公开(公告)号：US07453509B2

公开(公告)日：2008-11-18

申请号：US10650815

申请日：2003-08-28

申请人： Reinhard Losehand ,  Stefan Paulus ,  Martin Petz ,  Josef-Paul Schaffer ,  Martin Schroeder ,  Bernd Stadler

发明人： Reinhard Losehand ,  Stefan Paulus ,  Martin Petz ,  Josef-Paul Schaffer ,  Martin Schroeder ,  Bernd Stadler

IPC分类号： H04N5/225

CPC分类号： H04N5/2257 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14683 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H04N5/2254 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： A digital camera has a lens, a camera housing, and a semiconductor sensor. The camera housing is primarily formed of a transparent plastic block that encloses a semiconductor sensor only on its underside and has an adapted lens on its top side. Between the two there is provided an opaque layer with an aperture that improves the image quality. The invention also relates to a method for producing such a digital camera.

摘要翻译： 数码相机具有镜头，相机外壳和半导体传感器。 相机外壳主要由仅在其下侧包围半导体传感器的透明塑料块形成，并且在其顶侧具有适配的透镜。 在两者之间提供了具有提高图像质量的孔的不透明层。 本发明还涉及一种用于生产这种数字照相机的方法。

公开(公告)号：US08362579B2

公开(公告)日：2013-01-29

申请号：US12469512

申请日：2009-05-20

申请人： Horst Theuss ,  Klaus Elian ,  Martin Petz

发明人： Horst Theuss ,  Klaus Elian ,  Martin Petz

IPC分类号： H01L29/82

CPC分类号： H01L43/02 ,  B82Y25/00 ,  G01R33/093 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A semiconductor device includes a housing defining a cavity, a magnetic sensor chip disposed in the cavity, and mold material covering the magnetic sensor chip and substantially filling the cavity. One of the housing or the mold material is ferromagnetic, and the other one of the housing or the mold material is non-ferromagnetic.

摘要翻译： 半导体器件包括限定空腔的壳体，设置在空腔中的磁传感器芯片，以及覆盖磁传感器芯片并基本上填充空腔的模具材料。 壳体或模具材料之一是铁磁性的，壳体或模具材料中的另一个是非铁磁性的。

公开(公告)号：US07462919B2

公开(公告)日：2008-12-09

申请号：US10558114

申请日：2004-05-24

申请人： Thomas Engling ,  Martin Petz

发明人： Thomas Engling ,  Martin Petz

IPC分类号： H01L29/84

CPC分类号： B81B7/0058 ,  B81B2201/0264 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： A microelectromechanical component and to a method for the production thereof is disclosed. In one embodiment, the microelectromechanical component has a pressure-sensitive semiconductor chip, which is covered in its pressure-sensitive region by a rubber-elastic layer and is arranged in a cavity housing and covered by a rubber-elastic covering. This rubber-elastic covering has a greater thickness than the rubber-elastic layer on the pressure-sensitive region.

摘要翻译： 公开了一种微机电部件及其制造方法。 在一个实施例中，微电子机械部件具有压敏半导体芯片，该压敏半导体芯片通过橡胶弹性层在其压敏区域被覆盖，并且被布置在腔室中并由橡胶弹性覆盖物覆盖。 该橡胶弹性覆盖物的厚度比压敏区域上的橡胶弹性层厚。

公开(公告)号：US06271584B1

公开(公告)日：2001-08-07

申请号：US08913724

申请日：1997-08-27

申请人： Stefan Schmausser ,  Otto Gruber ,  Siegfried Fischer ,  Walter Juri ,  Bernd Barchmann ,  Jürgen Winterer ,  Martin Petz ,  Jürgen Steinbichler ,  Xaver Schlögel ,  Otto Voggenreiter

发明人： Stefan Schmausser ,  Otto Gruber ,  Siegfried Fischer ,  Walter Juri ,  Bernd Barchmann ,  Jürgen Winterer ,  Martin Petz ,  Jürgen Steinbichler ,  Xaver Schlögel ,  Otto Voggenreiter

IPC分类号： H01L23495

CPC分类号： H01L21/565 ,  H01L23/49541 ,  H01L2924/0002 ,  H01L2924/00

摘要： A bearer strip having components arranged in several parallel rows with variable spacing between the rows so as to increase packing density while providing sufficient empty space for introducing free flowing plastic on the bearer strip.

