公开(公告)号：US06827629B2

公开(公告)日：2004-12-07

申请号：US10726650

申请日：2003-12-04

Applicant: Dea-Yun Kim ,  Jae-Won Hwang ,  Eun-Ju Kang

Inventor： Dea-Yun Kim ,  Jae-Won Hwang ,  Eun-Ju Kang

IPC: B24B4900

CPC classification number: B24B37/013 ,  B24B49/12

Abstract: A polishing system controls the durations over which different layers on a substrate are sequentially polished. The polishing system polishes an upper layer using an endpoint detection technique and polishes a lower layer using a closed loop control technique. Once the lower layer is detected during the course of polishing the upper layer, the polishing system automatically enters the recipe for polishing the lower layer under a closed loop control mode.

公开(公告)号：US06811465B1

公开(公告)日：2004-11-02

申请号：US10111641

申请日：2002-04-26

Applicant: Daniel Andrew Mavro-Michaelis

Inventor： Daniel Andrew Mavro-Michaelis

IPC: B24B4900

CPC classification number: B24B49/00 ,  B24B1/00 ,  B24B5/42 ,  B24B19/125 ,  B24B27/0076 ,  B24B49/16

Abstract: In a method of grinding a component such as a cam, a reduction in the finish grinding time is achieved by rotating the component through only a single revolution during a final grinding step and controlling the depth of cut and the component speed of rotation during that single revolution, so as to maintain a substantially constant specific metal removal rate during the final grinding step. The headstock (12) velocity can vary between 2 and 20 rpm during a single revolution of the cam during the final grinding step, with the lower speed used for grinding the flanks and the higher speed used during the grinding of the nose and base of the cam. Using a grinding machine (10) having 17.5 kw of available power for rotating the wheel, and cutting a grinding wheel in the range 80-120 mm diameter, typically the depth of cut lies in the range of 0.25 to 0.5 mm.

Abstract translation: 在研磨诸如凸轮的部件的方法中，通过在最终研磨步骤期间仅旋转单一旋转部件并且在该单个旋转期间控制切割深度和部件旋转速度来实现精磨时间的减少 以便在最终研磨步骤期间保持基本恒定的特定金属去除速率。 在最终研磨步骤期间，在凸轮的单次旋转期间，主轴箱（12）的速度可以在2和20rpm之间变化，其中用于研磨侧面的较低速度以及在研磨鼻子和底座期间使用的较高速度 凸轮 使用具有17.5kw可用功率的研磨机（10）来旋转车轮，并且切割直径为80-120mm的砂轮，通常切割深度在0.25至0.5mm的范围内。

公开(公告)号：US06796879B2

公开(公告)日：2004-09-28

申请号：US10045781

申请日：2002-01-12

Applicant: Rico Cheng ,  Kang-Yung Peng ,  Kevin Lai

Inventor： Rico Cheng ,  Kang-Yung Peng ,  Kevin Lai

IPC: B24B4900

CPC classification number: B24B37/0053 ,  B24B37/04 ,  Y10S269/903

Abstract: A dual semiconductor wafer slippage, or loss, and water-resistant sensor holder for chemical mechanical polishing (CMP) semiconductor fabrication equipment is disclosed. The holder has a body and a cover. The body is designed to hold two wafer slippage sensors at an angle to a vertical plane, such as substantially fifteen degrees, and has a window to allow the sensors to detect wafer slippage. The cover is situated over the window of the body to prevent slurry from spraying and drying onto the sensors during high-pressure rinse cleaning of a platen of the CMP semiconductor fabrication equipment.

Abstract translation: 公开了用于化学机械抛光（CMP）半导体制造设备的双半导体晶片滑移或损失和防水传感器保持器。 支架有一个主体和一个盖子。 主体被设计成将两个晶片滑动传感器保持在垂直平面（例如大致十五度）的角度，并且具有允许传感器检测晶片滑动的窗口。 盖子位于身体的窗口之上，以防止在CMP半导体制造设备的压板的高压冲洗清洁期间浆料喷洒和干燥到传感器上。

公开(公告)号：US06796878B2

公开(公告)日：2004-09-28

申请号：US10184882

申请日：2002-07-01

Applicant: Masaaki Mitsuzono ,  Kenji Miura ,  Yutaka Tsukita

Inventor： Masaaki Mitsuzono ,  Kenji Miura ,  Yutaka Tsukita

IPC: B24B4900

CPC classification number: B23Q1/52 ,  B23Q17/22 ,  B23Q37/002 ,  Y10S451/90 ,  Y10T29/5109 ,  Y10T29/511 ,  Y10T74/1556 ,  Y10T409/307672

Abstract: There is provided an NC machine tool with tiltable spindle unit capable of being used both as vertical and inclined spindle type machine tools without restrictions on stroke and capable of easily carrying out tool measurement, alignment of a work piece with a tool, and truing. The NC machine tool includes: a spindle unit having a spindle serving both as a vertical spindle and an inclined spindle; and a tilting mechanism having a turning shaft for pivotably supporting the spindle unit on a vertical plane. The turning shaft has a center line of rotation which is arranged in the vicinity of a top end of a tool on a center line of the tool.

