公开(公告)号：US20080271911A1

公开(公告)日：2008-11-06

申请号：US10567151

申请日：2004-08-04

申请人： Naoaki Ogure ,  Manabu Tsujimura

发明人： Naoaki Ogure ,  Manabu Tsujimura

IPC分类号： H01R11/00 ,  H05K1/00

CPC分类号： C02F1/46109 ,  C02F1/46114 ,  C02F2001/46138 ,  C02F2001/46152 ,  C02F2101/308 ,  C02F2103/34 ,  Y10T29/49117

摘要： [Problems] To provide an electrode that is stable in liquid and is capable of processing a large volume of liquid and a small electrode that is capable of processing a large volume of liquid at high speed; provide a liquid processor and method of processing liquid in which the electrode is used; provide and electrode material being hard to be damaged by thermal stress; and provide an electrode, liquid processor and method of processing liquid in which the electrode material is used.[Means for solving problems] An electrode of configuration resulting from coating solid pieces of 5 to 60 mm size with electrically conductive diamond, supporting them on supports and bringing the same into contact with each other so as to realize current passage as a whole is used in various electrochemical process. Also, an electrode including (1) electrically conductive substrate, (2) covering layer covering the electrically conductive substrate and (3) electrically conductive diamond particles fixed on the covering layer, wherein each of the electrically conductive diamond particles is partially brought into contact with the electrically conductive substrate and another portion thereof is partially exposed on the surface of the covering layer. Further, an electrode material, wherein an entire side surface of columnar or tubular substrate is coated with electrically conductive diamond is used.

摘要翻译： [问题]提供一种在液体中稳定并能够加工大量液体的电极和能够高速加工大量液体的小电极; 提供液体处理器和处理使用电极的液体的方法; 提供并且难以被热应力损坏的电极材料; 并提供电极，液体处理器和处理使用电极材料的液体的方法。 [解决问题的方法]使用导电金刚石涂覆5〜60mm尺寸的实心片，将其支撑在支撑体上并使其彼此接触以实现整体的电流通过的结构电极被使用 在各种电化学过程中。 此外，包括（1）导电基板，（2）覆盖导电基板的覆盖层的电极和（3）固定在覆盖层上的导电金刚石颗粒，其中每个导电金刚石颗粒部分地与 导电性基板和其另一部分部分露出在覆盖层的表面上。 此外，使用其中柱状或管状基板的整个侧表面涂覆有导电金刚石的电极材料。

公开(公告)号：US06391775B1

公开(公告)日：2002-05-21

申请号：US09660411

申请日：2000-09-12

申请人： Naoaki Ogure ,  Hiroaki Inoue

发明人： Naoaki Ogure ,  Hiroaki Inoue

IPC分类号： H01L2144

CPC分类号： H01L21/7684 ,  H01L21/288 ,  H01L21/76888 ,  H01L23/53233 ,  H01L2924/0002 ,  H01L2924/00

摘要： Embedded interconnections of copper are formed by forming an insulating layer, forming embedded interconnections of copper in the insulating layer, making an exposed upper surface of the insulating layer and an exposed surface of the embedded interconnections of copper coplanar according to chemical mechanical polishing, and forming a protective silver film on the exposed surface of the embedded interconnections of copper. These steps are repeated on the existing insulating layer thereby to produce multiple layers of embedded interconnections of copper. The exposed surface of the embedded interconnections of copper is plated with silver according to immersion plating.

摘要翻译： 铜的嵌入式互连通过形成绝缘层而形成，在绝缘层中形成铜的嵌入互连，根据化学机械抛光使绝缘层的暴露的上表面和铜共面的嵌入式互连的暴露表面，以及形成 在铜的嵌入式互连的暴露表面上的保护性银膜。 在现有的绝缘层上重复这些步骤，从而产生多层铜的嵌入互连。 根据浸镀法，铜的嵌入互连的暴露表面镀银。

公开(公告)号：US5820649A

公开(公告)日：1998-10-13

申请号：US843185

申请日：1997-04-14

申请人： Naoaki Ogure ,  Kazuyoshi Terashima

发明人： Naoaki Ogure ,  Kazuyoshi Terashima

IPC分类号： C30B29/06 ,  C30B15/00 ,  C30B15/02 ,  C30B15/20 ,  H01L31/04 ,  C03B20/00

CPC分类号： C30B29/06 ,  C30B15/002 ,  C30B15/02 ,  Y10T117/1044 ,  Y10T117/1052 ,  Y10T117/1056

摘要： A liquid material such as molten silicon is stored in a crucible. A liquid material, which is identical to and held in the same conditions as the liquid material in the crucible, is continuously supplied from an auxiliary crucible to the crucible to keep constant the surface level of the liquid material in the crucible. The liquid material is continuously pulled up from the crucible at a predetermined speed while the liquid material is being solidified into a solid material such as a ribbon-like thin web of single-crystal silicon.

