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    Ultrafine-grain-copper-base sputter targets
    3.
    发明授权
    Ultrafine-grain-copper-base sputter targets 有权
    超细晶粒铜基溅射靶

    公开(公告)号：US08025749B2

    公开(公告)日：2011-09-27

    申请号：US11019713

    申请日：2004-12-23

    申请人： Andrew C. Perry ,  Paul S. Gilman

    发明人： Andrew C. Perry ,  Paul S. Gilman

    IPC分类号： C21D6/04

    CPC分类号： C23C14/3414 ,  C22F1/08

    摘要： The sputter target has a composition selected from the group consisting of high-purity copper and copper-base alloys. The sputter target's grain structure is at least about 99 percent recrystallized; and the sputter target's face has a grain orientation ratio of at least about 10 percent each of (111), (200), (220) and (311). In addition, the sputter target has a grain size of less than about 10 μm for improving sputter uniformity and reducing sputter target arcing.

    摘要翻译： 溅射靶具有选自高纯度铜和铜基合金的组成。 溅射靶的晶粒结构至少约99％重结晶; 并且溅射靶的面具有（111），（200），（220）和（311）的至少约10％的晶粒取向比。 此外，溅射靶具有小于约10μm的晶粒尺寸以改善溅射均匀性并减少溅射靶电弧。

    High-purity aluminum sputter targets and method of manufacture
    5.
    发明授权
    High-purity aluminum sputter targets and method of manufacture 有权
    高纯度铝溅射靶及其制造方法

    公开(公告)号：US07320736B2

    公开(公告)日：2008-01-22

    申请号：US10967133

    申请日：2004-10-19

    申请人： Andrew C. Perry ,  Paul S. Gilman ,  Thomas J. Hunt

    发明人： Andrew C. Perry ,  Paul S. Gilman ,  Thomas J. Hunt

    IPC分类号： C22F1/04

    CPC分类号： C23C14/3414 ,  C22F1/04

    摘要： The high-purity aluminum sputter target is at least 99.999 weight percent aluminum and has a grain structure. The grain structure is at least 99 percent recrystallized and has a grain size of less than 200 μm. The method forms high-purity aluminum sputter targets by first cooling a high-purity target blank to a temperature of less than −50 ° C. and then deforming the cooled high-purity target blank introduces intense strain into the high-purity target. After deforming, recrystallizing the grains at a temperature below 200 ° C. forms a target blank having at least 99 percent recrystallized grains. Finally, finishing at a low temperature sufficient to maintain the fine grain size of the high-purity target blank forms a finished sputter target.

    摘要翻译： 高纯度铝溅射靶至少为99.999重量％的铝，具有晶粒结构。 晶粒结构至少99％重结晶，粒径小于200μm。 该方法通过首先将高纯度目标坯料冷却至低于-50℃的温度，然后使冷却的高纯度靶材坯料变形，将高应变压制成高纯度靶材，形成高纯度铝溅射靶。 变形后，在低于200℃的温度下使晶粒再结晶，形成具有至少99％再结晶晶粒的靶坯。 最后，在足以维持高纯度靶材坯料的细晶粒尺寸的低温下进行精加工，形成成品溅射靶。

    Determination of actual defect size in cathode sputter targets subjected to ultrasonic inspection
    6.
    发明授权
    Determination of actual defect size in cathode sputter targets subjected to ultrasonic inspection 失效
    确定经超声波检测的阴极溅射靶的实际缺陷尺寸

    公开(公告)号：US06269699B1

    公开(公告)日：2001-08-07

    申请号：US09431745

    申请日：1999-11-01

    申请人： Paul S. Gilman ,  Alfred Snowman ,  Andre Desert

    发明人： Paul S. Gilman ,  Alfred Snowman ,  Andre Desert

    IPC分类号： G01N2910

    CPC分类号： G01N29/11 ,  G01N29/30 ,  G01N2291/0289 ,  G01N2291/044

    摘要： A method for determining actual size of internal target defects by ultrasonic inspection is provided in which the amplitude of signals generated by ultrasonic inspection are compared to metallurgical size measurements obtained through the use of optical microscopes or scanning electron microscopes or scanning election microscopes. From this comparison, a correlation factor may be obtained to determine the accuracy of the ultrasonic measurements. For a particular sputter target material, defect sizes obtained by ultrasonic inspection may then be multiplied by the correlation factor to determine the actual defect size for that defect. The use of actual defect sizes to determine defect sizes from ultrasonic inspection provides a more accurate determination of defect sizes than prior methods and provides a reliable means for accepting or rejecting targets for critical circuit manufacturing operations.

    摘要翻译： 提供了一种通过超声波检查来确定内部目标缺陷的实际尺寸的方法，其中将通过超声检查产生的信号的幅度与通过使用光学显微镜或扫描电子显微镜或扫描电子显微镜获得的冶金尺寸测量进行比较。 从该比较中，可以获得相关因子以确定超声波测量的精度。 对于特定的溅射靶材料，可以通过超声波检查获得的缺陷尺寸乘以相关因子，以确定该缺陷的实际缺陷尺寸。 使用实际的缺陷尺寸来确定超声波检测中的缺陷尺寸比现有方法更准确地确定缺陷尺寸，并提供接受或拒绝关键电路制造操作的目标的可靠手段。

    Thermomechanical processing of rapidly solidified high temperature al-base alloys
    10.
    发明授权
    Thermomechanical processing of rapidly solidified high temperature al-base alloys 失效
    快速凝固的高温铝基合金的热机械加工

    公开(公告)号：US4869751A

    公开(公告)日：1989-09-26

    申请号：US181798

    申请日：1988-04-15

    申请人： Michael S. Zedalis ,  Paul S. Gilman ,  Derek Raybould

    发明人： Michael S. Zedalis ,  Paul S. Gilman ,  Derek Raybould

    IPC分类号： B22F3/24 ,  C22C1/04 ,  C22C1/05 ,  C22F1/04 ,  C22F1/043

    CPC分类号： C22F1/043 ,  C22C1/0416 ,  C22F1/04

    摘要： A dispersion strengthened, non-heat treatable aluminum base alloy is formed into useful shapes by compacting under vacuum a powder composed of particles produced by rapid solidification of the alloy to obtain a compacted billet; forming said billet into rolling stock at a temperature ranging from incipient forming temperature to about 500.degree. C.; and rolling the stock to reduce the thickness thereof by subjecting the stock to at least one rolling pass, the stock having a percent thickness per pass ranging up to about 25 percent and a stock temperature ranging from about 230.degree. C. to about 500.degree. C.

    摘要翻译： 分散强化，不可热处理的铝基合金通过在真空下压实由通过合金快速凝固而产生的颗粒组成的粉末形成有用的形状，以获得压实的坯料; 在初始成型温度至约500℃的温度下将所述坯料形成为轧制坯料; 并且通过使坯料经受至少一次轧制过程来轧制坯料以减小其厚度，所述坯料的每个通过的厚度百分比高达约25％，并且坯料温度范围为约230℃至约500℃ 。