公开(公告)号：US20090078583A1

公开(公告)日：2009-03-26

申请号：US12007956

申请日：2008-01-17

申请人： Itsuki Kobata ,  Akira Kodera ,  Yasushi Toma ,  Tsukuru Suzuki ,  Takayuki Saito ,  Yuji Makita ,  Hirokuni Hiyama

发明人： Itsuki Kobata ,  Akira Kodera ,  Yasushi Toma ,  Tsukuru Suzuki ,  Takayuki Saito ,  Yuji Makita ,  Hirokuni Hiyama

IPC分类号： B23H5/06 ,  B23H11/00 ,  C25F3/16 ,  C25F7/00

CPC分类号： C25F3/00 ,  B23H5/08 ,  B24B37/013 ,  B24B49/105 ,  H01L21/32125

摘要： A composite electrolytic processing method makes it possible to remove a conductive film without leaving it in an electrically-insulated state on an underlying barrier film, thereby exposing the barrier film. The electrochemical mechanical polishing method includes: applying a voltage between a first electrode connected to one pole of a power source and a second electrode, connected to the other pole of the power source, for feeding electricity to a conductive film of a polishing object; filling an electrolytic liquid into a space between the first electrode and the conductive film of the polishing object; and pressing and rubbing the conductive film against a polishing surface of a polishing pad to polish the conductive film in such a manner that a barrier film underlying the conductive film becomes gradually exposed from the center toward the periphery of the polishing object.

摘要翻译： 复合电解处理方法使得可以在导电膜上去除导电膜而不会使其在下面的阻挡膜上处于电绝缘状态，从而暴露阻挡膜。 电化学机械抛光方法包括：在连接到电源的一个极的第一电极和连接到电源的另一个极的第二电极之间施加电压，用于向抛光对象的导电膜供电; 将电解液体填充到研磨对象物的第一电极和导电膜之间的空间内; 并且将导电膜按压并摩擦抛光垫的抛光表面以使导电膜抛光，使得导电膜下面的阻挡膜从研磨对象的中心逐渐露出。

公开(公告)号：US20070254558A1

公开(公告)日：2007-11-01

申请号：US11661141

申请日：2005-08-26

申请人： Masako Kodera ,  Yoshihiro Mochizuki ,  Akira Fukuda ,  Akira Kodera ,  Hirokuni Hiyama ,  Manabu Tsujimura ,  Kazuto Hirokawa ,  Akira Fukunaga

发明人： Masako Kodera ,  Yoshihiro Mochizuki ,  Akira Fukuda ,  Akira Kodera ,  Hirokuni Hiyama ,  Manabu Tsujimura ,  Kazuto Hirokawa ,  Akira Fukunaga

IPC分类号： B24B37/04 ,  H01L21/00

CPC分类号： H01L21/6708 ,  B24B37/005 ,  B24B37/042 ,  B24B37/046 ,  B24B49/006 ,  B24B57/02

摘要： A polishing apparatus (30) has a polishing surface (32), a top ring (36) for holding a wafer (W), motors (46, 56) to move the polishing surface (32) and the wafer (W) relative to each other at a relative speed, and a vertical movement mechanism (54) to press the wafer (W) against the polishing surface (32) under a pressing pressure. The polishing apparatus (30) also has a controller (44) to adjust a polishing condition in a non-Preston range in which a polishing rate is not proportional to a product of the pressing pressure and the relative speed. The polishing apparatus (30) can simultaneously achieve uniform supply of a chemical liquid to a surface of the wafer (W) and a uniform polishing rate within the surface of the wafer (W).

摘要翻译： 抛光装置（30）具有抛光面（32），用于保持晶片（W）的顶环（36），使抛光面（32）和晶片（W）相对于运动的电机（46,56）相对于 以及垂直移动机构（54），其在压制压力下将晶片（W）压靠在抛光表面（32）上。 抛光装置（30）还具有控制器（44），用于在抛光速率与按压压力与相对速度的乘积不成比例的非普雷斯顿范围内调节抛光状态。 抛光装置（30）可以同时实现向晶片（W）的表面均匀供应化学液体，并且在晶片表面（W）内均匀的研磨速率。

