公开(公告)号：US09412709B2

公开(公告)日：2016-08-09

申请号：US13898949

申请日：2013-05-21

Applicant: Sheila F. Chopin ,  Min Ding ,  Varughese Mathew ,  Scott S. Roth

Inventor： Sheila F. Chopin ,  Min Ding ,  Varughese Mathew ,  Scott S. Roth

IPC: H01L21/56 ,  H01L21/44 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L24/02 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/02166 ,  H01L2224/0218 ,  H01L2224/0219 ,  H01L2224/03005 ,  H01L2224/03009 ,  H01L2224/03015 ,  H01L2224/03019 ,  H01L2224/034 ,  H01L2224/03622 ,  H01L2224/0391 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05 ,  H01L2224/05565 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/32145 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48507 ,  H01L2224/48824 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/365 ,  H01L2924/3651 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A packaged semiconductor device is made by forming a conductive pad on an external surface of an integrated circuit device, forming a passivation layer over the conductive pad, removing a portion of the passivation layer over a bond area on the conductive pad, forming a sacrificial anode around a majority of a periphery surrounding the bond area, forming a conductive bond in the bond area, and forming an encapsulating material around the conductive bond and an exposed portion of the sacrificial anode.

Abstract translation: 通过在集成电路器件的外表面上形成导电焊盘来形成封装的半导体器件，在导电焊盘上方形成钝化层，在导电焊盘上的接合区域上去除钝化层的一部分，形成牺牲阳极 在围绕结合区域的周边的大部分周围，在接合区域中形成导电结合，以及在导电接合周围形成封装材料和牺牲阳极的暴露部分。

公开(公告)号：US20150084168A1

公开(公告)日：2015-03-26

申请号：US14035999

申请日：2013-09-25

Applicant: MIN DING ,  Tim V. Pham

Inventor： MIN DING ,  Tim V. Pham

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495

CPC classification number: H01L23/3107 ,  H01L23/3121 ,  H01L23/49555 ,  H01L23/562 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1815 ,  H01L2924/00012

Abstract: A microelectronic device package including a package substrate, microelectronic component disposed on a first surface of a first portion of the substrate, and encapsulant material surrounding the microelectronic electronic component. An exposed surface of the first portion of the substrate is exposed through an opening in a first major surface of the encapsulant material. The exposed surface of the first portion has an edge. Encapsulant material is adjacent to the edge at the first major surface. The exposed surface is opposite the first surface. A stress relief feature located in one of the first major surface or a second major surface of the encapsulant material. The second major surface is opposite the first major surface. The stress relief feature reduces an amount of the encapsulant material and is 1 mm or less of a plane of the edge of the exposed surface. The plane is generally perpendicular to the exposed surface.

Abstract translation: 一种微电子器件封装，包括封装衬底，设置在衬底的第一部分的第一表面上的微电子部件和围绕微电子电子部件的密封材料。 衬底的第一部分的暴露表面通过密封剂材料的第一主表面中的开口露出。 第一部分的暴露表面具有边缘。 密封材料与第一主表面的边缘相邻。 暴露的表面与第一表面相对。 应力消除特征位于密封剂材料的第一主表面或第二主表面之一中。 第二主表面与第一主表面相对。 应力释放特征减少了密封剂材料的量，并且是暴露表面的边缘的平面的1mm或更小。 平面大致垂直于暴露的表面。

公开(公告)号：US20140346663A1

公开(公告)日：2014-11-27

申请号：US13898949

申请日：2013-05-21

Applicant: Sheila F. Chopin ,  Min Ding ,  Varughese Mathew ,  Scott S. Roth

Inventor： Sheila F. Chopin ,  Min Ding ,  Varughese Mathew ,  Scott S. Roth

IPC: H01L23/00

CPC classification number: H01L24/02 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/02166 ,  H01L2224/0218 ,  H01L2224/0219 ,  H01L2224/03005 ,  H01L2224/03009 ,  H01L2224/03015 ,  H01L2224/03019 ,  H01L2224/034 ,  H01L2224/03622 ,  H01L2224/0391 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05 ,  H01L2224/05565 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/32145 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48507 ,  H01L2224/48824 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/365 ,  H01L2924/3651 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A packaged semiconductor device is made by forming a conductive pad on an external surface of an integrated circuit device, forming a passivation layer over the conductive pad, removing a portion of the passivation layer over a bond area on the conductive pad, forming a sacrificial anode around a majority of a periphery surrounding the bond area, forming a conductive bond in the bond area, and forming an encapsulating material around the conductive bond and an exposed portion of the sacrificial anode.