摘要翻译： 将诸如熔融硅的液体材料储存在坩埚中。 将与坩埚中的液体材料相同并保持在相同条件下的液体材料从辅助坩埚连续供应到坩埚中，以保持坩埚中的液体材料的表面水平恒定。 当液体材料固化成诸如单晶硅的带状薄腹板的固体材料时，液体材料以预定速度从坩埚中连续拉起。

公开(公告)号：US5705230A

公开(公告)日：1998-01-06

申请号：US324460

申请日：1994-10-17

申请人： Toru Matanabe ,  Hirokazu Ezawa ,  Masahiro Miyata ,  Yukio Ikeda ,  Manabu Tsujimura ,  Hiroaki Inoue ,  Takeyuki Odaira ,  Naoaki Ogure

发明人： Toru Matanabe ,  Hirokazu Ezawa ,  Masahiro Miyata ,  Yukio Ikeda ,  Manabu Tsujimura ,  Hiroaki Inoue ,  Takeyuki Odaira ,  Naoaki Ogure

IPC分类号： C23C18/34 ,  C23C18/16 ,  C23C26/00 ,  C25D5/18 ,  C25D5/20 ,  H01L21/48 ,  H01L21/768 ,  H05K3/42 ,  B05D1/18

CPC分类号： C23C18/1608 ,  C23C18/1612 ,  C23C18/1651 ,  C23C18/1666 ,  C23C18/1831 ,  H01L21/486 ,  H01L21/76877 ,  H05K3/422

摘要： The improved method comprises contacting a substrate 5 at least once by a liquid containing the elements that compose a pure metal or an alloy with which the small holes or recesses 3a in the substrate 5 are to be filled or covered, whereby the liquid wets the inner surfaces of said small holes or recesses 3a while, at the same time, said pure metal or said alloy is deposited on the surface of said substrate 5. The method is capable of filling small holes or covering small recesses in the surface of the substrate 5 with improved efficiency while, at the same time, it improves the heat resistance and materials stability of the part that contains the formed filling or covering layer.

摘要翻译： 改进的方法包括使基底5至少一次由含有构成纯金属的元素的液体或与基底5中的小孔或凹槽3a填充或覆盖的合金相接触，由此液体润湿内部 所述小孔或凹部3a的表面，同时所述纯金属或所述合金沉积在所述基板5的表面上。该方法能够填充小孔或覆盖基板5的表面中的小凹槽 同时提高了包含形成的填充或覆盖层的部件的耐热性和材料稳定性。

公开(公告)号：US5656542A

公开(公告)日：1997-08-12

申请号：US544453

申请日：1995-10-18

申请人： Masahiro Miyata ,  Hirokazu Ezawa ,  Naoaki Ogure ,  Manabu Tsujimura ,  Takeyuki Ohdaira ,  Hiroaki Inoue ,  Yukio Ikeda

发明人： Masahiro Miyata ,  Hirokazu Ezawa ,  Naoaki Ogure ,  Manabu Tsujimura ,  Takeyuki Ohdaira ,  Hiroaki Inoue ,  Yukio Ikeda

IPC分类号： H01L21/768 ,  H01L23/532 ,  H01L21/26

CPC分类号： H01L21/76873 ,  H01L21/76843 ,  H01L21/76858 ,  H01L21/76877 ,  H01L23/53242 ,  H01L23/53247 ,  H01L2924/0002

摘要： In a semiconductor device and a method for manufacturing the same according to the present invention, for example, an insulating film is deposited on a silicon substrate, and a concave groove is formed in the insulating film in accordance with a predetermined wiring pattern. Titanium and palladium are deposited in sequence on the insulating film to form a titanium film and a palladium film, respectively. A silver film is formed on the palladium film by electroplating, and a groove-shaped silver wiring layer is formed by polishing. The resultant structure is annealed at a temperature of about 700.degree. C., and an intermetallic compound is formed by alloying the titanium film and palladium film with each other. Consequently, a burying type wiring layer whose resistance is lower than that of aluminum, is constituted by the silver wiring layer and intermetallic compound.