公开(公告)号：US20050155868A1

公开(公告)日：2005-07-21

申请号：US11035373

申请日：2005-01-14

申请人： Itsuki Kobata ,  Yutaka Wada ,  Hirokuni Hiyama ,  Takayuki Saito ,  Yasushi Toma ,  Tsukuru Suzuki ,  Akira Kodera

发明人： Itsuki Kobata ,  Yutaka Wada ,  Hirokuni Hiyama ,  Takayuki Saito ,  Yasushi Toma ,  Tsukuru Suzuki ,  Akira Kodera

IPC分类号： B23H5/08 ,  B24B37/04 ,  C25F1/00 ,  C25F3/00 ,  H01L21/321 ,  H01L21/768 ,  B23H3/00

CPC分类号： H01L21/32115 ,  B23H5/08 ,  B24B37/042 ,  B24B37/046 ,  C25F1/00 ,  C25F3/00 ,  H01L21/7684

摘要： An electrolytic processing apparatus can increase the efficiency of the dissociation reaction of water and efficiently perform electrolytic processing, and can eliminate the need for an operation for a change of ion exchanger. The electrolytic processing apparatus includes: a processing electrode and a feeding electrode; a liquid supply section for supplying a liquid containing an ion-exchange material between the workpiece and at least one of the processing electrode and the feeding electrode; a power source for applying a voltage between the processing electrode and the feeding electrode; and a drive section for moving the workpiece and at least one of the processing electrode and the feeding electrode relative to each other; wherein electrolytic processing of the workpiece is carried out while keeping the workpiece not in contact with and close to the processing electrode at a distance of not more than 10 μm.

摘要翻译： 电解处理装置可以提高水的解离反应的效率，并且有效地进行电解处理，并且可以消除对于改变离子交换剂的操作的需要。 电解处理装置包括：处理电极和馈电电极; 液体供应部分，用于在工件和处理电极和馈电电极中的至少一个之间提供含有离子交换材料的液体; 用于在处理电极和馈电电极之间施加电压的电源; 以及用于相对于彼此移动所述工件和所述处理电极和所述馈送电极中的至少一个的驱动部分; 其中进行工件的电解处理，同时保持工件不超过10um的距离与处理电极接触并靠近处理电极。

公开(公告)号：US06858838B2

公开(公告)日：2005-02-22

申请号：US10451635

申请日：2002-03-22

申请人： Katsunori Ichiki ,  Kazuo Yamauchi ,  Hirokuni Hiyama ,  Seiji Samukawa

发明人： Katsunori Ichiki ,  Kazuo Yamauchi ,  Hirokuni Hiyama ,  Seiji Samukawa

IPC分类号： H05H1/46 ,  B01J19/08 ,  C23C14/32 ,  C23C16/50 ,  H01J27/16 ,  H01J37/08 ,  H01J37/317 ,  H01J37/32 ,  H01L21/205 ,  H01L21/302 ,  H01L21/3065 ,  H05H3/02 ,  H01L21/306

CPC分类号： H01J37/321 ,  H01J37/3178 ,  H01J37/32357 ,  H05H3/02

摘要： A neutral particle beam processing apparatus comprises a plasma generator for generating positive ions and/or negative ions in a plasma, a pair of electrodes (5, 6) involving the plasma generated by the plasma generator therebetween, and a power supply (102) for applying a voltage between the pair of electrodes (5, 6). The pair of electrodes (5, 6) accelerate the positive ions and/or the negative ions generated by the plasma generator. The positive ions and/or the negative ions are neutralized and converted into neutral particles while being drifted in the plasma between the pair of electrodes (5, 6) toward a workpiece (X). The accelerated neutral particles pass through one of the electrodes (6) and are applied to the workpiece (X).