Abstract translation: 提供了一种具有可倾斜主轴单元的数控机床，可用作垂直和倾斜主轴型机床，不受行程限制，并且可以方便地进行工具测量，工件与工具的对准以及修整。 数控机床包括：主轴单元，其具有主轴，用作垂直主轴和倾斜主轴; 以及具有用于在垂直平面上可枢转地支撑主轴单元的转动轴的倾斜机构。 旋转轴具有中心线，其布置在工具的中心线上的工具的顶端附近。

公开(公告)号：US06769961B1

公开(公告)日：2004-08-03

申请号：US10345694

申请日：2003-01-15

Applicant: Rodney C. Kistler ,  Aleksander Owczarz

Inventor： Rodney C. Kistler ,  Aleksander Owczarz

IPC: B24B4900

CPC classification number: B24B37/013 ,  B24B37/26 ,  B24B57/02

Abstract: A chemical mechanical planarization (CMP) apparatus includes a bath of an aqueous solution. A first holder, which is configured to support a wafer, is disposed within the bath. A first spindle is configured to rotate the first holder. A second holder, which is rotated by a second spindle, is disposed above the first holder. The second holder supports a planarization media, which is disposed within the bath. The planarization media is oriented to face the surface of the first holder on which the wafer is to be supported. The planarization media can be a pad containing polyurethane or a substrate having an overlying abrasive film. The CMP apparatus also can include a system for recirculating and reconditioning the aqueous solution. A method for performing a CMP process also is described.

Abstract translation: 化学机械平面化（CMP）装置包括水溶液浴。 被配置为支撑晶片的第一保持器设置在浴槽内。 第一主轴构造成旋转第一保持器。 由第二主轴旋转的第二保持器设置在第一保持器的上方。 第二支架支撑设置在浴槽内的平坦化介质。 平面化介质被定向为面对要在其上支撑晶片的第一保持器的表面。 平坦化介质可以是含有聚氨酯的垫或具有上覆磨料膜的基材。 CMP设备还可以包括用于再循环和修复水溶液的系统。 还描述了用于执行CMP处理的方法。

公开(公告)号：US06769958B1

公开(公告)日：2004-08-03

申请号：US10225330

申请日：2002-08-21

Applicant: Howard W. Grivna

Inventor： Howard W. Grivna

IPC: B24B4900

CPC classification number: B24B7/28 ,  B24B7/06 ,  B24B19/24 ,  B24B21/04 ,  B24B27/0023 ,  B24B51/00

Abstract: A belt wear optimizing system for a wood surface treating apparatus with a plurality of individual work stations arranged serially along an endless conveyor. Each station includes a working abrasive head along with an elevation control for adjustably positioning the contact surface of each abrasive head at a desired working distance from the opposed surface of the workpiece traveling along the endless conveyor. An incoming workpiece thickness detector is positioned at the infeed end, and additional workpiece thickness detectors are positioned downstream from each work station, with each being positioned to measure the thickness of the workpiece after it has passed through its preceding individual work station. In addition to a workpiece thickness detector at the infeed end, a signal generated by the thickness detector is transmitted to a central processor whereupon the head elevation control is actuated responsively to controllably and adjustably position the working head to its desired working position based upon a predetermined stock removal program for each individual head in the sequence.