摘要翻译： 一种载体条，其具有以几行平行排布置，排之间具有可变的间隔，以便增加包装密度，同时提供足够的空闲空间用于将自由流动的塑料引入承载条上。

公开(公告)号：US07622802B2

公开(公告)日：2009-11-24

申请号：US11196500

申请日：2005-08-04

申请人： Stefan Paulus ,  Martin Petz

发明人： Stefan Paulus ,  Martin Petz

IPC分类号： H01L23/10 ,  H01L23/34

CPC分类号： H01L23/49861 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48137 ,  H01L2224/48472 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/3025 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

摘要： An electronic device, including a radiofrequency power module, includes a cavity housing including a housing frame with plastic walls and with a metal frame including a top side and a rear side, a metallic housing bottom including at least one chip island, and at least one semiconductor chip. Each semiconductor chip is arranged on each chip island and includes a top side and a rear side. The plastic walls of the cavity housing are connected to the metal frame in a positively locking manner with anchoring elements, and the housing bottom is connected to the rear side of the metal frame in a thermostable manner with a solder joint.

摘要翻译： 一种包括射频功率模块的电子设备包括：腔室壳体，其包括具有塑料壁的壳体框架和包括顶侧和后侧的金属框架，金属壳体底部包括至少一个芯片岛，以及至少一个 半导体芯片 每个半导体芯片布置在每个芯片岛上并且包括顶侧和后侧。 空腔壳体的塑料壁以固定的方式与金属框架连接，并且壳体底部以耐热方式与焊接接头连接到金属框架的后侧。

公开(公告)号：US20070090473A1

公开(公告)日：2007-04-26

申请号：US10558114

申请日：2004-05-24

申请人： Thomas Engling ,  Martin Petz

发明人： Thomas Engling ,  Martin Petz

IPC分类号： H01L29/82 ,  H01L27/14 ,  H01L29/84 ,  H01L21/00

CPC分类号： B81B7/0058 ,  B81B2201/0264 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： A microelectromechanical component and to a method for the production thereof is disclosed. In one embodiment, the microelectromechanical component has a pressure-sensitive semiconductor chip, which is covered in its pressure-sensitive region by a rubber-elastic layer and is arranged in a cavity housing and covered by a rubber-elastic covering. This rubber-elastic covering has a greater thickness than the rubber-elastic layer on the pressure-sensitive region.

摘要翻译： 公开了一种微机电部件及其制造方法。 在一个实施例中，微电子机械部件具有压敏半导体芯片，该压敏半导体芯片通过橡胶弹性层在其压敏区域被覆盖，并且被布置在腔室中并由橡胶弹性覆盖物覆盖。 该橡胶弹性覆盖物的厚度比压敏区域上的橡胶弹性层厚。

公开(公告)号：US10107875B2

公开(公告)日：2018-10-23

申请号：US12627848

申请日：2009-11-30

申请人： Klaus Elian ,  Martin Petz ,  Uwe Schindler ,  Horst Theuss ,  Adolf Koller

发明人： Klaus Elian ,  Martin Petz ,  Uwe Schindler ,  Horst Theuss ,  Adolf Koller

IPC分类号： G01R33/09 ,  B82Y25/00 ,  G01D5/244 ,  G01P1/02 ,  G01P3/488 ,  H01L43/02

摘要： An integrated circuit includes a leadframe, and a die having a top surface, a bottom surface, and a plurality of perimeter sides and including at least one magnetic field sensor element disposed proximate to the top surface, wherein the bottom surface is bonded to the leadframe. A molded magnetic material encapsulates the die and at least a portion of the leadframe, and provides a magnetic field substantially perpendicular to the top surface of the die. A non-magnetic material is disposed between the die and the molded magnetic material at least along perimeter sides of the die intersecting a lateral magnetic field component which is parallel to the top surface of the die.

