公开(公告)号：US07976362B2

公开(公告)日：2011-07-12

申请号：US12534465

申请日：2009-08-03

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Teruyuki Watanabe ,  Kenichi Kobayashi ,  Masayuki Kumekawa ,  Toshio Yokoyama

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Teruyuki Watanabe ,  Kenichi Kobayashi ,  Masayuki Kumekawa ,  Toshio Yokoyama

IPC分类号： B24B29/00

CPC分类号： B24B37/04 ,  B24B55/02 ,  Y10S451/914

摘要： A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.

摘要翻译： 一种基板研磨装置，具备：具有保持被研磨基板的头部的基板保持机构，以及具备安装有研磨垫的研磨台的研磨机构。 由头部保持的基板被压靠在抛光台上的抛光垫上，以通过基板和抛光垫的相对运动来抛光基板。 基板抛光装置还包括用于将要抛光的基板输送到头部并且接收经抛光的基板的基板传送机构。 基板转印机构包括用于接收待抛光的基板的待抛光基板和用于接收被抛光的基板的抛光的基板接收器。

公开(公告)号：US07585205B2

公开(公告)日：2009-09-08

申请号：US11905687

申请日：2007-10-03

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Teruyuki Watanabe ,  Kenichi Kobayashi ,  Masayuki Kumekawa ,  Toshio Yokoyama

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Teruyuki Watanabe ,  Kenichi Kobayashi ,  Masayuki Kumekawa ,  Toshio Yokoyama

IPC分类号： B24B49/00

CPC分类号： B24B37/04 ,  B24B55/02 ,  Y10S451/914

摘要： A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.

摘要翻译： 一种基板研磨装置，具备：具有保持被研磨基板的头部的基板保持机构，以及具备安装有研磨垫的研磨台的研磨机构。 由头部保持的基板被压靠在抛光台上的抛光垫上，以通过基板和抛光垫的相对运动来抛光基板。 基板抛光装置还包括用于将要抛光的基板输送到头部并且接收经抛光的基板的基板传送机构。 基板转印机构包括用于接收待抛光的基板的待抛光基板和用于接收被抛光的基板的抛光的基板接收器。

公开(公告)号：US20080178800A1

公开(公告)日：2008-07-31

申请号：US12076834

申请日：2008-03-24

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Teruyuki Watanabe ,  Ryo Kato ,  Toshio Yokoyama ,  Kenichi Suzuki ,  Kenichi Kobayashi

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Teruyuki Watanabe ,  Ryo Kato ,  Toshio Yokoyama ,  Kenichi Suzuki ,  Kenichi Kobayashi

IPC分类号： B05C3/02

CPC分类号： H01L21/288 ,  C23C2/003 ,  C23C18/1619 ,  C23C18/163 ,  C23C18/1642 ,  H01L21/6708 ,  H01L21/67742 ,  H01L21/6838 ,  H01L21/76849

摘要： A substrate processing unit includes: a vertically-movable substrate holder for holding a substrate; a pan surrounding a periphery of the substrate holder; a cell, located below the substrate holder and within the pan, having in its interior a chemical processing section; and a cell cover, capable of closing a top opening of the cell, having a plurality of spray nozzles for separately spraying at least two types of processing liquids, wherein the pan and the cell each have an individual liquid discharge line.

公开(公告)号：US07374646B2

公开(公告)日：2008-05-20

申请号：US10767253

申请日：2004-01-30

申请人： Hidenao Suzuki ,  Kazufumi Nomura ,  Kunihito Ide ,  Hiroyuki Kanda ,  Koji Mishima ,  Naoki Mihara ,  Natsuki Makino ,  Seiji Katsuoka

发明人： Hidenao Suzuki ,  Kazufumi Nomura ,  Kunihito Ide ,  Hiroyuki Kanda ,  Koji Mishima ,  Naoki Mihara ,  Natsuki Makino ,  Seiji Katsuoka

IPC分类号： C25D17/00 ,  C25D17/02 ,  C25D17/06 ,  C25D7/12

CPC分类号： H01L21/2885 ,  C25D7/123 ,  C25D17/001 ,  H01L21/76877

摘要： The present invention provides an electrolytic processing apparatus which is capable of increasing an in-plane uniformity of a film thickness of a plated film by making more uniform an electric field distribution over an entire surface to be processed of a substrate even if the substrate has a large area, and controlling more uniformly a speed, over the entire surface to be processed of the substrate. The electrolytic processing apparatus of this invention includes: a substrate holder for holding a substrate, a first electrode for being brought into contact with the substrate to supply current to a surface, to be processed, of the substrate; a second electrode disposed substantially parallel to the surface, to be processed, of the substrate in a position facing the surface, to be processed, of the substrate held by the substrate holder; a high resistance structure disposed between the substrate held by the substrate holder and the second electrode; an electrolytic solution introducing portion for introducing an electrolytic solution into a region across which the substrate held by the substrate holder and the high resistance structure face each other, from laterally of the high resistance structure; and a power source for applying a voltage between the first electrode and the second electrode.