摘要翻译： 一种中性粒子束处理装置，包括：等离子体发生器，用于在等离子体中产生正离子和/或负离子;一对电极（5,6），其包括由等离子体发生器在其间产生的等离子体;以及电源（102），用于 在所述一对电极（5,6）之间施加电压。 一对电极（5,6）加速由等离子体发生器产生的正离子和/或负离子。 正离子和/或负离子被中和并转化成中性粒子，同时在一对电极（5,6）之间的等离子体中朝向工件（X）漂移。 加速的中性粒子通过电极（6）之一并施加到工件（X）上。

公开(公告)号：US06520845B2

公开(公告)日：2003-02-18

申请号：US09813323

申请日：2001-03-21

申请人： Kazuto Hirokawa ,  Hirokuni Hiyama ,  Yutaka Wada ,  Hisanori Matsuo

发明人： Kazuto Hirokawa ,  Hirokuni Hiyama ,  Yutaka Wada ,  Hisanori Matsuo

IPC分类号： B24B2900

CPC分类号： B24B37/30 ,  B24B7/228 ,  B24B37/105 ,  B24B41/068 ,  B24B49/16

摘要： A polishing apparatus comprises a polishing member that has a wide stable polishing range to perform effective polishing, even if a rotation axis moves away from the edge of a workpiece. A polishing member holder holds the polishing member, and a workpiece holder holds the workpiece to be polished. A drive device produces a relative sliding motion between the polishing member and the workpiece. At least one holder of either the polishing member holder or the workpiece holder is rotatable about a rotation axis and is tiltable with respect to other holder. Such one holder is provided with a pressing mechanism to stabilize orientation or desired posture of the one holder by applying an adjusting pressure to the one holder at a location away from the rotation axis.

摘要翻译： 抛光装置包括抛光构件，其具有宽的稳定的抛光范围以进行有效的抛光，即使旋转轴线远离工件的边缘移动。 抛光构件保持器保持抛光构件，并且工件保持器保持待抛光的工件。 驱动装置在抛光构件和工件之间产生相对滑动运动。 抛光构件保持器或工件保持器中的至少一个保持器可围绕旋转轴线旋转并且可相对于其他保持器倾斜。 这种一个保持器设置有按压机构，以通过在远离旋转轴线的位置向一个保持器施加调节压力来稳定一个保持器的取向或期望姿势。

公开(公告)号：US06220945B1

公开(公告)日：2001-04-24

申请号：US09296567

申请日：1999-04-22

申请人： Kazuto Hirokawa ,  Hirokuni Hiyama ,  Yutaka Wada ,  Hisanori Matsuo

发明人： Kazuto Hirokawa ,  Hirokuni Hiyama ,  Yutaka Wada ,  Hisanori Matsuo

IPC分类号： B24B2900

CPC分类号： B24B37/30 ,  B24B7/228 ,  B24B37/105 ,  B24B41/068 ,  B24B49/16

摘要： A polishing apparatus comprises a polishing member that has a wide stable polishing range to perform effective polishing, even if a rotation axis moves away from the edge of a workpiece. A polishing member holder holds the polishing member, and a workpiece holder holds the workpiece to be polished. A drive device produces a relative sliding motion between the polishing member and the workpiece. At least one holder of either the polishing member holder or the workpiece holder is rotatable about a rotation axis and is tiltable with respect to other holder. Such one holder is provided with a pressing mechanism to stabilize orientation or desired posture of the one holder by applying an adjusting pressure to the one holder at a location away from the rotation axis.

公开(公告)号：US4885491A

公开(公告)日：1989-12-05

申请号：US206464

申请日：1988-06-14

申请人： Hirokuni Hiyama ,  Katsuhide Watanabe ,  Atsushi Nakajima ,  Chikara Murakami

发明人： Hirokuni Hiyama ,  Katsuhide Watanabe ,  Atsushi Nakajima ,  Chikara Murakami

IPC分类号： F16C32/04 ,  F16C39/06 ,  H02K7/09

CPC分类号： F16C32/0451 ,  F16C32/0487

摘要： An active type magnetic bearing system includes magnetic bearings for suspending a rotary body to permit it to rotate about its rotational axis. A control system supplies the magnetic bearings with signals to control the radial position of the rotary body, and comprises displacement detecting circuits for detecting any displacement of the radial position of the rotary body and a control circuit for producing a control signal which serves to suppress any unstable vibration of the rotary body.

