公开(公告)号：US08362579B2

公开(公告)日：2013-01-29

申请号：US12469512

申请日：2009-05-20

申请人： Horst Theuss ,  Klaus Elian ,  Martin Petz

发明人： Horst Theuss ,  Klaus Elian ,  Martin Petz

IPC分类号： H01L29/82

CPC分类号： H01L43/02 ,  B82Y25/00 ,  G01R33/093 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A semiconductor device includes a housing defining a cavity, a magnetic sensor chip disposed in the cavity, and mold material covering the magnetic sensor chip and substantially filling the cavity. One of the housing or the mold material is ferromagnetic, and the other one of the housing or the mold material is non-ferromagnetic.

摘要翻译： 半导体器件包括限定空腔的壳体，设置在空腔中的磁传感器芯片，以及覆盖磁传感器芯片并基本上填充空腔的模具材料。 壳体或模具材料之一是铁磁性的，壳体或模具材料中的另一个是非铁磁性的。

公开(公告)号：US10107875B2

公开(公告)日：2018-10-23

申请号：US12627848

申请日：2009-11-30

申请人： Klaus Elian ,  Martin Petz ,  Uwe Schindler ,  Horst Theuss ,  Adolf Koller

发明人： Klaus Elian ,  Martin Petz ,  Uwe Schindler ,  Horst Theuss ,  Adolf Koller

IPC分类号： G01R33/09 ,  B82Y25/00 ,  G01D5/244 ,  G01P1/02 ,  G01P3/488 ,  H01L43/02

摘要： An integrated circuit includes a leadframe, and a die having a top surface, a bottom surface, and a plurality of perimeter sides and including at least one magnetic field sensor element disposed proximate to the top surface, wherein the bottom surface is bonded to the leadframe. A molded magnetic material encapsulates the die and at least a portion of the leadframe, and provides a magnetic field substantially perpendicular to the top surface of the die. A non-magnetic material is disposed between the die and the molded magnetic material at least along perimeter sides of the die intersecting a lateral magnetic field component which is parallel to the top surface of the die.

公开(公告)号：US20110127998A1

公开(公告)日：2011-06-02

申请号：US12627848

申请日：2009-11-30

申请人： Klaus Elian ,  Martin Petz ,  Uwe Schindler ,  Horst Theuss ,  Adolf Koller

发明人： Klaus Elian ,  Martin Petz ,  Uwe Schindler ,  Horst Theuss ,  Adolf Koller

IPC分类号： G01N27/72 ,  H01L43/00 ,  H01L43/12

CPC分类号： G01R33/093 ,  B82Y25/00 ,  G01D5/24438 ,  G01P1/026 ,  G01P3/488 ,  H01L43/02 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： An integrated circuit includes a leadframe, and a die having a top surface, a bottom surface, and a plurality of perimeter sides and including at least one magnetic field sensor element disposed proximate to the top surface, wherein the bottom surface is bonded to the leadframe. A molded magnetic material encapsulates the die and at least a portion of the leadframe, and provides a magnetic field substantially perpendicular to the top surface of the die. A non-magnetic material is disposed between the die and the molded magnetic material at least along perimeter sides of the die intersecting a lateral magnetic field component which is parallel to the top surface of the die.

摘要翻译： 集成电路包括引线框和具有顶表面，底表面和多个周边的管芯，并且包括靠近顶表面设置的至少一个磁场传感器元件，其中底表面接合到引线框架 。 模制的磁性材料封装模具和引线框架的至少一部分，并且提供基本上垂直于模具顶表面的磁场。 至少沿着与模具的顶面平行的横向磁场分量相交的模具的周边，至少沿模具和模制的磁性材料之间设置非磁性材料。

公开(公告)号：US20100295140A1

公开(公告)日：2010-11-25

申请号：US12469512

申请日：2009-05-20

申请人： Horst Theuss ,  Klaus Elian ,  Martin Petz

发明人： Horst Theuss ,  Klaus Elian ,  Martin Petz

IPC分类号： H01L43/06 ,  H01L21/70

CPC分类号： H01L43/02 ,  B82Y25/00 ,  G01R33/093 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A semiconductor device includes a housing defining a cavity, a magnetic sensor chip disposed in the cavity, and mold material covering the magnetic sensor chip and substantially filling the cavity. One of the housing or the mold material is ferromagnetic, and the other one of the housing or the mold material is non-ferromagnetic.