摘要翻译： 本发明提供一种电解处理装置，其能够通过使基板的整个表面上的电场分布更均匀，从而提高镀膜的膜厚的面内均匀性， 大面积，并且在基板的整个待处理表面上更均匀地控制速度。 本发明的电解处理装置包括：用于保持基板的基板保持器，用于与基板接触的第一电极，以将基板的待加工表面供给电流; 基板平行于被处理面的基板平面的第二电极，所述第一电极与所述基板保持器保持的所述基板面对所述要被处理的表面的位置; 设置在由衬底保持器保持的衬底和第二电极之间的高电阻结构; 电解液引入部分，用于将电解溶液引入到由所述衬底保持器保持的所述衬底和所述高电阻结构面对的区域中，从所述高电阻结构的侧面引出; 以及用于在第一电极和第二电极之间施加电压的电源。

公开(公告)号：US20070070575A1

公开(公告)日：2007-03-29

申请号：US10578100

申请日：2004-12-22

申请人： Masahiko Sekimoto ,  Seiji Katsuoka ,  Naoki Dai ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Suzuki ,  Kenichi Kobayashi ,  Yasuyuki Motoshima ,  Ryo Kato

发明人： Masahiko Sekimoto ,  Seiji Katsuoka ,  Naoki Dai ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Suzuki ,  Kenichi Kobayashi ,  Yasuyuki Motoshima ,  Ryo Kato

IPC分类号： H01T23/00

CPC分类号： H01L21/67086 ,  H01L21/67051 ,  H01L21/687

摘要： A substrate holding apparatus can meet the request for a smaller-sized compact apparatus while ensuring a sufficient immersion depth of a substrate in a processing liquid. The substrate holding apparatus includes: a substrate holder (84) for supporting a substrate (W) by bringing a peripheral portion of a surface of the substrate (W) into contact with a first sealing member (92); and a substrate pressing section (85) for lowering relative to the substrate holder (84) so as to press the substrate (W) held by the substrate holder (84) downward, thereby bringing the first sealing member (92) into pressure contact with the substrate (W); wherein the substrate pressing section (85) is provided with a second ring-shaped sealing member (170) which makes pressure contact with an upper surface of a ring-shaped holding section of the substrate holder (84), thereby sealing the peripheral region of the substrate pressing section (85).

摘要翻译： 基板保持装置可以满足对较小尺寸的小型装置的要求，同时确保基板在处理液体中的足够的浸入深度。 基板保持装置包括：通过使基板（W）的表面的周边部分与第一密封构件（92）接触来支撑基板（W）的基板保持件（84）; 以及用于相对于基板保持件（84）下降以便将由基板保持件（84）保持的基板（W）向下压的基板按压部（85），从而使第一密封部件（92）与 基板（W）; 其中，所述基板按压部（85）设置有与所述基板保持件（84）的环状保持部的上表面压力接触的第二环状密封部件（170），从而密封所述基板保持部 基板按压部（85）。

公开(公告)号：US20060236929A1

公开(公告)日：2006-10-26

申请号：US11455736

申请日：2006-06-20

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motoshima ,  Akira Owatari ,  Naoki Dai

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motoshima ,  Akira Owatari ,  Naoki Dai

IPC分类号： B05C3/02

CPC分类号： H01L21/67161 ,  C23C18/1628 ,  C23C18/1893 ,  C25D7/123 ,  C25D17/001 ,  C25D17/08 ,  H01L21/67051 ,  H01L21/67126 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/6723 ,  H01L21/67742 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/67781 ,  H01L21/68707 ,  H01L21/68721 ,  Y10S134/902 ,  Y10T279/11

摘要： The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.

公开(公告)号：US06413146B1

公开(公告)日：2002-07-02

申请号：US09984433

申请日：2001-10-30

申请人： Seiji Katsuoka ,  Manabu Tsujimura ,  Kunihiko Sakurai ,  Hiroyuki Osawa

发明人： Seiji Katsuoka ,  Manabu Tsujimura ,  Kunihiko Sakurai ,  Hiroyuki Osawa

IPC分类号： B24B4900

CPC分类号： B24B37/345 ,  B24B27/0023 ,  B24B37/10 ,  B24B37/11 ,  B24B49/12 ,  B24B53/017 ,  Y10T29/53961

摘要： This invention pertains to a polishing apparatus for polishing a semiconductor wafer. The apparatus comprises a storage section that is capable of receiving a workpiece to be polished and a polished workpiece. The polishing unit that polishes the workpiece includes a primary polishing table and a secondary polishing table, wherein the polishing surface of the secondary polishing table is constructed to be arranged such that at least a portion of a surface of the workpiece being polished by the polishing surface of the secondary polishing table extends beyond an edge of the polishing surface of the secondary polishing table. Also provided is a film thickness measuring device, which measures the thickness of a film formed on a polished workpiece while the polished workpiece is held by a top ring above a pusher.