Abstract translation: 通过在集成电路器件的外表面上形成导电焊盘来形成封装的半导体器件，在导电焊盘上方形成钝化层，在导电焊盘上的接合区域上去除钝化层的一部分，形成牺牲阳极 在围绕结合区域的周边的大部分周围，在接合区域中形成导电结合，以及在导电接合周围形成封装材料和牺牲阳极的暴露部分。

公开(公告)号：US08354548B2

公开(公告)日：2013-01-15

申请号：US13025674

申请日：2011-02-11

Applicant: Shuanghua Hu ,  Yazhong Huang ,  Min Ding ,  Louis S. Chupak ,  Xiaofan Zheng ,  Robert G. Gentles

Inventor： Shuanghua Hu ,  Yazhong Huang ,  Min Ding ,  Louis S. Chupak ,  Xiaofan Zheng ,  Robert G. Gentles

IPC: C07D311/00

CPC classification number: C07D311/70 ,  C07D405/12

Abstract: The present disclosure is generally directed to compounds that can inhibit DAGLα and/or β activity, compositions comprising such compounds, and methods for inhibiting DAGLα and/or β activity.

公开(公告)号：US20120191843A1

公开(公告)日：2012-07-26

申请号：US13284350

申请日：2011-10-28

Applicant: Min Ding ,  Vishal Singh ,  Yueping Zhang ,  Guofei Jiang

Inventor： Min Ding ,  Vishal Singh ,  Yueping Zhang ,  Guofei Jiang

IPC: G06F15/16

CPC classification number: G06F11/3089 ,  G06F11/3006 ,  G06F11/3051 ,  H04L41/12 ,  H04L41/142 ,  H04L43/0876

Abstract: Systems and methods for discovering a set of applications that run on a network are disclosed. In accordance with one method, aggregate traffic volumes are determined for pairs of nodes on the network over a plurality of time intervals. The method further includes building a traffic matrix denoting each of the pairs of nodes and denoting respective aggregate traffic volume histories of each of the pairs of nodes that are based on the determined traffic volumes. In addition, the traffic matrix is formulated as a combination of bases vectors that model the set of applications. The bases vectors are determined by applying a covariance matrix adaptation evolutionary strategy based on the traffic matrix. An indication of the set of applications based on the bases vectors is output.

Abstract translation: 公开了用于发现在网络上运行的一组应用的系统和方法。 根据一种方法，在多个时间间隔上为网络上的节点对确定聚合业务量。 该方法还包括构建表示每对节点的业务矩阵并且表示基于所确定的业务量的每对节点对应的聚合业务量历史。 另外，业务矩阵被形成为对应用集合建模的基本向量的组合。 通过应用基于业务矩阵的协方差矩阵适应进化策略来确定基本向量。 输出基于基本向量的应用集合的指示。

公开(公告)号：US20110311480A1

公开(公告)日：2011-12-22

申请号：US13222256

申请日：2011-08-31

Applicant: John A. Bender ,  Min Ding ,  Robert G. Gentles ,  Piyasena Hewawasam

Inventor： John A. Bender ,  Min Ding ,  Robert G. Gentles ,  Piyasena Hewawasam

IPC: A61K38/20 ,  A61P31/14 ,  A61K38/21 ,  A61K31/55 ,  A61K31/7056

CPC classification number: C07D487/08 ,  A61K31/55 ,  A61K45/06 ,  C07D471/08 ,  C07D487/04 ,  C07D519/00

Abstract: The invention encompasses compounds of formula I as well as compositions and methods of using the compounds. The compounds have activity against hepatitis C virus (HCV) and are useful in treating those infected with HCV.

Abstract translation: 本发明包括式I化合物以及使用该化合物的组合物和方法。 该化合物具有抗丙型肝炎病毒（HCV）的活性，可用于治疗HCV感染者。

公开(公告)号：US20110207772A1

公开(公告)日：2011-08-25

申请号：US13025674

申请日：2011-02-11

Applicant: Shuanghua Hu ,  Yazhong Huang ,  Min Ding ,  Louis S. Chupak ,  Xiaofan Zheng ,  Robert G. Gentles

Inventor： Shuanghua Hu ,  Yazhong Huang ,  Min Ding ,  Louis S. Chupak ,  Xiaofan Zheng ,  Robert G. Gentles

IPC: A61K31/4709 ,  C07D311/04 ,  A61K31/352 ,  C07D401/12 ,  A61P25/18 ,  A61P25/24 ,  A61P25/22 ,  A61P3/10 ,  A61P3/06

CPC classification number: C07D311/70 ,  C07D405/12

Abstract: The present disclosure is generally directed to compounds that can inhibit DAGLα and/or β activity, compositions comprising such compounds, and methods for inhibiting DAGLα and/or β activity.