摘要翻译： 半导体器件包括限定空腔的壳体，设置在空腔中的磁传感器芯片，以及覆盖磁传感器芯片并基本上填充空腔的模具材料。 壳体或模具材料之一是铁磁性的，壳体或模具材料中的另一个是非铁磁性的。

公开(公告)号：US20070145972A1

公开(公告)日：2007-06-28

申请号：US11453365

申请日：2006-06-15

申请人： Albert Auburger ,  Jochen Dangelmaier ,  Alfred Gottlieb ,  Martin Petz ,  Uwe Schindler ,  Horst Theuss

发明人： Albert Auburger ,  Jochen Dangelmaier ,  Alfred Gottlieb ,  Martin Petz ,  Uwe Schindler ,  Horst Theuss

IPC分类号： G01R33/02

CPC分类号： G01R33/06 ,  G01P3/488 ,  G01P15/105

摘要： A sensor component used to measure a magnetic field strength is disclosed. In one embodiment, the sensor component contains a plurality of leads and a sensor semiconductor chip, which measures the magnetic field strength. The sensor semiconductor chip has pads on its active upper side. These pads are connected electrically to the leads. The sensor component also contains a magnet, which is attached to the leads. The sensor semiconductor chip is arranged on an upper side of the magnet. The sensor component also has a first mold compound which shares a common boundary with the sensor semiconductor chip and surrounds the sensor semiconductor chip, the magnet and parts of the lead.

摘要翻译： 公开了用于测量磁场强度的传感器部件。 在一个实施例中，传感器部件包含测量磁场强度的多个引线和传感器半导体芯片。 传感器半导体芯片在其主动上侧具有焊盘。 这些焊盘与引线电连接。 传感器部件还包含一个附着在引线上的磁铁。 传感器半导体芯片布置在磁体的上侧。 传感器部件还具有与传感器半导体芯片共用公共边界并围绕传感器半导体芯片，磁体和引线部分的第一模具化合物。

公开(公告)号：US07385394B2

公开(公告)日：2008-06-10

申请号：US11453365

申请日：2006-06-15

申请人： Albert Auburger ,  Jochen Dangelmaier ,  Alfred Gottlieb ,  Martin Petz ,  Uwe Schindler ,  Horst Theuss

发明人： Albert Auburger ,  Jochen Dangelmaier ,  Alfred Gottlieb ,  Martin Petz ,  Uwe Schindler ,  Horst Theuss

IPC分类号： G01R33/02 ,  H05K7/04 ,  G01B7/30

CPC分类号： G01R33/06 ,  G01P3/488 ,  G01P15/105

摘要： A sensor component used to measure a magnetic field strength is disclosed. In one embodiment, the sensor component contains a plurality of leads and a sensor semiconductor chip, which measures the magnetic field strength. The sensor semiconductor chip has pads on its active upper side. These pads are connected electrically to the leads. The sensor component also contains a magnet, which is attached to the leads. The sensor semiconductor chip is arranged on an upper side of the magnet. The sensor component also has a first mold compound which shares a common boundary with the sensor semiconductor chip and surrounds the sensor semiconductor chip, the magnet and parts of the lead.

摘要翻译： 公开了用于测量磁场强度的传感器部件。 在一个实施例中，传感器部件包含测量磁场强度的多个引线和传感器半导体芯片。 传感器半导体芯片在其主动上侧具有焊盘。 这些焊盘与引线电连接。 传感器部件还包含一个附着在引线上的磁铁。 传感器半导体芯片布置在磁体的上侧。 传感器部件还具有与传感器半导体芯片共用公共边界并围绕传感器半导体芯片，磁体和引线部分的第一模具化合物。

公开(公告)号：US07453509B2

公开(公告)日：2008-11-18

申请号：US10650815

申请日：2003-08-28

申请人： Reinhard Losehand ,  Stefan Paulus ,  Martin Petz ,  Josef-Paul Schaffer ,  Martin Schroeder ,  Bernd Stadler

发明人： Reinhard Losehand ,  Stefan Paulus ,  Martin Petz ,  Josef-Paul Schaffer ,  Martin Schroeder ,  Bernd Stadler

IPC分类号： H04N5/225

CPC分类号： H04N5/2257 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14683 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H04N5/2254 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： A digital camera has a lens, a camera housing, and a semiconductor sensor. The camera housing is primarily formed of a transparent plastic block that encloses a semiconductor sensor only on its underside and has an adapted lens on its top side. Between the two there is provided an opaque layer with an aperture that improves the image quality. The invention also relates to a method for producing such a digital camera.

