公开(公告)号：US08535451B2

公开(公告)日：2013-09-17

申请号：US12240300

申请日：2008-09-29

申请人： John M. de Larios ,  Mike Ravkin ,  Jeffrey Farber ,  Mikhail Korolik ,  Fritz Redeker ,  Aleksander Owczarz

发明人： John M. de Larios ,  Mike Ravkin ,  Jeffrey Farber ,  Mikhail Korolik ,  Fritz Redeker ,  Aleksander Owczarz

IPC分类号： B08B1/04

CPC分类号： B08B3/003 ,  H01L21/67028 ,  H01L21/67046 ,  Y10S134/902

摘要： An apparatus and method are disclosed in which a semiconductor substrate having a surface containing contaminants is cleaned or otherwise subjected to chemical treatment using a foam. The semiconductor wafer is supported either on a stiff support (or a layer of foam) and foam is provided on the opposite surface of the semiconductor wafer while the semiconductor wafer is supported. The foam contacting the semiconductor wafer is pressurized using a form to produce a jammed foam. Relative movement between the form and the semiconductor wafer. such as oscillation parallel and/or perpendicular to the top surface of the semiconductor wafer. is then induced while the jammed foam is in contact with the semiconductor wafer to remove the undesired contaminants and/or otherwise chemically treat the surface of the semiconductor wafer using the foam.

摘要翻译： 公开了一种装置和方法，其中具有含有污染物的表面的半导体衬底被清洁或以其它方式用泡沫进行化学处理。 半导体晶片被支撑在刚性支撑件（或泡沫层）上，并且在半导体晶片被支撑的同时在半导体晶片的相对表面上提供泡沫。 接触半导体晶片的泡沫使用形式加压以产生卡住的泡沫。 形式与半导体晶圆之间的相对移动。 例如平行于和/或垂直于半导体晶片的顶表面的振荡。 然后在卡住的泡沫与半导体晶片接触的同时引发，以除去不期望的污染物和/或以其它方式化学处理使用泡沫的半导体晶片的表面。

公开(公告)号：US08069813B2

公开(公告)日：2011-12-06

申请号：US11735984

申请日：2007-04-16

申请人： William Thie ,  John M. Boyd ,  Fritz C. Redeker ,  Yezdi Dordi ,  John Parks ,  Tiruchirapalli Arunagiri ,  Aleksander Owczarz ,  Todd Balisky ,  Clint Thomas ,  Jacob Wylie ,  Alan M. Schoepp

发明人： William Thie ,  John M. Boyd ,  Fritz C. Redeker ,  Yezdi Dordi ,  John Parks ,  Tiruchirapalli Arunagiri ,  Aleksander Owczarz ,  Todd Balisky ,  Clint Thomas ,  Jacob Wylie ,  Alan M. Schoepp

IPC分类号： B05C3/00

CPC分类号： H01L21/288 ,  C23C18/1619 ,  C23C18/1632 ,  H01L21/76873

摘要： A dry-in/dry-out system is disclosed for wafer electroless plating. The system includes an upper zone for wafer ingress/egress and drying operations. Proximity heads are provided in the upper zone to perform the drying operations. The system also includes a lower zone for electroless plating operations. The lower zone includes an electroless plating apparatus that implements a wafer submersion by fluid upwelling method. The upper and lower zones of the system are enclosed by a dual-walled chamber, wherein the inner wall is a chemically inert plastic and the outer wall is a structural metal. The system interfaces with a fluid handling system which provides the necessary chemistry supply and control for the system. The system is ambient controlled. Also, the system interfaces with an ambient controlled managed transfer module (MTM).

摘要翻译： 公开了一种用于晶片无电镀的干/干输出系统。 该系统包括用于晶片入口/出口和干燥操作的上部区域。 靠近头部设置在上部区域以执行干燥操作。 该系统还包括用于无电镀操作的下部区域。 下部区域包括通过流体上升流法实现晶片浸没的化学镀设备。 系统的上部和下部区域由双壁室围住，其中内壁是化学惰性塑料，外壁是结构金属。 系统与流体处理系统接口，为系统提供必要的化学物质供应和控制。 系统是环境控制的。 此外，系统与环境受控的托管传输模块（MTM）接口。

公开(公告)号：US06937915B1

公开(公告)日：2005-08-30

申请号：US10113151

申请日：2002-03-28

申请人： Rodney Kistler ,  David J. Hemker ,  Yehiel Gotkis ,  Aleksander Owczarz ,  Bruno Morel ,  Damon V. Williams

发明人： Rodney Kistler ,  David J. Hemker ,  Yehiel Gotkis ,  Aleksander Owczarz ,  Bruno Morel ,  Damon V. Williams