Abstract translation: 本公开一般涉及可抑制DAGLα和/或bgr的化合物; 活性，包含这些化合物的组合物和抑制DAGLα和/或bgr的方法; 活动。

公开(公告)号：US07660026B2

公开(公告)日：2010-02-09

申请号：US11675090

申请日：2007-02-15

Applicant: Wei-Hsin Hou ,  Jau-Min Ding ,  Hsing-Lung Wang ,  Chi-Chang Liao ,  Yan-Rung Lin

Inventor： Wei-Hsin Hou ,  Jau-Min Ding ,  Hsing-Lung Wang ,  Chi-Chang Liao ,  Yan-Rung Lin

IPC: G02F1/03 ,  G02F1/33

CPC classification number: G02F1/133305 ,  G02F1/133377 ,  Y10T428/31504

Abstract: The invention is directed to a method for forming a flexible electro-optic film. The method comprises steps of providing a first substrate having a conductive layer formed thereon and then forming a first locating structure over the conductive layer, wherein the locating structure includes target regions and periphery regions. The surface tension of the target regions is difference from that of the periphery regions. Thereafter, an electro-optic medium placing process for forming an electro-optic droplet on each of the target regions is performed. A solidifying process for forming a capsule wall covering the electro-optic droplet on each of the target regions is performed. The first substrate is laminated with a second substrate.

Abstract translation: 本发明涉及一种形成柔性电光膜的方法。 该方法包括以下步骤：提供其上形成有导电层的第一基板，然后在导电层上形成第一定位结构，其中定位结构包括目标区域和外围区域。 目标区域的表面张力与外围区域的表面张力不同。 此后，进行用于在每个目标区域上形成电光液滴的电光介质放置过程。 执行用于形成覆盖每个目标区域上的电光液滴的胶囊壁的固化方法。 第一衬底与第二衬底层压。

公开(公告)号：US07601686B2

公开(公告)日：2009-10-13

申请号：US11481536

申请日：2006-07-06

Applicant: Piyasena Hewawasam ,  Min Ding ,  Li-Qiang Sun ,  Paul Michael Scola

Inventor： Piyasena Hewawasam ,  Min Ding ,  Li-Qiang Sun ,  Paul Michael Scola

IPC: A61K38/00

CPC classification number: C07K5/0808 ,  A61K38/00

Abstract: The present disclosure relates to tripeptide compounds, compositions and methods for the treatment of hepatitis C virus (HCV) infection. Also disclosed are pharmaceutical compositions containing such compounds and methods for using these compounds in the treatment of HCV infection.

Abstract translation: 本公开涉及用于治疗丙型肝炎病毒（HCV）感染的三肽化合物，组合物和方法。 还公开了含有这些化合物的药物组合物和使用这些化合物治疗HCV感染的方法。

公开(公告)号：US07538102B2

公开(公告)日：2009-05-26

申请号：US12046030

申请日：2008-03-11

Applicant: Kap-Sun Yeung ,  John A. Bender ,  Robert G. Gentles ,  Zhong Yang ,  Min Ding ,  Yong Tu ,  Piyasena Hewawasam ,  Ying Han ,  John F. Kadow

Inventor： Kap-Sun Yeung ,  John A. Bender ,  Robert G. Gentles ,  Zhong Yang ,  Min Ding ,  Yong Tu ,  Piyasena Hewawasam ,  Ying Han ,  John F. Kadow

IPC: A61P31/00 ,  A61K31/55 ,  C07D223/14

CPC classification number: C07D487/04 ,  C07D519/00

Abstract: The invention encompasses compounds of Formula I, pharmaceutically acceptable salts thereof, compositions, and methods of using the compounds. The compounds have activity against hepatitis C virus (HCV) and are useful in treating those infected with HCV.

Abstract translation: 本发明包括式I的化合物，其药学上可接受的盐，组合物和使用该化合物的方法。 该化合物具有抗丙型肝炎病毒（HCV）的活性，可用于治疗HCV感染者。