摘要翻译： 在根据本发明的半导体器件及其制造方法中，例如，在硅衬底上沉积绝缘膜，并且根据预定的布线图案在绝缘膜中形成凹槽。 钛和钯依次沉积在绝缘膜上以分别形成钛膜和钯膜。 通过电镀在钯膜上形成银膜，通过研磨形成槽状的银布线层。 所得结构在约700℃的温度下退火，并通过使钛膜和钯膜彼此合金化形成金属间化合物。 因此，电阻低于铝的掩埋型布线层由银布线层和金属间化合物构成。

公开(公告)号：US20060118598A1

公开(公告)日：2006-06-08

申请号：US11291838

申请日：2005-12-02

申请人： Yusuke Chikamori ,  Naoaki Ogure ,  Hideki Tateishi ,  Yukio Fukunaga ,  Hiroyuki Ueyama

发明人： Yusuke Chikamori ,  Naoaki Ogure ,  Hideki Tateishi ,  Yukio Fukunaga ,  Hiroyuki Ueyama

IPC分类号： B23K1/00 ,  B23K5/00 ,  B23K20/14

CPC分类号： B23K20/023 ,  B23K2101/40

摘要： A bonding apparatus can bond contacts of electronic components directly to each other without the need for solder. The bonding apparatus include a hermetically sealed processing chamber, a plurality of bases for holding at least two workpieces having respective bonding regions in the processing chamber, a gas inlet for introducing a processing gas to clean the bonding regions into the processing chamber, a pressure controller for controlling a predetermined pressure to be developed in the processing chamber, a heater for heating the workpieces in the processing chamber, and a bonding unit for pressing and bonding the bonding regions of the workpieces to each other in the processing chamber.

摘要翻译： 接合装置可以将电子部件的触点彼此直接接合而不需要焊料。 接合装置包括密封处理室，用于在处理室中保持具有各自的接合区域的至少两个工件的多个基座，用于引入处理气体以将接合区域引入处理室的气体入口，压力控制器 用于控制处理室中要显影的预定压力，用于加热处理室中的工件的加热器，以及用于在处理室中将工件的接合区域彼此压合并粘合的接合单元。

公开(公告)号：US06921722B2

公开(公告)日：2005-07-26

申请号：US09866843

申请日：2001-05-30

申请人： Naoaki Ogure ,  Kuniaki Horie ,  Yuji Araki ,  Hiroshi Nagasaka ,  Momoko Kakutani ,  Tohru Satake

发明人： Naoaki Ogure ,  Kuniaki Horie ,  Yuji Araki ,  Hiroshi Nagasaka ,  Momoko Kakutani ,  Tohru Satake

IPC分类号： C23C16/18 ,  C23C16/452 ,  C23C16/48 ,  H01J37/32 ,  H01L21/285 ,  H01L21/3213 ,  H01L21/302

CPC分类号： H01J37/32422 ,  C23C16/18 ,  C23C16/452 ,  C23C16/486 ,  C23C16/487 ,  H01J37/3233 ,  H01L21/28556 ,  H01L21/32136

摘要： There is provided a method of performing a surface treatment, such as coating, denaturation, modification and etching, on a surface of a substrate. The method comprises the steps of bringing a surface treatment gas into contact with a surface of a substrate, and irradiating the surface of the substrate with a fast particle beam to enhance an activity of the surface and/or the surface treatment gas, thereby facilitating a reaction between the surface and the gas. The fast particle beam may be selected from a group consisting of an electron beam, a charged particle beam, an atomic beam and molecular beam. For example, during a coating operation, chemical deposition of predetermined component elements of the gas onto the surface is effected and a predetermined portion of the surface of the substrate is irradiated with a particle beam to form a coating layer on the predetermined portion.

摘要翻译： 提供了在基板的表面上进行表面处理如涂层，变性，改性和蚀刻的方法。 该方法包括以下步骤：使表面处理气体与基板的表面接触，并用快速粒子束照射基板的表面，以增强表面和/或表面处理气体的活性，由此有助于 表面和气体之间的反应。 快速粒子束可以选自电子束，带电粒子束，原子束和分子束。 例如，在涂布操作期间，将气体的预定组分元素化学沉积到表面上，并且用颗粒束照射基板的表面的预定部分，以在预定部分上形成涂层。

公开(公告)号：US06455475B1

公开(公告)日：2002-09-24

申请号：US09709732

申请日：2000-11-13

申请人： Naoaki Ogure

发明人： Naoaki Ogure

IPC分类号： F16C3306

CPC分类号： F16C33/14 ,  F16C33/06 ,  F16C33/12 ,  F16C2223/30 ,  Y10T428/12896

摘要： The present invention is to provide a sliding member and a process for producing the same, which produce a high-quality soft metal layer uniformly coated on a sliding surface by a process alternative to electroplating or ion plating. The metal layer has been formed by ultra-fine metal (silver) particles dissolved in a solvent, which is coated on a sliding surface of the sliding member and dried and fired such that ultra-fine metal particles are melt and bonded to one another. The average particle diameter of the ultra-fine metal (silver) particles is 1 to 20 nm, and in particular 1 to 10 nm. The whole metal coating process can be carried out in the air at room temperature to about 200-300° C.

