Sensor device and a method of manufacturing the same
    1.
    发明授权
    Sensor device and a method of manufacturing the same 有权
    传感器装置及其制造方法

    公开(公告)号:US08794054B2

    公开(公告)日:2014-08-05

    申请号:US13262628

    申请日:2010-03-25

    CPC classification number: G01N33/5438 B81C1/00087 G01N33/48721

    Abstract: A sensor device for analyzing fluidic samples is provided. The sensor device includes a stacked sensing arrangement having at least three sensing layers and a multilayer structure. The multilayer structure has a hole formed therein which is adapted to let pass the fluidic sample and the stacked sensing arrangement is formed in the multilayer structure in such a way that the fluidic sample passes the stacked sensing arrangement when the fluidic sample passes the hole.

    Abstract translation: 提供了一种用于分析流体样品的传感器装置。 传感器装置包括具有至少三个感测层和多层结构的层叠感测装置。 多层结构具有形成在其中的孔,其适于使流体样品通过,并且层叠的感测装置形成在多层结构中,使得当流体样品通过孔时流体样品通过堆叠的感测装置。

    Semiconductor storage device and manufacturing method
    4.
    发明授权
    Semiconductor storage device and manufacturing method 有权
    半导体存储装置及其制造方法

    公开(公告)号:US08334559B2

    公开(公告)日:2012-12-18

    申请号:US12780612

    申请日:2010-05-14

    CPC classification number: H01L29/42324 H01L29/7881

    Abstract: A semiconductor storage device includes a semiconductor substrate having a first region of a first conductivity type in between respective regions of an opposite conductivity type, at least the first region being covered by a first dielectric layer, a polysilicon floating gate placed on the first dielectric layer over the first region, said floating gate being surrounded by an insulating material; and a metal control gate structure adjacent to the polysilicon floating gate, the metal control gate structure being capacitively coupled to said floating gate. A method of manufacturing such a semiconductor storage device is also disclosed.

    Abstract translation: 一种半导体存储装置,包括具有第一导电类型的第一区域的相应导电类型的相应区域之间的至少第一区域被第一介电层覆盖的半导体衬底,放置在第一介电层上的多晶硅浮置栅极 在第一区域上,所述浮栅被绝缘材料包围; 以及与所述多晶硅浮置栅极相邻的金属控制栅极结构,所述金属控制栅极结构电容耦合到所述浮置栅极。 还公开了制造这种半导体存储装置的方法。

    Schottky diode and method of manufacture
    5.
    发明授权
    Schottky diode and method of manufacture 有权
    肖特基二极管及其制造方法

    公开(公告)号:US08709885B2

    公开(公告)日:2014-04-29

    申请号:US13500405

    申请日:2010-11-17

    Abstract: A method of manufacturing Schottky diodes in a CMOS process includes forming wells, including first wells (16) for forming CMOS devices and second wells (18) for forming Schottky devices. Then, transistors are formed in the first wells, the second wells protected with a protection layer (20) and suicide contacts (40) formed to source and drain regions in the first wells. The protection layer is then removed, a Schottky material deposited and etched away except in a contact region in each second well to form a Schottky contact between the Schottky material (74) and each second well (18).

    Abstract translation: 在CMOS工艺中制造肖特基二极管的方法包括形成阱,包括用于形成CMOS器件的第一阱(16)和用于形成肖特基器件的第二阱(18)。 然后,晶体管形成在第一阱中,第二阱由保护层(20)和形成于第一阱中的源极和漏极区域的硅化物接触(40)保护。 然后去除保护层,除了在每个第二阱中的接触区域中沉积并蚀刻掉肖特基材料,以在肖特基材料(74)和每个第二阱(18)之间形成肖特基接触。

    Memory cell, a memory array and a method of programming a memory cell
    7.
    发明授权
    Memory cell, a memory array and a method of programming a memory cell 有权
    存储单元,存储器阵列和编程存储器单元的方法

    公开(公告)号:US08320192B2

    公开(公告)日:2012-11-27

    申请号:US12594595

    申请日:2008-04-01

    CPC classification number: G11C16/0466 G11C16/0433

    Abstract: A method of programming a memory cell (100), the method comprising applying a first electric potential to a first electric terminal (101) of the memory cell (100) to accelerate first charge carriers of a first type of conductivity to thereby generate second charge carriers of a second type of conductivity by impact ionisation of the accelerated first charge carriers, and applying a second electric potential to a second electric terminal (102) of the memory cell (100) to accelerate the second charge carriers to thereby inject the second charge carriers in a charge trapping structure (103) of the memory cell (100).

    Abstract translation: 一种对存储单元(100)进行编程的方法,所述方法包括:向所述存储单元(100)的第一电端(101)施加第一电位,以加速第一导电类型的第一电荷载流子,从而产生第二电荷 通过加速的第一电荷载流子的冲击电离使第二类型的导电性的载流子,以及向存储单元(100)的第二电端子(102)施加第二电位,以加速第二电荷载流子,从而注入第二电荷 存储单元(100)的电荷俘获结构(103)中的载流子。

    NON-VOLATILE MEMORY DEVICE
    10.
    发明申请
    NON-VOLATILE MEMORY DEVICE 有权
    非易失性存储器件

    公开(公告)号:US20090242964A1

    公开(公告)日:2009-10-01

    申请号:US12298267

    申请日:2007-04-19

    Abstract: A finFET-based non-volatile memory device on a semiconductor substrate includes source and drain regions, a fin body, a charge trapping stack and a gate. The fin body extends between the source and the drain region as a connection. The charge trapping stack covers a portion of the fin body and the gate covers the charge trapping stack at the location of the fin body. The fin body has a corner-free shape for at least ¾ of the circumference of the fin body which lacks distinct crystal faces and transition zones in between the crystal faces.

    Abstract translation: 半导体衬底上的基于finFET的非易失性存储器件包括源区和漏区,翅片体,电荷俘获堆和栅极。 翅片体作为连接在源极和漏极区域之间延伸。 电荷捕获堆叠覆盖翅片体的一部分,并且栅极在翅片体的位置处覆盖电荷捕获堆叠。 翅片体具有无角形的形状,用于在翅片体的周边的至少3/4处,其在晶面之间缺少明显的晶面和过渡区。

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