IPC分类号： B24B37/005 ,  B24B49/02 ,  B24B49/10 ,  B24B49/14 ,  H01L21/304 ,  H01L21/66 ,  G06F19/00

CPC分类号： B24B37/005 ,  B24B49/10 ,  B24B49/14

摘要： In chemical mechanical polishing apparatus, a wafer carrier plate is provided with a cavity for reception of a sensor positioned very close to a wafer to be polished. Energy resulting from contact between a polishing pad and an exposed surface of the wafer is transmitted only a very short distance to the sensor and is sensed by the sensor, providing data as to the nature of properties of the exposed surface of the wafer, and of transitions of those properties. Correlation methods provide graphs relating sensed energy to the surface properties, and to the transitions. The correlation graphs provide process status data for process control.

摘要翻译： 在化学机械抛光装置中，晶片承载板设置有用于接收位于非常接近待抛光晶片的传感器的空腔。 由抛光垫与晶片的暴露表面之间的接触所产生的能量仅传播到传感器非常短的距离，并由传感器感测，提供关于晶片的暴露表面的性质的数据以及 这些属性的转换。 相关方法提供了将感测能量与表面性质和转变相关联的图。 相关图提供过程控制的过程状态数据。

公开(公告)号：US06929531B2

公开(公告)日：2005-08-16

申请号：US10251033

申请日：2002-09-19

申请人： Yehiel Gotkis ,  Aleksander Owczarz ,  David Hemker ,  Nicolas Bright ,  Rodney Kistler

发明人： Yehiel Gotkis ,  Aleksander Owczarz ,  David Hemker ,  Nicolas Bright ,  Rodney Kistler

IPC分类号： B24B37/04 ,  B24B49/02 ,  B24B49/10 ,  H01L21/321 ,  H01L21/66 ,  B24B49/00

CPC分类号： B24B37/042 ,  B24B49/02 ,  B24B49/10 ,  H01L21/3212 ,  H01L22/00

摘要： A system and method of measuring a metallic layer on a substrate within a multi-step substrate process includes modifying a metallic layer on the substrate such as forming a metallic layer or removing at least a portion of the metallic layer. At least one sensor is positioned a predetermined distance from the surface of the substrate. The surface of the substrate is mapped to determine a uniformity of the metallic layer on the surface of the substrate.

摘要翻译： 在多步衬底工艺中测量衬底上的金属层的系统和方法包括改变衬底上的金属层，例如形成金属层或去除金属层的至少一部分。 至少一个传感器定位在离基板表面预定距离处。 映射衬底的表面以确定衬底表面上的金属层的均匀性。

公开(公告)号：US20050133060A1

公开(公告)日：2005-06-23

申请号：US10746114

申请日：2003-12-23

申请人： John Larios ,  Mike Ravkin ,  Jeffrey Farber ,  Mikhail Korolik ,  Fritz Redeker ,  Aleksander Owczarz

发明人： John Larios ,  Mike Ravkin ,  Jeffrey Farber ,  Mikhail Korolik ,  Fritz Redeker ,  Aleksander Owczarz

IPC分类号： B08B3/00 ,  H01L21/00 ,  B08B3/04

CPC分类号： B08B3/003 ,  H01L21/67028 ,  H01L21/67046 ,  Y10S134/902

摘要： An apparatus and method are disclosed in which a semiconductor substrate having a surface containing contaminants is cleaned or otherwise subjected to chemical treatment using a foam. The semiconductor wafer is supported either on a stiff support (or a layer of foam) and foam is provided on the opposite surface of the semiconductor wafer while the semiconductor wafer is supported. The foam contacting the semiconductor wafer is pressurized using a form to produce a jammed foam. Relative movement between the form and the semiconductor wafer, such as oscillation parallel and/or perpendicular to the top surface of the semiconductor wafer, is then induced while the jammed foam is in contact with the semiconductor wafer to remove the undesired contaminants and/or otherwise chemically treat the surface of the semiconductor wafer using the foam.