Abstract translation: 一种用于木材表面处理装置的带磨损优化系统，其具有沿着循环输送机串联布置的多个单独的工作站。 每个工位都包括一个加工的研磨头以及一个仰角控制装置，用于将磨削头的接触表面可调节地定位在与循环传送带行进的工件的相对表面所需的工作距离上。 进入的工件厚度检测器位于进料端，并且附加的工件厚度检测器位于每个工作站的下游，每个工件的位置用于在工件通过其前一个单独的工作站之后测量工件的厚度。 除了在进料端的工件厚度检测器之外，厚度检测器产生的信号被传送到中央处理器，由此基于预定的工作位置，响应于可控地和可调节地将工作头定位到其期望的工作位置， 序列中每个单独头部的库存清理程序。

公开(公告)号：US06769957B2

公开(公告)日：2004-08-03

申请号：US09896504

申请日：2001-06-29

Applicant: Jonathan D. Buttram

Inventor： Jonathan D. Buttram

IPC: B24B4900

CPC classification number: B24B49/10 ,  B21B28/02 ,  B24B5/167 ,  G01N29/043 ,  G01N29/28 ,  G01N2291/0421 ,  G01N2291/0422 ,  G01N2291/044 ,  G01N2291/2626 ,  Y10S451/91

Abstract: A method and apparatus for simultaneously inspecting and grinding roll mills which utilizes a transducer assembly which produces a creeping wave propagation in conjunction with a couplant fluid provider and data acquisition circuit which allows the operator to see the crack and imperfections in on the surface of the mill rolls as they are rotated and to grind them off.

Abstract translation: 一种用于同时检查和研磨辊磨机的方法和装置，其利用换能器组件，其与耦合剂流体提供器和数据采集电路一起产生蠕变波传播，其允许操作者看到磨机表面上的裂纹和缺陷 卷轴旋转并将其磨碎。

公开(公告)号：US06769956B1

公开(公告)日：2004-08-03

申请号：US10067188

申请日：2002-02-04

Applicant: Matthew R. Konieczny

Inventor： Matthew R. Konieczny

IPC: B24B4900

CPC classification number: B24C5/02

Abstract: A grit blasting nozzle and nozzle fixture assembly provides for both rapid installation of the nozzle within the fixture, and precise alignment of the nozzle when installed in the fixture. Corresponding flat surfaces and shoulders on the nozzle and nozzle fixture orient the nozzle within the fixture, and a spring-biased pin engages an angled surface in the nozzle housing to fully seat the nozzle within the fixture. A proximity sensor facilitates consistent setting of the proper distance between the nozzle and the workpiece.

Abstract translation: 喷砂喷嘴和喷嘴固定组件提供喷嘴在夹具内的快速安装，以及安装在固定装置中时喷嘴的精确对准。 喷嘴和喷嘴夹具上的相应的平坦表面和肩部将喷嘴定位在固定装置内，并且弹簧偏置销与喷嘴壳体中的成角度的表面接合，以将喷嘴完全安置在固定装置内。 接近传感器便于喷嘴和工件之间适当距离的一致设定。

公开(公告)号：US06755718B2

公开(公告)日：2004-06-29

申请号：US09782893

申请日：2001-02-13

Applicant: Scott E. Moore

Inventor： Scott E. Moore

IPC: B24B4900

CPC classification number: B24B53/017 ,  B24B49/006 ,  B24B49/16 ,  B24B53/12

Abstract: A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body having a conditioning surface that engages a planarizing surface of the planarizing medium and is movable relative to the planarizing medium. A force sensor is coupled to the conditioning body to detect a frictional force imparted to the conditioning body by the planarizing medium when the conditioning body and the planarizing medium are moved relative to each other. The apparatus can further include a feedback device that controls the motion, position, or force between the conditioning body and the planarizing medium to control the conditioning of the planarizing medium.

公开(公告)号：US06752692B2

公开(公告)日：2004-06-22

申请号：US09932987

申请日：2001-08-21

Applicant: Yutaka Wada ,  Hirokuni Hiyama ,  Norio Kimura

Inventor： Yutaka Wada ,  Hirokuni Hiyama ,  Norio Kimura

IPC: B24B4900

CPC classification number: B24B37/345 ,  B08B3/08 ,  B24B53/017 ,  H01L21/67051 ,  Y10S134/902

Abstract: A method is suitable for cleaning substrates, after polishing, that require a high degree of cleanliness, such as semiconductor wafers, glass substrates, or liquid crystal displays. The method includes polishing a substrate using an abrasive liquid containing abrasive particles, and cleaning a polished surface of the substrate by supplying a cleaning liquid having substantially the same pH as the abrasive liquid or similar pH to the abrasive liquid so that a pH of the abrasive liquid attached to the polished surface of the substrate is not rapidly changed.

Abstract translation: 一种方法适用于清洗需要高度清洁度的基板，如半导体晶片，玻璃基板或液晶显示器。 该方法包括使用含磨料颗粒的磨料液研磨衬底，以及通过向研磨液中提供与磨料液体或类似pH具有基本上相同pH值的清洗液体来清洗衬底的抛光表面，使磨料的pH值 附着于基板抛光面的液体不会迅速变化。