摘要翻译： 本发明提供一种滑动构件及其制造方法，其通过替代电镀或离子电镀的方法制造均匀地涂覆在滑动表面上的高质量软金属层。 金属层由溶解在溶剂中的超细金属（银）颗粒形成，其被涂覆在滑动构件的滑动表面上并干燥并烧结，使得超细金属颗粒彼此熔融结合。 超细金属（银）粒子的平均粒径为1〜20nm，特别优选为1〜10nm。 整个金属涂层工艺可以在室温至约200-300℃的空气中进行。

公开(公告)号：US06432257B1

公开(公告)日：2002-08-13

申请号：US09018909

申请日：1998-02-05

申请人： Hiroshi Nagasaka ,  Momoko Kakutani ,  Kunio Tateishi ,  Naoaki Ogure ,  Takashi Yoda

发明人： Hiroshi Nagasaka ,  Momoko Kakutani ,  Kunio Tateishi ,  Naoaki Ogure ,  Takashi Yoda

IPC分类号： B24B500

CPC分类号： B24B53/017 ,  B24B37/04 ,  B24B53/12 ,  B24D18/00

摘要： A improved dresser for dressing a polishing surface, easily be manufactured such that an object to be polished is not scratched when the object is polished. The dresser can dress the polishing surface of a polishing apparatus to effect surface correction and to correct a time-lapse change due to a polishing operation, a number of spired projections are formed on a surface of a metallic substrate and a wear-resistant hard film is formed on at least a portion of the surface of the metallic substrate on which the projections are formed.

摘要翻译： 可以容易地制造用于修整抛光表面的改进的修整器，使得抛光对象在被抛光时不被划伤。 梳妆台可以打磨抛光装置的抛光表面以进行表面校正并且校正由于抛光操作引起的延时变化，在金属基底和耐磨硬膜的表面上形成多个喷射突起 形成在其上形成有突起的金属基板的表面的至少一部分上。

公开(公告)号：US07033463B1

公开(公告)日：2006-04-25

申请号：US09762582

申请日：1999-08-11

申请人： Akihisa Hongo ,  Naoaki Ogure ,  Hiroaki Inoue ,  Satoshi Sendai ,  Tetsuma Ikegami ,  Koji Mishima ,  Shuichi Okuyama ,  Mizuki Nagai ,  Ryoichi Kimizuka ,  Megumi Maruyama

发明人： Akihisa Hongo ,  Naoaki Ogure ,  Hiroaki Inoue ,  Satoshi Sendai ,  Tetsuma Ikegami ,  Koji Mishima ,  Shuichi Okuyama ,  Mizuki Nagai ,  Ryoichi Kimizuka ,  Megumi Maruyama

IPC分类号： C25D17/00

CPC分类号： H01L21/76843 ,  C23C18/1632 ,  C23C18/1653 ,  C23C18/1682 ,  C23C18/38 ,  C25D3/38 ,  C25D7/123 ,  C25D17/001 ,  H01L21/2885 ,  H01L21/76873 ,  H01L21/76874 ,  H01L21/76877 ,  H01L2221/1089 ,  H05K3/107 ,  H05K3/241 ,  H05K3/423

摘要： A method and apparatus plate a substrate to form wiring by efficiently filling a fine recess formed in a semiconductor substrate with plating metal without a void or contamination. The plating of the substrate to fill a wiring recess formed in the semiconductor substrate with plating metal includes performing an electroless plating process of forming an initial layer on the substrate, and performing an electrolytic plating process of filling the wiring recess with the plating metal, while the initial layer serves as a feeding layer.

摘要翻译： 一种方法和装置，通过有效地填充形成在半导体衬底中的精细凹槽，镀覆金属而没有空隙或污染，从而形成衬底以形成布线。 用电镀金属填充形成在半导体衬底中的布线凹槽的衬底的电镀包括在衬底上进行形成初始层的无电镀处理，并且进行用电镀金属填充布线凹槽的电解电镀工艺，同时 初始层用作供料层。