摘要翻译： 数码相机具有镜头，相机外壳和半导体传感器。 相机外壳主要由仅在其下侧包围半导体传感器的透明塑料块形成，并且在其顶侧具有适配的透镜。 在两者之间提供了具有提高图像质量的孔的不透明层。 本发明还涉及一种用于生产这种数字照相机的方法。

公开(公告)号：US07622802B2

公开(公告)日：2009-11-24

申请号：US11196500

申请日：2005-08-04

申请人： Stefan Paulus ,  Martin Petz

发明人： Stefan Paulus ,  Martin Petz

IPC分类号： H01L23/10 ,  H01L23/34

CPC分类号： H01L23/49861 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48137 ,  H01L2224/48472 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/3025 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

摘要： An electronic device, including a radiofrequency power module, includes a cavity housing including a housing frame with plastic walls and with a metal frame including a top side and a rear side, a metallic housing bottom including at least one chip island, and at least one semiconductor chip. Each semiconductor chip is arranged on each chip island and includes a top side and a rear side. The plastic walls of the cavity housing are connected to the metal frame in a positively locking manner with anchoring elements, and the housing bottom is connected to the rear side of the metal frame in a thermostable manner with a solder joint.

摘要翻译： 一种包括射频功率模块的电子设备包括：腔室壳体，其包括具有塑料壁的壳体框架和包括顶侧和后侧的金属框架，金属壳体底部包括至少一个芯片岛，以及至少一个 半导体芯片 每个半导体芯片布置在每个芯片岛上并且包括顶侧和后侧。 空腔壳体的塑料壁以固定的方式与金属框架连接，并且壳体底部以耐热方式与焊接接头连接到金属框架的后侧。

公开(公告)号：US20070090473A1

公开(公告)日：2007-04-26

申请号：US10558114

申请日：2004-05-24

申请人： Thomas Engling ,  Martin Petz

发明人： Thomas Engling ,  Martin Petz

IPC分类号： H01L29/82 ,  H01L27/14 ,  H01L29/84 ,  H01L21/00

CPC分类号： B81B7/0058 ,  B81B2201/0264 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： A microelectromechanical component and to a method for the production thereof is disclosed. In one embodiment, the microelectromechanical component has a pressure-sensitive semiconductor chip, which is covered in its pressure-sensitive region by a rubber-elastic layer and is arranged in a cavity housing and covered by a rubber-elastic covering. This rubber-elastic covering has a greater thickness than the rubber-elastic layer on the pressure-sensitive region.

摘要翻译： 公开了一种微机电部件及其制造方法。 在一个实施例中，微电子机械部件具有压敏半导体芯片，该压敏半导体芯片通过橡胶弹性层在其压敏区域被覆盖，并且被布置在腔室中并由橡胶弹性覆盖物覆盖。 该橡胶弹性覆盖物的厚度比压敏区域上的橡胶弹性层厚。

公开(公告)号：US07462919B2

公开(公告)日：2008-12-09

申请号：US10558114

申请日：2004-05-24

申请人： Thomas Engling ,  Martin Petz

发明人： Thomas Engling ,  Martin Petz

IPC分类号： H01L29/84

CPC分类号： B81B7/0058 ,  B81B2201/0264 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： A microelectromechanical component and to a method for the production thereof is disclosed. In one embodiment, the microelectromechanical component has a pressure-sensitive semiconductor chip, which is covered in its pressure-sensitive region by a rubber-elastic layer and is arranged in a cavity housing and covered by a rubber-elastic covering. This rubber-elastic covering has a greater thickness than the rubber-elastic layer on the pressure-sensitive region.

摘要翻译： 公开了一种微机电部件及其制造方法。 在一个实施例中，微电子机械部件具有压敏半导体芯片，该压敏半导体芯片通过橡胶弹性层在其压敏区域被覆盖，并且被布置在腔室中并由橡胶弹性覆盖物覆盖。 该橡胶弹性覆盖物的厚度比压敏区域上的橡胶弹性层厚。