air feed pipe is connected respectively to the heat processing furnace and the other ends opened in air. In such arrangement, after processing gases are evacuated from the heat processing furnace, an inert gas is fed. Then when an internal pressure of the furnace becomes near an air pressure, the first valve is opened in response to the output signal of the pressure detecting unit to make the internal pressure of the heat processing furnace a little higher than the air pressure. When a differential pressure value of the differential pressure gauge is below a set value, the third value is opened to communicate the interior of the heat processing furnace with air through the air feed pipe. Then the cap closing the opening of the heat processing furnace is opened.

摘要翻译： 一种热处理装置，包括：当热处理炉中的压力变为设定值时输出输出信号的压力检测单元;具有第一阀和止回阀的排气管，由第二阀关闭的差压表 在来自热处理炉的内部的压力和具有第三阀的进气管。 每个排气管和供气管的一端分别连接到热处理炉，另一端在空气中敞开。 在这样的布置中，在处理气体从热处理炉抽出之后，供给惰性气体。 然后，当炉子的内部压力接近空气压力时，响应于压力检测单元的输出信号打开第一阀门，使得热处理炉的内部压力比空气压力高一点。 当差压表的差压值低于设定值时，打开第三值，以使热处理炉的内部通过供气管与空气相通。 然后关闭热处理炉的开口的盖子打开。