公开(公告)号：US4489951A

公开(公告)日：1984-12-25

申请号：US523944

申请日：1983-08-17

申请人： Tadashi Kataoka ,  Hirokuni Hiyama

发明人： Tadashi Kataoka ,  Hirokuni Hiyama

IPC分类号： F16J15/34 ,  F16J15/36

CPC分类号： F16J15/3468

摘要： A mechanical seal is disclosed wherein an intermediate floating ring is employed between a seat sleeve and a rotary ring. Each of the rotary ring, intermediate floating ring and the seat sleeve are pressed against each other so as to be relatively rotatable at their respective abutting interfaces, each of the rotary ring, intermediate ring and the seat sleeve being separated from each other with proper clearances between the opposing surfaces thereof at places which are outward of the sliding interfaces and each of the opposing surfaces is provided with an annular groove and a cascade of blades therein so that a fluid coupling is formed between the adjacent opposing surfaces.

摘要翻译： 公开了一种机械密封件，其中在座椅套筒和旋转环之间采用中间浮动环。 旋转环，中间浮动环和座套中的每一个彼此压靠，以便在它们各自的邻接界面处相对旋转，旋转环，中间环和座套中的每一个彼此分离，具有适当的间隙 在其相对表面之间的位于滑动界面外侧的位置和每个相对表面之间设置有环形槽和叶片级联，使得在相邻的相对表面之间形成流体联接。

公开(公告)号：US20100081361A1

公开(公告)日：2010-04-01

申请号：US12566224

申请日：2009-09-24

申请人： Akira Fukuda ,  Yoshihiro Mochizuki ,  Yutaka Wada ,  Yoichi Shiokawa ,  Hirokuni Hiyama

发明人： Akira Fukuda ,  Yoshihiro Mochizuki ,  Yutaka Wada ,  Yoichi Shiokawa ,  Hirokuni Hiyama

IPC分类号： B24B53/02 ,  B24B1/00 ,  B24B53/12

CPC分类号： B24B53/017

摘要： A method of dressing a polishing member with a diamond dresser having diamond particles arranged on a surface thereof is provided. The method includes determining dressing conditions by performing a simulation of a distribution of a sliding distance of the diamond dresser on a surface of the polishing member, and dressing the polishing member with the diamond dresser under the dressing conditions determined. The simulation includes calculation of the sliding distance corrected in accordance with a depth of the diamond particles thrusting into the polishing member.

摘要翻译： 提供了一种用金刚石修整器修整抛光构件的方法，其具有布置在其表面上的金刚石颗粒。 该方法包括通过对抛光构件的表面上的金刚石修整器的滑动距离的分布进行模拟来确定修整条件，以及在确定的修整条件下用金刚石修整器修整抛光构件。 模拟包括根据推入抛光构件的金刚石颗粒的深度校正的滑动距离的计算。

公开(公告)号：US06849857B2

公开(公告)日：2005-02-01

申请号：US10471610

申请日：2002-03-22

申请人： Katsunori Ichiki ,  Kazuo Yamauchi ,  Hirokuni Hiyama ,  Seiji Samukawa

发明人： Katsunori Ichiki ,  Kazuo Yamauchi ,  Hirokuni Hiyama ,  Seiji Samukawa

IPC分类号： H05H1/46 ,  B01J19/08 ,  C23C14/32 ,  H01J37/08 ,  H01J37/30 ,  H01J37/32 ,  H01L21/205 ,  H01L21/302 ,  H01L21/3065 ,  H01J37/00

CPC分类号： H01J37/32137 ,  H01J37/08 ,  H01J37/30 ,  H01J37/32357 ,  H01J2237/0827

摘要： A beam processing apparatus comprises a workpiece holder (20) for holding a workpiece (X), a plasma generator for generating a plasma in a vacuum chamber (3), first electrode (4) disposed in the vacuum chamber (3), and a second electrode (5) disposed upstream of the first electrode (4) in the vacuum chamber (3). The beam processing apparatus further comprises a voltage applying unit for applying a variable voltage between the first electrode (4) and the second electrode (5) to alternately extract positive ions (6) and negative ions from the plasma generated by the plasma generator.

摘要翻译： 光束处理装置包括用于保持工件（X）的工件保持器（20），用于在真空室（3）中产生等离子体的等离子体发生器，设置在真空室（3）中的第一电极（4） 第二电极（5），设置在真空室（3）中的第一电极（4）的上游。 光束处理装置还包括用于在第一电极（4）和第二电极（5）之间施加可变电压以从等离子体发生器产生的等离子体中交替地提取正离子（6）和负离子的电压施加单元。