摘要翻译： 公开了一种装置和方法，其中具有含有污染物的表面的半导体衬底被清洁或以其它方式用泡沫进行化学处理。 半导体晶片被支撑在刚性支撑件（或泡沫层）上，并且在半导体晶片被支撑的同时在半导体晶片的相对表面上提供泡沫。 接触半导体晶片的泡沫使用形式加压以产生卡住的泡沫。 然后，在卡住的泡沫与半导体晶片接触的同时，形成半导体晶片之间的相对运动（例如平行于和/或垂直于半导体晶片的顶表面的振荡），以除去不需要的污染物和/或以其他方式 使用泡沫化学处理半导体晶片的表面。

公开(公告)号：US20050000653A1

公开(公告)日：2005-01-06

申请号：US10881094

申请日：2004-06-29

申请人： Yehiel Gotkis ,  Rodney Kistler ,  Aleksander Owczarz ,  David Hemker ,  Nicolas Bright

发明人： Yehiel Gotkis ,  Rodney Kistler ,  Aleksander Owczarz ,  David Hemker ,  Nicolas Bright

IPC分类号： C23F1/00 ,  G01B7/06 ,  G01R27/00 ,  H01L21/302

CPC分类号： G01B7/105 ,  G01B7/107 ,  G01B2210/44

摘要： A system for processing a wafer is provided. The system includes a chemical mechanical planarization (CMP) tool. The CMP tool includes a wafer carrier defined within a housing. A carrier film is affixed to the bottom surface and supports a wafer. A sensor embedded in the wafer carrier. The sensor is configured to induce an eddy current in the wafer to determine a proximity and a thickness of the wafer. A sensor array external to the CMP tool is included. The sensor array is in communication with the sensor embedded in the wafer carrier and substantially eliminates a distance sensitivity. The sensor array provides an initial thickness of the wafer to allow for a calibration to be performed on the sensor embedded in the wafer carrier. The calibration offsets variables causing inaccuracies in the determination of the thickness of the wafer during CMP operation. A method and an apparatus are also provided.

公开(公告)号：US06716299B1

公开(公告)日：2004-04-06

申请号：US10186944

申请日：2002-06-28

申请人： Yehiel Gotkis ,  Aleksander Owczarz ,  Jeffrey Yung

发明人： Yehiel Gotkis ,  Aleksander Owczarz ,  Jeffrey Yung

IPC分类号： B24B500

CPC分类号： B24B37/32 ,  B24B21/04

摘要： An invention is provided for a retaining ring for use in a chemical mechanical planarization system. The retaining ring includes an annular retaining ring capable of holding a flatted wafer in position during a CMP operation. The flatted wafer has a first corner and a second corner disposed on a flatted edge of the wafer. Also included is a plurality of profiled teeth disposed along an interior surface of the annular retaining ring. The profiled teeth are separated from each other such that the first comer and the second corner of the wafer do not contact profiled teeth simultaneously at all orientations of the wafer in the retaining ring. In addition, a surface of each tooth that contacts the wafer is inclined so as to form an angle greater than 90° relative to a polishing surface and away from the center of the wafer.

摘要翻译： 本发明提供一种用于化学机械平面化系统的保持环。 保持环包括能够在CMP操作期间将平坦的晶片保持在适当位置的环形保持环。 平坦晶片具有设置在晶片的平坦边缘上的第一角和第二角。 还包括沿着环形保持环的内表面设置的多个成型齿。 成型齿彼此分离，使得晶片的第一角和第二角不会在保持环中的晶片的所有取向同时接触成型齿。 此外，接触晶片的每个齿的表面倾斜，以便相对于抛光表面形成大于90°的角度并远离晶片的中心。

公开(公告)号：US06408863B1

公开(公告)日：2002-06-25

申请号：US09610175

申请日：2000-07-05

申请人： Aleksander Owczarz

发明人： Aleksander Owczarz

IPC分类号： B08B1300

CPC分类号： H01L21/67051 ,  B08B3/02 ,  B08B11/02 ,  F16F1/38 ,  F16F15/02 ,  F16F15/08 ,  H01L21/67 ,  H02K5/124 ,  H02K5/24 ,  Y10S134/902

摘要： An apparatus for processing a semiconductor wafer is set forth. The apparatus comprises a processing bowl that defines a processing chamber. The processing bowl is in fixed alignment with a frame. A wafer support structure adapted to support at least one wafer is mounted for rotation within the processing chamber. A motor drive assembly is disposed exterior to the processing chamber and connected to rotate the wafer support. The motor drive assembly includes an electrically driven motor and at least one shock absorbing member connected between the electrically driven motor and the frame. The electrically driven motor preferably includes a rotor shaft that rotates about an axis of rotation. The shock absorbing member is adapted to elastically deform in substantially all directions perpendicular to the axis of rotation of the rotor shaft in response to vibrational forces having components perpendicular to the axis of rotation and, to a lesser degree, in directions parallel to the axis of rotation of the rotating shaft in response to vibrational forces having components parallel to the axis of rotation. In accordance with a further, independently unique aspect of the present invention, an aggressive seal is provided to prevent materials, such as processing fluids, from entering the motor in the region of the motor rotor. To this end, expulsion threads are provided at an end of the rotor shaft of the motor. A member substantially surrounds the expulsion threads at the end of the rotor. Together, the member defines a chamber with the rotor. Rotation of the rotor and threads assist in preventing foreign materials from entering the motor.