摘要翻译： 本发明涉及用于研磨半导体晶片的抛光装置。 该装置包括能够接收待抛光工件和抛光工件的存储部分。 抛光工件的抛光单元包括主抛光台和二次抛光台，其中二次抛光台的抛光表面被构造成使得被抛光表面抛光的工件表面的至少一部分 的二次抛光台延伸超过二次抛光台的抛光表面的边缘。 还提供了一种膜厚测量装置，其测量在抛光工件上形成的膜的厚度，同时抛光的工件由推动器上方的顶环保持。

公开(公告)号：US06402597B1

公开(公告)日：2002-06-11

申请号：US09580829

申请日：2000-05-30

申请人： Kunihiko Sakurai ,  Seiji Katsuoka

发明人： Kunihiko Sakurai ,  Seiji Katsuoka

IPC分类号： B34B5300

CPC分类号： B24B53/017 ,  B24B37/015 ,  B24B37/04

摘要： A workpiece such as a semiconductor wafer is polished to a planar finish by a polishing apparatus. The polishing apparatus comprises a turntable having a polishing surface thereon, a top ring for holding a workpiece and pressing the workpiece against the polishing surface, a dressing apparatus having a dresser element for dressing the polishing surface by bringing the dresser element into contact with the polishing surface, and a temperature control device for controlling the temperature of the dresser element before dressing and/or during dressing.

摘要翻译： 通过抛光装置将诸如半导体晶片的工件抛光成平面光洁度。 抛光装置包括其上具有抛光表面的转台，用于保持工件并将工件压靠在抛光表面上的顶环，具有用于通过使修整器元件与抛光接触来修整抛光表面的修整器元件的修整装置 表面和用于在敷料和/或敷料期间控制修整器元件的温度的温度控制装置。

公开(公告)号：US5643067A

公开(公告)日：1997-07-01

申请号：US571598

申请日：1995-12-13

申请人： Seiji Katsuoka ,  Kunihiko Sakurai ,  Tetsuji Togawa

发明人： Seiji Katsuoka ,  Kunihiko Sakurai ,  Tetsuji Togawa

IPC分类号： B24B53/00 ,  B24B53/007 ,  B24B53/017 ,  B24B21/18 ,  B24B33/00 ,  B24B47/26 ,  B24B55/00

CPC分类号： B24B53/017 ,  B24B53/00

摘要： A dressing apparatus is used to resurface a polishing surface of a polish cloth used to polish semiconductor wafers. A dressing brush which spins on its own axis is also coupled to a drive shaft of a main drive of the dressing apparatus through a planetary gear mechanism so that the brush will rotate or orbit about the drive shaft. Therefore, the dressing brush traces a complex path and its dressing action is spread over a wide surface area of the polishing cloth to produce thorough resurfacing of the polishing surface. The service life of the cloth is significantly increased and contributes to improving the overall efficiency of preparing high quality polished semiconductor wafers. For economy, the dressing apparatus can be mounted easily on a conventional polishing apparatus having a dressing facility.

摘要翻译： 修整装置用于重新表面抛光用于抛光半导体晶片的抛光布的抛光表面。 在其自身的轴线上旋转的修整刷也通过行星齿轮机构联接到修整设备的主驱动器的驱动轴，使得电刷将围绕驱动轴旋转或轨道。 因此，修整刷跟踪复杂的路径，并且其修整作用分布在抛光布的宽表面区域上，以产生抛光表面的彻底表面。 布的使用寿命显着增加，有助于提高制备高质量抛光半导体晶片的整体效率。 为了经济，敷料装置可以容易地安装在具有修整设备的常规抛光装置上。

公开(公告)号：US08795032B2

公开(公告)日：2014-08-05

申请号：US12457175

申请日：2009-06-03

申请人： Mitsuru Miyazaki ,  Seiji Katsuoka ,  Naoki Matsuda ,  Junji Kunisawa ,  Kenichi Kobayashi ,  Hiroshi Sotozaki ,  Hiroyuki Shinozaki ,  Osamu Nabeya ,  Shinya Morisawa ,  Takahiro Ogawa ,  Natsuki Makino

发明人： Mitsuru Miyazaki ,  Seiji Katsuoka ,  Naoki Matsuda ,  Junji Kunisawa ,  Kenichi Kobayashi ,  Hiroshi Sotozaki ,  Hiroyuki Shinozaki ,  Osamu Nabeya ,  Shinya Morisawa ,  Takahiro Ogawa ,  Natsuki Makino

IPC分类号： B24B51/00

CPC分类号： B24B37/345 ,  H01L21/30625 ,  H01L21/67219 ,  H01L21/67739 ,  H01L21/67742 ,  H01L21/67754 ,  Y10T137/0318 ,  Y10T137/8593

摘要： An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

摘要翻译： 公开了一种用于处理衬底的设备。 该装置包括：抛光部，其被配置为对基板进行抛光;移动机构，被配置为传送基板;以及清洁部，其构造成清洁和干燥被研磨的基板。 清洗部具有多个用于清洗多个基板的清洗线。 多个清洁线具有多个清洁模块和用于传送基板的多个传送机器人。