公开(公告)号：US07868430B2

公开(公告)日：2011-01-11

申请号：US12238468

申请日：2008-09-26

申请人： Stefan Paulus ,  Manfred Fries ,  Martin Petz ,  Thomas Mueller

发明人： Stefan Paulus ,  Manfred Fries ,  Martin Petz ,  Thomas Mueller

IPC分类号： H01L29/72

CPC分类号： H01L23/49861 ,  H01L23/24 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： This application relates to a semiconductor device comprising multiple separate leads molded in a molded structure, and a chip attached to the molded structure over at least two of the multiple separate leads.

摘要翻译： 本申请涉及包括模制在模制结构中的多个分离引线的半导体器件，以及在多个分离引线中的至少两个上连接到模制结构的芯片。

公开(公告)号：US20070145972A1

公开(公告)日：2007-06-28

申请号：US11453365

申请日：2006-06-15

申请人： Albert Auburger ,  Jochen Dangelmaier ,  Alfred Gottlieb ,  Martin Petz ,  Uwe Schindler ,  Horst Theuss

发明人： Albert Auburger ,  Jochen Dangelmaier ,  Alfred Gottlieb ,  Martin Petz ,  Uwe Schindler ,  Horst Theuss

IPC分类号： G01R33/02

CPC分类号： G01R33/06 ,  G01P3/488 ,  G01P15/105

摘要： A sensor component used to measure a magnetic field strength is disclosed. In one embodiment, the sensor component contains a plurality of leads and a sensor semiconductor chip, which measures the magnetic field strength. The sensor semiconductor chip has pads on its active upper side. These pads are connected electrically to the leads. The sensor component also contains a magnet, which is attached to the leads. The sensor semiconductor chip is arranged on an upper side of the magnet. The sensor component also has a first mold compound which shares a common boundary with the sensor semiconductor chip and surrounds the sensor semiconductor chip, the magnet and parts of the lead.

摘要翻译： 公开了用于测量磁场强度的传感器部件。 在一个实施例中，传感器部件包含测量磁场强度的多个引线和传感器半导体芯片。 传感器半导体芯片在其主动上侧具有焊盘。 这些焊盘与引线电连接。 传感器部件还包含一个附着在引线上的磁铁。 传感器半导体芯片布置在磁体的上侧。 传感器部件还具有与传感器半导体芯片共用公共边界并围绕传感器半导体芯片，磁体和引线部分的第一模具化合物。

公开(公告)号：US20060014326A1

公开(公告)日：2006-01-19

申请号：US11220341

申请日：2005-09-06

申请人： Albert Auburger ,  Hainz Oswald ,  Helga Hainz ,  Dietmar Lang ,  Rudolf Lehner ,  Stefan Paulus ,  Martin Petz ,  Michael Weber

发明人： Albert Auburger ,  Hainz Oswald ,  Helga Hainz ,  Dietmar Lang ,  Rudolf Lehner ,  Stefan Paulus ,  Martin Petz ,  Michael Weber

IPC分类号： H01L21/44

CPC分类号： H01L21/568 ,  H01L23/3107 ,  H01L23/482 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48475 ,  H01L2224/4848 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/854 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A semiconductor component has a housing with a first main area and a second main area opposite to the first main area, which surrounds at least one semiconductor chip. The semiconductor chip has a first metallization layer on a first main side. A second main side of the semiconductor chip borders the second main area of the semiconductor component. The first metallization layer of the semiconductor chip is connected via electrical conductors to contacts that are likewise surrounded by the housing and border the second main area. The semiconductor chip furthermore has, on the second main side, a second metallization layer for carrying signals.

摘要翻译： 半导体部件具有壳体，其具有第一主区域和与第一主区域相对的第二主区域，该第一主区域围绕至少一个半导体芯片。 半导体芯片在第一主侧具有第一金属化层。 半导体芯片的第二主面与半导体部件的第二主要区域相接。 半导体芯片的第一金属化层通过电导体连接到同样被壳体包围并与第二主区域相接触的触点。 半导体芯片在第二主侧还具有用于承载信号的第二金属化层。