摘要翻译： 阐述了一种用于处理半导体晶片的设备。 该装置包括限定处理室的处理碗。 处理碗与框架固定对准。 适于支撑至少一个晶片的晶片支撑结构被安装用于在处理室内旋转。 电动机驱动组件设置在处理室的外部并被连接以旋转晶片支撑件。 马达驱动组件包括电驱动马达和连接在电驱动马达和框架之间的至少一个减震构件。 电动马达优选地包括围绕旋转轴线旋转的转子轴。 冲击吸收构件适于响应于具有垂直于旋转轴线的分量的振动力而在与转子轴的旋转轴线垂直的基本上所有方向上弹性变形，并且在较小程度上在平行于转子轴 响应于具有与旋转轴线平行的分量的振动力，旋转轴的旋转。 根据本发明的另外独立独特的方面，提供侵蚀性密封件以防止诸如加工流体的材料在马达转子的区域内进入马达。 为此，排出螺纹设置在电动机的转子轴的端部。 构件基本上围绕转子末端处的排出螺纹。 该构件一起定义具有转子的腔室。 转子和螺纹的旋转有助于防止异物进入电机。

公开(公告)号：US5445172A

公开(公告)日：1995-08-29

申请号：US27863

申请日：1993-03-08

申请人： Raymon F. Thompson ,  Aleksander Owczarz

发明人： Raymon F. Thompson ,  Aleksander Owczarz

IPC分类号： G11B7/26 ,  H01L21/00 ,  H01L21/687 ,  B08D3/02

CPC分类号： H01L21/68728 ,  H01L21/6708 ,  H01L21/67086 ,  H01L21/68707 ,  H01L21/68785 ,  G11B7/26 ,  Y10S134/902

摘要： A single wafer processing apparatus includes a portable processing head that can be a portable module or a movable unit mounted to a supporting machine frame. The processing head has movable fingers adapted to grip a wafer. The fingers protrude from a protective wafer plate. Indexing and rotation monitoring assemblies are provided for automation of the wafer processing steps. A complementary processing base includes an upwardly-open bowl that receives a wafer held by the portable processing head. It has a full-diameter movable bottom wall for rapid draining purposes. Liquid and/or gas jets and nozzles supply fluids required within the bowl for processing of wafers.

摘要翻译： 单个晶片处理装置包括便携式处理头，其可以是安装到支撑机架的便携式模块或可移动单元。 处理头具有适于夹紧晶片的活动指状物。 指状物从保护性晶片板突出。 提供分度和旋转监测组件用于晶片处理步骤的自动化。 补充处理基座包括接收由便携式处理头保持的晶片的向上开口的碗。 它具有用于快速排水的全直径可移动底壁。 液体和/或气体喷嘴和喷嘴提供碗内所需的流体用于处理晶片。

公开(公告)号：US5232328A

公开(公告)日：1993-08-03

申请号：US665766

申请日：1991-03-05

申请人： Aleksander Owczarz ,  Raymon F. Thompson

发明人： Aleksander Owczarz ,  Raymon F. Thompson

IPC分类号： H01L21/00

CPC分类号： H01L21/67028 ,  Y10S414/14

摘要： A processor for centrifugal processing of semiconductor wafers and similar units. The processor is specially constructed to provide an automatically extendible and retractable rotor head to allow automated loading and unloading of wafers. The processor includes a novel shaft assembly construction which includes an axially extendible shaft controlled using pressurized fluid. The pressurized fluid is supplied to the shaft assembly by a pressure supply which is controllably extendable and retractable for engagement with the shaft assembly when rotation is stopped. The shaft assembly also preferably incorporates an axial locking mechanism which holds the axially movable components of the shaft assembly in fixed axial position during rotation, while allowing release when rotation is stopped so that movable portions of the shaft assembly can be axially extended.

摘要翻译： 用于半导体晶片和类似单元的离心处理的处理器。 处理器是特别构造的，以提供可自动伸缩的转子头，以允许自动装载和卸载晶片。 该处理器包括新颖的轴组件结构，其包括使用加压流体控制的可轴向延伸的轴。 加压流体通过压力供应器供应到轴组件，该压力供应器可旋转地延伸和缩回以用于与轴组件接合。 轴组件还优选地包括轴向锁定机构，其将轴组件的可轴向移动的部件在旋转期间保持在固定的轴向位置，同时当旋转停止时允许释放，使得轴组件的可动部分可以轴向延伸。